Top Engineering Jobs in Singapore

Lead the reliability testing and process improvement for HBM products, ensuring quality and efficiency while mentoring team members and managing projects.

Maintain and support R&D engineering lab equipment through setup, qualification, preventive maintenance, calibration, troubleshooting, rebuilding, modifications, and upgrades. Document equipment activity, manage product tracking and inventory, respond to customer requests, support audits, follow safety procedures, and collaborate with engineering teams. Identify automation opportunities and use AI tools to improve productivity.

Drive manufacturing execution and product engineering for next-generation HBM products. Responsibilities include test flow development and validation, optimized test coverage, circuit debug, yield improvement, test-time reduction, reliability enhancement, cost reduction, and design-for-test strategy. The role supports product validation using CAD tools and Verilog simulations, resolves manufacturing and quality issues, collaborates cross-functionally, mentors engineers, and makes technical decisions on risk and project priorities.

Leads HBM product system engineering and manufacturing test development for next-generation memory products. Responsibilities include test coverage optimization, product validation, circuit debugging, yield improvement, cost and test-time reduction, root-cause analysis, DFT strategy, technical decision-making, cross-functional collaboration, and team mentorship. The role also drives innovation, project execution, and productivity improvements using AI tools.

Leads multiple hardware engineering teams and managers developing high-performance networking platforms. Owns technical strategy, architecture through mass production, quality, reliability, cost, budgets, schedules, and delivery. Partners with program management, manufacturing, supply chain, executives, suppliers, and outsourced development partners. Responsibilities include organizational design, hiring, talent development, performance management, succession planning, process improvement, and strategic technology direction.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Conduct a five-month engineering project optimizing Chemical Mechanical Planarization processes and characterizing equipment in semiconductor manufacturing. Analyze process, metrology, equipment, and manufacturing data using statistical and AI-assisted methods; assess process capability and qualification results; and develop a dashboard, analytics model, or automation tool. Collaborate with cross-functional stakeholders and deliver technical reports, presentations, engineering recommendations, and documented improvement results focused on stability, yield, cost, productivity, or data accessibility.

Five-month internship developing AI and machine learning solutions for semiconductor facilities engineering. Responsibilities include analyzing operational and sensor data, building predictive maintenance and anomaly-detection prototypes, creating dashboards and automation workflows, and developing AI-enabled knowledge-management tools. The intern will collaborate with facilities engineers, apply software-engineering principles, document findings, and present recommendations and business value.

Supports NAND product development from silicon through system integration. Responsibilities include translating business and SSD requirements into qualification specifications, developing AI-enabled data workflows, coordinating technology, design, fabrication, assembly, test, quality, supply chain, and business teams, and managing product qualification priorities. The role leads reviews, cross-functional meetings, capability assessments, and resolution of NAND-system issues to enable timely customer product qualification.

Supports semiconductor HBM reliability, device/package/wafer testing, failure analysis, product debugging, laboratory operations, inventory and logistics, audits, safety compliance, automation, data analysis, and continuous improvement. Uses AI-assisted tools, Power BI, Python, SQL, and manufacturing systems to improve reliability workflows and debug efficiency. Requires rotating day/night shifts, including occasional weekends and public holidays, and collaborates with cross-functional teams while mentoring junior technicians.

Leads HBM product engineering reliability teams responsible for reliability test development, qualification execution, DPM reduction, failure analysis, root-cause resolution, manufacturing test optimization, and process conversions. Collaborates with fabrication, technology development, design, quality, and system teams to improve yield, cost, cycle time, quality, and product reliability. Provides technical decisions, risk management, project leadership, mentoring, and innovation while supporting HBM products across DRAM, interface die, and stacked components.

Leads a team developing and productionizing predictive, machine learning, deep learning, and GenAI solutions for semiconductor manufacturing and HBM product engineering. Responsibilities include yield and reliability modeling, large-scale data pipelines, MLOps, model monitoring and drift control, distributed analytics, deployment, and engineering decision support. The role also requires mentoring engineers, setting technical direction, collaborating cross-functionally, and translating model outputs into improvements in quality, cost, cycle time, and manufacturing efficiency.

