Top Design Engineer Jobs in Singapore

Develops orbital lifetime prediction and end-of-life disposal models for small satellites. Evaluates passive, active, and hybrid deorbiting strategies, disposal feasibility, deorbiting performance, collision risks, and space debris evolution. The role also contributes to an integrated simulation and decision-support framework for mission safety and orbital lifetime assessment, requiring research communication, independent problem-solving, collaboration, and technical proficiency in aerospace simulation tools.

Designs and develops PCB logical and physical layouts for high-speed digital, RF, analog, mixed-signal, and power applications. Responsibilities include schematic interpretation, netlist generation, routing constraints, signal and power integrity, DFM/DFA optimization, manufacturing data packages, design verification, tool evaluation, process improvement, documentation, and vendor collaboration. The role also supports design reviews, product releases, and PCB automation using Cadence SKILL.

Lead design and delivery of station rejuvenation projects across the MRT network. Manage consultants, oversee civil/structural design development, secure approvals, safeguard corridors, control budget and schedule, evaluate tenders, and coordinate multidisciplinary stakeholders to reduce congestion, improve accessibility, and modernize ageing stations from concept through implementation.

Perform block-level and top-level physical design implementation for high-speed transceiver IPs at advanced technology nodes. Responsibilities include floorplanning, placement, CTS, routing, physical verification, timing and power optimization, EM/IR analysis, congestion mitigation, ECOs, IP integration, and tapeout signoff. The role also requires scripting automation and collaboration with RTL, STA, and cross-functional engineering teams.

Design and verify advanced-node CMOS analog and mixed-signal ICs, including PLLs, ADCs, regulators, amplifiers, transmitters, receivers, and clocking circuits. The role requires transistor-level design, tapeout, lab bring-up, debugging, noise and jitter analysis, and collaboration across global teams. Engineers will use Spectre and MATLAB, contribute to connectivity and optical applications, and apply expertise in RFIC design, PCB development, ESD protection, packaging, and high-speed data transmission.

Lead block-level and top-level physical implementation for high-speed transceiver IPs at advanced technology nodes. Responsibilities include floorplanning, placement, CTS, routing, timing and power convergence, EM/IR analysis, congestion mitigation, physical verification, IP integration, ECOs, and tapeout signoff. The role requires collaboration with RTL and STA teams, automation scripting, and hands-on use of industry-standard implementation and signoff tools.

Designs and implements DFT architectures and specifications for ASIC/SoC products. Responsibilities include scan insertion, ATPG pattern development, compression and clock-control insertion, optimizing test coverage and power, and pre- and post-silicon verification and debug. The role also requires gate-level simulation, failure analysis, scripting, and collaboration across product teams.

Develop and sustain wafer inspection equipment through subsystem design, system integration, testing, characterization, troubleshooting, and new product introduction. Define specifications and manufacturing requirements, optimize build processes, document procedures, train manufacturing teams, and support quality, tooling, facilities, and product launches. The role requires optical systems expertise, customer collaboration, technical problem-solving, and leadership in resolving complex issues.

Designs and integrates optical inspection and metrology systems, including alignment, testing, characterization, specifications, manufacturing procedures, and design-for-manufacturability. Develops manufacturing requirements and introduction plans, optimizes build processes, trains manufacturing personnel, and troubleshoots complex opto-mechanical and electromechanical equipment. Requires strong optics, imaging, automation, semiconductor manufacturing, and technical problem-solving expertise.

Design and review mechanical systems for data centres, focusing on HVAC, cooling, liquid cooling integration, heat transfer, fluid distribution, capacity, redundancy, and maintainability. Coordinate designs with multidisciplinary teams, consultants, suppliers, and contractors; review technical documentation; support procurement, construction, site assessments, installation, and commissioning. Improve energy and water efficiency while standardizing scalable designs for high-density AI and HPC environments.

Drive RTL-to-GDS implementation for advanced processors and ASICs, including synthesis, place and route, timing analysis, timing closure, and power, performance, and area optimization. Perform timing and logic ECOs, resolve congestion and implementation issues, and improve physical design methodologies and automation using Tcl, Perl, and Python. Collaborate with RTL, architecture, timing, and CAD teams to deliver high-quality silicon.

Design and manufacturing engineer supporting advanced eBeam SEM instruments. Responsibilities include diagnosing system issues, analyzing data, building optimization models, developing manufacturing processes, improving designs for manufacturability, creating troubleshooting procedures, leading cross-disciplinary projects, and providing field and supplier escalation support with up to 25% travel.

