Top Design Engineer Jobs in Singapore

Design and validate high-speed digital hardware for networking platforms. Responsibilities include component selection, schematic design, board bring-up, debugging, lab measurements, testing, feasibility studies, design margin analysis, root-cause analysis, and collaboration with global engineering teams. The role provides mentorship and hands-on experience for recent graduates developing real-world networking products.

Leads power architecture and board-level power design for advanced networking platforms. Designs AC-DC and DC-DC conversion, regulators, hot-swap and protection circuits, sequencing, monitoring, and power distribution systems. Owns simulation, schematic development, bring-up, validation, compliance testing, characterization, and root-cause investigations. Establishes design standards, drives system-level trade-offs, collaborates across engineering and manufacturing teams, and mentors senior engineers.

Leads complex hardware designs for next-generation networking platforms across component selection, schematic capture, board architecture, bring-up, debugging, validation, and production readiness. Drives high-speed digital design decisions involving signal integrity, power distribution, performance, reliability, and system-level trade-offs. Collaborates with layout, validation, manufacturing, and firmware teams, performs root-cause analysis and empirical testing, establishes design best practices, and mentors junior engineers.

Lead end-to-end hardware architecture for high-performance networking platforms across multiple product generations. Define system and board-level architectures, make trade-offs across silicon, memory, interfaces, power, timing, thermal, firmware, and manufacturing, and guide feasibility, modeling, validation, reviews, and production. Establish reusable design standards, influence global engineering teams, resolve complex technical issues, and mentor senior engineers and future architects.

Owns advanced package architecture and execution from feasibility through tape-out, qualification, and production readiness. Leads complex package trade-offs across silicon, technology, assembly, quality, suppliers, and OSAT teams. Integrates electrical, thermal, mechanical, power, signal, and manufacturing requirements in silicon-package-board co-design. Advances design rules, automation workflows, and technology roadmaps while mentoring engineers and serving as the technical authority for package design decisions.

Design and advance manufacturing solutions for advanced semiconductor inspection and metrology products. Collaborate with manufacturing, supply chain, installation, quality, global suppliers, and design engineering teams to develop scalable, efficient, and cost-effective electronics manufacturing processes and products.

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Responsibilities include package layout and routing, high-speed SerDes and RF structures, impedance matching, signal and power integrity, thermal management, manufacturability, reliability, and coordinating multiple projects with global teams and external vendors.

Designs and develops PCB logical and physical layouts for high-speed digital, RF, analog, mixed-signal, and power applications. Responsibilities include schematic interpretation, netlist generation, routing constraints, signal and power integrity, DFM/DFA optimization, manufacturing data packages, design verification, tool evaluation, process improvement, documentation, and vendor collaboration. The role also supports design reviews, product releases, and PCB automation using Cadence SKILL.

Perform block-level and top-level physical design implementation for high-speed transceiver IPs at advanced technology nodes. Responsibilities include floorplanning, placement, CTS, routing, physical verification, timing and power optimization, EM/IR analysis, congestion mitigation, ECOs, IP integration, and tapeout signoff. The role also requires scripting automation and collaboration with RTL, STA, and cross-functional engineering teams.

Design and verify advanced-node CMOS analog and mixed-signal ICs, including PLLs, ADCs, regulators, amplifiers, transmitters, receivers, and clocking circuits. The role requires transistor-level design, tapeout, lab bring-up, debugging, noise and jitter analysis, and collaboration across global teams. Engineers will use Spectre and MATLAB, contribute to connectivity and optical applications, and apply expertise in RFIC design, PCB development, ESD protection, packaging, and high-speed data transmission.

Lead block-level and top-level physical implementation for high-speed transceiver IPs at advanced technology nodes. Responsibilities include floorplanning, placement, CTS, routing, timing and power convergence, EM/IR analysis, congestion mitigation, physical verification, IP integration, ECOs, and tapeout signoff. The role requires collaboration with RTL and STA teams, automation scripting, and hands-on use of industry-standard implementation and signoff tools.

Designs and implements DFT architectures and specifications for ASIC/SoC products. Responsibilities include scan insertion, ATPG pattern development, compression and clock-control insertion, optimizing test coverage and power, and pre- and post-silicon verification and debug. The role also requires gate-level simulation, failure analysis, scripting, and collaboration across product teams.

Develop and sustain wafer inspection equipment through subsystem design, system integration, testing, characterization, troubleshooting, and new product introduction. Define specifications and manufacturing requirements, optimize build processes, document procedures, train manufacturing teams, and support quality, tooling, facilities, and product launches. The role requires optical systems expertise, customer collaboration, technical problem-solving, and leadership in resolving complex issues.

