Top Engineering Jobs in Singapore

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

The Senior Manager will develop global TIQ strategy, lead materials cost engineering, manage TIQ programs, and mentor teams to optimize semiconductor manufacturing costs and processes.

The Manufacturing Engineer is responsible for production planning, ensuring on-time delivery, driving continuous improvements, and maintaining safety standards.

Responsible for overseeing multiple construction projects, ensuring timely delivery, risk management, communication among teams, and stakeholder management as a Director for Global Facilities & Construction.

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

The Global FE Planning Modeling Engineer optimizes manufacturing processes, analyzes capital impacts, and leads network tool utilization strategies within a multi-functional team environment.

The Shift Equipment Engineer is responsible for improving equipment efficiency, providing manufacturing support, leading continuous improvement projects, and conducting training in a semiconductor environment.

As Engineering Lead, you'll manage the Notification Platform team, focusing on building and operating critical components for messaging. Responsibilities include developing a resilient Notification Platform, maintaining architecture standards, and fostering team growth.

Manage cross-functional teams to oversee product development, from concept to manufacturing. Enhance process efficiency and support product documentation and regulatory certifications.

The Engineering Director will lead software engineering teams, set technical direction, ensure product quality, and foster innovation and collaboration.

Early-career engineer supporting NAND package and silicon integration. Assist CPI assessments, DFMEA/PFMEA, wafer dicing/singulation investigations, DOEs and test vehicles, yield and manufacturability problem solving, and prepare technical documentation under mentorship.

Lead and develop a high-performing team to enhance package and HBM product engineering activities, focusing on quality, cost, and cycle time improvements while collaborating across various teams.

Lead the Onboarding Engineering team, focusing on technical direction and people management to develop scalable KYC and onboarding systems.

Lead the Onboarding team by managing engineers, driving technical design, building scalable KYC systems, and ensuring security and compliance.

Lead technology development programs for execution against market timelines, manage operations, develop schedules, and coordinate with stakeholders and teams while ensuring project requirements are met.

Lead the Media Health Reliability team in developing reliability tests, driving reliability improvements, and collaborating cross-functionally to ensure product quality and performance.

Lead the Realtime Data Platform to define a 1-3 year roadmap, modernize data infrastructure for real-time analytics at petabyte scale, enable data-driven product features, scale and mentor engineering teams, and act as a trusted advisor on Data and AI architecture, governance, and observability.

Lead HBM product reliability engineering: develop and execute intrinsic/extrinsic reliability tests, reduce DPM, root-cause qual and RMA failures via EFA/PFA, recommend fab process conversions, collaborate cross-functionally, mentor team, and manage project and risk to meet quality, cost, and cycle-time KPIs.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Lead development and validation of next-generation High Bandwidth Memory (HBM) products, optimize manufacturing test coverage and DFT strategy, improve yield and reduce test time through circuit debug and data analysis, mentor team members, and collaborate cross-functionally to meet quality, cost, cycle time, and scale objectives.

Lead manufacturing test development and validation for next-generation HBM products. Drive test coverage optimization, yield improvement, DFT strategy, reliability, and test-time reduction. Perform circuit debug and cross-functional execution with Fab, design, and test teams while mentoring others and making technical risk/prioritization decisions to enable scalable, cost-effective production.

Develop and deploy product-disposition workflows and deviation alert systems using statistical tools and ML/AI to improve yield, reliability, and quality. Build algorithms for data mining, pattern recognition, and wafer/die screening. Collaborate with Fab, design, and quality teams, mentor team members, and drive technical innovation to meet KPIs like quality, cost, cycle time, and scale.

Develop and execute reliability test flows and qualification plans for HBM products, drive DPM reduction, root-cause failure analysis (EFA/PFA), recommend process conversions for HVM, manage risk and cross-functional collaboration, mentor team members, and make technical decisions to improve yield, quality, and reliability.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.