Participate in functional and design validation of advanced NAND products using silicon and simulation platforms. Develop test cases, automation scripts, and engineering tools; analyze performance, timing, and power characteristics; investigate failures through log review and root-cause analysis; and document findings in technical reports and presentations.

Leads pre-sales solution engineering for Mastercard issuer loyalty products across Singapore and Southeast Asia. Acts as the technical advisor and solution designer for sales teams, supporting product demonstrations, technical discovery, RFIs/RFPs, integration analysis, solution documentation, stakeholder approvals, and handoffs to delivery. Partners with product teams on customer insights, competitive intelligence, go-to-market execution, and roadmap strategy.

Leads functional and design validation for advanced NAND products using silicon and simulation platforms. Develops deterministic tests, random sequence generators, and automation frameworks in C, Python, and Perl. Performs electrical failure analysis, root-cause investigations, and cross-functional issue resolution. Uses Verilog, Synopsys VCS, dashboards, data analytics, and AI/ML techniques to improve validation coverage, test efficiency, defect triage, and debug productivity.

Internship focused on semiconductor process integration, device reliability, and data-driven improvement for NAND, DRAM, and HBM manufacturing. The intern will study process interactions, failure mechanisms, yield, reliability, and manufacturing data while gaining exposure to analytics, automation, dashboards, and AI/ML tools. Deliverables include technical documentation, analysis reports, improvement evaluations, and an analytics or automation demonstration. The role involves collaboration across process, manufacturing, yield, product, and failure analysis teams.

Interns will develop AI-enabled and digital solutions for semiconductor failure analysis workflows. Responsibilities include analyzing laboratory metrics and engineering datasets, creating dashboards and automation tools, exploring AI and knowledge-management applications, collaborating with Test Engineering stakeholders, and presenting project findings. The role provides exposure to electrical and physical failure analysis, semiconductor manufacturing, data analytics, workflow automation, and engineering decision-making.

Five-month internship focused on SSD depanel process characterization and optimization in semiconductor manufacturing. Responsibilities include executing statistical Design of Experiments, analyzing process and equipment data, identifying variation sources, establishing operating windows, developing visualizations, collaborating with engineering stakeholders, and evaluating AI-enabled tools for automated analysis, anomaly detection, reporting, and knowledge capture.

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

The MTS/Principal Engineer leads WET process development for NAND technology, conducting experiments, supporting process integration, and mentoring junior staff, while collaborating across teams to drive innovation and optimize processes.

Lead global teams for HBM customer integration and system engineering, drive technical interlocks, design reviews, escalations, and integration. Partner with design, product, manufacturing to translate customer requirements into product solutions. Own HBM architecture, packaging, manufacturing, customer enablement, scalable engagement models, governance, and executive communications. Resolve complex technical issues and influence product roadmaps. Develop and deploy AI systems to automate processes and solve technical challenges.

Develops, evaluates, qualifies, and deploys automated semiconductor packaging equipment. Responsibilities include defining equipment requirements, benchmarking suppliers, managing capital requests and purchasing specifications, establishing qualification criteria, transferring equipment to production, maintaining equipment maturity and capability records, enabling automation and process-control systems, and supporting supplier improvement initiatives and continuous improvement projects.

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

Analyze and improve yield during High Bandwidth Memory new product introduction, from first silicon through early high-volume manufacturing. Responsibilities include yield monitoring, excursion management, defect breakdown, failure analysis coordination, yield deviation analysis, dashboard maintenance, SPC/FDC monitoring, and identifying improvement opportunities. The engineer collaborates with process integration, process engineering, manufacturing, quality, and data analysis teams while applying AI-assisted tools and data-driven problem-solving methods.

Supports semiconductor device, package, wafer, and HBM reliability testing, failure analysis, debugging, laboratory operations, inventory, logistics, audits, safety, and continuous improvement. Uses AI-assisted tools, automation, data analysis, dashboards, and digital transformation to improve reliability operations. Requires rotating day/night shifts and collaboration with cross-functional teams, with opportunities to mentor junior technicians.