Designs and integrates optical inspection and metrology systems, including alignment, testing, characterization, specifications, manufacturing procedures, and design-for-manufacturability. Develops manufacturing requirements and introduction plans, optimizes build processes, trains manufacturing personnel, and troubleshoots complex opto-mechanical and electromechanical equipment. Requires strong optics, imaging, automation, semiconductor manufacturing, and technical problem-solving expertise.

Engineering intern supporting NAND flash silicon design validation through Verilog simulations, validation planning, semiconductor measurements, Python-based data analysis, anomaly detection, and AI-enabled report automation. The role involves using automated test equipment, oscilloscopes, and probe stations under guidance, documenting results, and presenting a final technical report. Candidates should study electrical, electronic, computer, microelectronics, or semiconductor engineering and commit to a five-month full-time internship.

Designs and integrates electrical and electro-mechanical systems for semiconductor equipment. Responsibilities include electrical architecture, power distribution, schematics, component qualification, controls integration, system bring-up, validation, troubleshooting, safety compliance, manufacturing support, documentation, and root-cause analysis. The role collaborates with engineering, manufacturing, suppliers, quality, NPI, service, and field teams to deliver reliable, manufacturable, high-volume products.

Design and review mechanical systems for data centres, focusing on HVAC, cooling, liquid cooling integration, heat transfer, fluid distribution, capacity, redundancy, and maintainability. Coordinate designs with multidisciplinary teams, consultants, suppliers, and contractors; review technical documentation; support procurement, construction, site assessments, installation, and commissioning. Improve energy and water efficiency while standardizing scalable designs for high-density AI and HPC environments.

Develop and improve manufacturing processes and designs for advanced scanning electron microscopy systems. Resolve complex system interaction and field issues, analyze data and models, define manufacturability requirements, create system test and troubleshooting processes, and lead cross-functional project plans. The role also supports beta testing at customer sites and requires deep technical expertise in systems engineering, electron optics, vacuum systems, and high voltage.

Design and manufacturing engineer supporting advanced eBeam SEM instruments. Responsibilities include diagnosing system issues, analyzing data, building optimization models, developing manufacturing processes, improving designs for manufacturability, creating troubleshooting procedures, leading cross-disciplinary projects, and providing field and supplier escalation support with up to 25% travel.

Designs digital circuit blocks and SoC infrastructure, including RTL implementation, IP integration, bus and memory interfaces, clocking, power and reset management. Verifies blocks and mixed-signal/RF integrations using directed, random, assertion-based, modeling, and cosimulation methods. Develops embedded firmware for SoC validation and contributes to architecture, design, verification reviews, technical specifications, reference manuals, and datasheets.

Design and implement digital and mixed-signal ICs at the chip and block level. Responsibilities include RTL design, digital signal processing implementation, digital architecture definition, system and block-level simulation, and testbench development. The role requires strong knowledge of digital logic, computer architecture, DSP, and CPU/DSP/NPU design, with familiarity with memory systems, bus protocols, verification methodologies, and scripting languages preferred.

Conduct silicon design validation for advanced NAND products through Verilog simulations, validation planning, laboratory measurements, and data analysis. The intern will use testers, oscilloscopes, probe stations, scripting, and engineering software to analyze validation data, generate technical reports, and prototype AI-enabled workflows for automated data collection, reporting, or anomaly detection.

Develop and improve advanced scanning electron microscopy systems for manufacturability, testing, troubleshooting, and production. Analyze data, perform modeling, resolve complex system interactions, create test processes, and drive cross-disciplinary project plans. Support field escalations and beta testing at customer sites while providing design requirements and technical solutions for manufacturability issues. Travel up to 25%.

Develop and optimize manufacturing processes, assembly, alignment, and testing for high-precision electron optics systems. Collaborate with operations, design, quality, supply chain, suppliers, and manufacturing partners to resolve performance and manufacturability issues. Lead root-cause analysis, corrective actions, risk mitigation, process validation, production readiness, modeling, and data-driven improvements. Create project plans, drive cross-functional execution, and present technical solutions.

Leads specification, architecture, transistor-level design, verification, layout supervision, validation, and manufacturing test for complex analog IC subsystems. Partners with architecture, RTL, product, applications, and marketing teams; resolves cross-block issues; supports customer and manufacturing challenges; and mentors senior engineers without formal management responsibility.