Top Design Engineer Jobs in Singapore

Leads power architecture and board-level power design for advanced networking platforms. Designs AC-DC and DC-DC conversion, regulators, hot-swap and protection circuits, sequencing, monitoring, and power distribution systems. Owns simulation, schematic development, bring-up, validation, compliance testing, characterization, and root-cause investigations. Establishes design standards, drives system-level trade-offs, collaborates across engineering and manufacturing teams, and mentors senior engineers.

Leads complex hardware designs for next-generation networking platforms across component selection, schematic capture, board architecture, bring-up, debugging, validation, and production readiness. Drives high-speed digital design decisions involving signal integrity, power distribution, performance, reliability, and system-level trade-offs. Collaborates with layout, validation, manufacturing, and firmware teams, performs root-cause analysis and empirical testing, establishes design best practices, and mentors junior engineers.

Lead end-to-end hardware architecture for high-performance networking platforms across multiple product generations. Define system and board-level architectures, make trade-offs across silicon, memory, interfaces, power, timing, thermal, firmware, and manufacturing, and guide feasibility, modeling, validation, reviews, and production. Establish reusable design standards, influence global engineering teams, resolve complex technical issues, and mentor senior engineers and future architects.

Develop, validate, and qualify NAND Flash memory products across pre-silicon and post-silicon stages. Responsibilities include Verilog simulations, Cadence and CAD tool use, circuit analysis, electrical failure analysis, device characterization, configuration validation, engineering sample support, and troubleshooting with cross-functional R&D, manufacturing, quality, and business teams. The role also incorporates AI-assisted engineering tools and continuous improvement initiatives.

Develop and improve manufacturing processes and designs for advanced scanning electron microscopy systems. Resolve complex system interaction and field issues, analyze data and models, define manufacturability requirements, create system test and troubleshooting processes, and lead cross-functional project plans. The role also supports beta testing at customer sites and requires deep technical expertise in systems engineering, electron optics, vacuum systems, and high voltage.

Design and manufacturing engineer supporting advanced eBeam SEM instruments. Responsibilities include diagnosing system issues, analyzing data, building optimization models, developing manufacturing processes, improving designs for manufacturability, creating troubleshooting procedures, leading cross-disciplinary projects, and providing field and supplier escalation support with up to 25% travel.

Designs digital circuit blocks and SoC infrastructure, including RTL implementation, IP integration, bus and memory interfaces, clocking, power and reset management. Verifies blocks and mixed-signal/RF integrations using directed, random, assertion-based, modeling, and cosimulation methods. Develops embedded firmware for SoC validation and contributes to architecture, design, verification reviews, technical specifications, reference manuals, and datasheets.

Design and implement digital and mixed-signal ICs at the chip and block level. Responsibilities include RTL design, digital signal processing implementation, digital architecture definition, system and block-level simulation, and testbench development. The role requires strong knowledge of digital logic, computer architecture, DSP, and CPU/DSP/NPU design, with familiarity with memory systems, bus protocols, verification methodologies, and scripting languages preferred.

Conduct silicon design validation for advanced NAND products through Verilog simulations, validation planning, laboratory measurements, and data analysis. The intern will use testers, oscilloscopes, probe stations, scripting, and engineering software to analyze validation data, generate technical reports, and prototype AI-enabled workflows for automated data collection, reporting, or anomaly detection.

Develop and improve advanced scanning electron microscopy systems for manufacturability, testing, troubleshooting, and production. Analyze data, perform modeling, resolve complex system interactions, create test processes, and drive cross-disciplinary project plans. Support field escalations and beta testing at customer sites while providing design requirements and technical solutions for manufacturability issues. Travel up to 25%.

Develop and optimize manufacturing processes, assembly, alignment, and testing for high-precision electron optics systems. Collaborate with operations, design, quality, supply chain, suppliers, and manufacturing partners to resolve performance and manufacturability issues. Lead root-cause analysis, corrective actions, risk mitigation, process validation, production readiness, modeling, and data-driven improvements. Create project plans, drive cross-functional execution, and present technical solutions.

Leads specification, architecture, transistor-level design, verification, layout supervision, validation, and manufacturing test for complex analog IC subsystems. Partners with architecture, RTL, product, applications, and marketing teams; resolves cross-block issues; supports customer and manufacturing challenges; and mentors senior engineers without formal management responsibility.