Designs and develops traffic management schemes, advises developers and agencies, analyzes traffic patterns, and oversees implementation and review. Leads road safety and urban mobility projects using data science, GIS, and traffic microsimulation to develop data-driven recommendations that improve traffic flow, safety, and travel experiences for commuters, motorists, and cyclists.

Designs digital circuit blocks and SoC infrastructure, including RTL implementation, IP integration, bus and memory interfaces, clocking, power and reset management. Verifies blocks and mixed-signal/RF integrations using directed, random, assertion-based, modeling, and cosimulation methods. Develops embedded firmware for SoC validation and contributes to architecture, design, verification reviews, technical specifications, reference manuals, and datasheets.

Design and implement digital and mixed-signal ICs at the chip and block level. Responsibilities include RTL design, digital signal processing implementation, digital architecture definition, system and block-level simulation, and testbench development. The role requires strong knowledge of digital logic, computer architecture, DSP, and CPU/DSP/NPU design, with familiarity with memory systems, bus protocols, verification methodologies, and scripting languages preferred.

Develop and improve advanced scanning electron microscopy systems for manufacturability, testing, troubleshooting, and production. Analyze data, perform modeling, resolve complex system interactions, create test processes, and drive cross-disciplinary project plans. Support field escalations and beta testing at customer sites while providing design requirements and technical solutions for manufacturability issues. Travel up to 25%.

Develop and optimize manufacturing processes, assembly, alignment, and testing for high-precision electron optics systems. Collaborate with operations, design, quality, supply chain, suppliers, and manufacturing partners to resolve performance and manufacturability issues. Lead root-cause analysis, corrective actions, risk mitigation, process validation, production readiness, modeling, and data-driven improvements. Create project plans, drive cross-functional execution, and present technical solutions.

Design and develop mixed-signal IC products, including digital architectures, block- and chip-level RTL implementations, digital signal-processing blocks, and verification environments. Translate system requirements into robust digital designs and collaborate with analog, mixed-signal, and system teams. Responsibilities include EDA implementation flows, testbench development, and block- and system-level verification for power-management or data-converter products.

Leads specification, architecture, transistor-level design, verification, layout supervision, validation, and manufacturing test for complex analog IC subsystems. Partners with architecture, RTL, product, applications, and marketing teams; resolves cross-block issues; supports customer and manufacturing challenges; and mentors senior engineers without formal management responsibility.

Leads the analog design organization and sets architecture, specifications, methodology, and technical direction across multiple semiconductor programs. Directly designs or supervises critical transistor-level analog blocks, oversees verification, validation, layout, and production bring-up, and resolves high-risk technical issues. The role also mentors and manages engineers, chairs design reviews, partners with digital and product teams, supports customer and executive discussions, and drives improvements in tools, design flow, and IP reuse.

Designs and develops complex electrical systems for genomic sequencing instruments. Responsibilities include board-level design, power and thermal management, simulation, board bring-up, troubleshooting, failure analysis, telemetry, EMI/EMC mitigation, performance monitoring, design verification, risk management, and cross-functional technical leadership for RUO and IVD products.

Leads mechanical design and development of DNA sequencing instruments, including precision electro-mechanical and fluidic mechanisms. Translates requirements into subsystem specifications, performs mechanical and thermal analyses, manages outsourced design and manufacturing partners, conducts risk analysis and verification testing, and supports product transfer into manufacturing. Requires strong expertise in robust electro-mechanical system design, tolerance analysis, GD&T, FEA, manufacturing processes, component selection, and SolidWorks. Travel to the US is required.

Leads mechanical design and development of precision electro-mechanical, fluidic, optical, and thermal subsystems for DNA sequencing instruments. Responsibilities include requirements definition, subsystem specifications, mechanical and thermal analysis, tolerance optimization, verification testing, risk analysis, outsourced manufacturing coordination, project scheduling, and product transfer to manufacturing. The role requires cross-functional collaboration, supplier management, and resolution of manufacturing and field issues.

Lead system and subsystem integration, testing, characterization, and specification activities for semiconductor inspection systems. Define architectures, create test plans, resolve complex optical-mechanical and system issues, and support manufacturing and field service teams. Deliver technical training, maintain documentation, coordinate cross-functional projects, report progress and risks, and contribute to product strategy and roadmap alignment. Requires an advanced technical degree and preferably more than three years of relevant experience, with up to 20% international travel.

Supports manufacturing, integration, and sustaining of electronic subsystems and assemblies. Troubleshoots PCB, wiring, and system-level issues; performs root-cause analysis; implements corrective actions; improves yield, reliability, quality, and cost; develops manufacturing documentation; supports validation and qualification testing; resolves supplier issues; and manages engineering changes across the product lifecycle.