Leads the analog design organization and sets architecture, specifications, methodology, and technical direction across multiple semiconductor programs. Directly designs or supervises critical transistor-level analog blocks, oversees verification, validation, layout, and production bring-up, and resolves high-risk technical issues. The role also mentors and manages engineers, chairs design reviews, partners with digital and product teams, supports customer and executive discussions, and drives improvements in tools, design flow, and IP reuse.

Designs and develops complex electrical systems for genomic sequencing instruments. Responsibilities include board-level design, power and thermal management, simulation, board bring-up, troubleshooting, failure analysis, telemetry, EMI/EMC mitigation, performance monitoring, design verification, risk management, and cross-functional technical leadership for RUO and IVD products.

Leads mechanical design and development of DNA sequencing instruments, including precision electro-mechanical and fluidic mechanisms. Translates requirements into subsystem specifications, performs mechanical and thermal analyses, manages outsourced design and manufacturing partners, conducts risk analysis and verification testing, and supports product transfer into manufacturing. Requires strong expertise in robust electro-mechanical system design, tolerance analysis, GD&T, FEA, manufacturing processes, component selection, and SolidWorks. Travel to the US is required.

Leads mechanical design and development of precision electro-mechanical, fluidic, optical, and thermal subsystems for DNA sequencing instruments. Responsibilities include requirements definition, subsystem specifications, mechanical and thermal analysis, tolerance optimization, verification testing, risk analysis, outsourced manufacturing coordination, project scheduling, and product transfer to manufacturing. The role requires cross-functional collaboration, supplier management, and resolution of manufacturing and field issues.

Lead system and subsystem integration, testing, characterization, and specification activities for semiconductor inspection systems. Define architectures, create test plans, resolve complex optical-mechanical and system issues, and support manufacturing and field service teams. Deliver technical training, maintain documentation, coordinate cross-functional projects, report progress and risks, and contribute to product strategy and roadmap alignment. Requires an advanced technical degree and preferably more than three years of relevant experience, with up to 20% international travel.

Own core product surfaces from concept through launch, creating high-fidelity coded prototypes and improving the coss ui design system. Collaborate asynchronously with product and design engineering, emphasizing accessibility, web standards, interaction details, evidence-based decisions, and reusable component architecture. Frame hypotheses, measure outcomes, document decisions, incorporate critique, and deliver prototypes that engineers can implement directly.

Manage optical alignment equipment and methodologies for wafer inspection tools, improve optical integration yield and predictability, troubleshoot manufacturing issues, resolve supplier quality problems, support quality and purchasing improvements, and ensure manufacturing readiness through design reviews.

Supports manufacturing, integration, and sustaining of electronic subsystems and assemblies. Troubleshoots PCB, wiring, and system-level issues; performs root-cause analysis; implements corrective actions; improves yield, reliability, quality, and cost; develops manufacturing documentation; supports validation and qualification testing; resolves supplier issues; and manages engineering changes across the product lifecycle.

Supports production builds, system integration, manufacturing ramp, and sustaining engineering for electrical systems. Troubleshoots electronic and system-level issues, performs root cause analysis, implements corrective actions, and develops manufacturing documentation. Collaborates with design, quality, supply chain, suppliers, and contract manufacturers. Supports validation, qualification, reliability testing, engineering changes, yield improvement, cost reduction, and continuous improvement initiatives.

Lead physical design and implementation for complex SoC and SerDes/interconnect designs from RTL through GDSII tapeout. Responsibilities include floorplanning, power and clock planning, place-and-route, PPA optimization, timing, power, noise, EM/IR-drop analysis, physical verification, signoff, IP integration, flow automation, and methodology development.

As a Senior Engineer in NAND Silicon Design Validation, you'll develop and validate NAND Flash products, perform simulations, and collaborate across teams to address design issues.

Define physical design rules for Non-Volatile Memory technologies, interact with process integration, evaluate design feasibility, and support design rule checking.

Integrate and customize a commercial RISC-V core soft IP, perform RTL (Verilog/SystemVerilog) front-end and control-path modifications, tailor microarchitecture for PPA, support ASIC front-end tasks (synthesis, STA, power, floorplanning), collaborate across performance/middle-end/back-end teams, and contribute to pre- and post-silicon verification and debugging.