Top Engineering Jobs in Singapore

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

Lead the Media Health Manufacturing efforts for Micron's HBM products, focusing on test coverage, product development, yield improvement, and cross-functional collaboration.

Leads HBM product engineering and media health manufacturing activities, including test-flow development, validation, yield improvement, reliability, circuit debugging, test coverage optimization, cost reduction, and DFT strategy. Manages technical projects, makes risk and prioritization decisions, mentors engineers, and collaborates with manufacturing, design, technology development, quality, and reliability teams to deliver next-generation HBM products.

Lead cross-functional execution of HBM products from concept through design, new product introduction, and high-volume manufacturing. Build and maintain development schedules, prioritize tactical activities, manage risks and issues, coordinate engineering and manufacturing teams, communicate status to technical and senior leadership, assign task ownership, maintain documentation, and support hardware readiness and capacity planning.

Develop, deploy, and support wafer probe equipment and processes for global semiconductor manufacturing, with emphasis on HBM. Evaluate equipment and probe cards, establish standardized processes, engage suppliers, analyze manufacturing data, define equipment specifications, resolve production issues, and support high-volume manufacturing integration. The role collaborates with global manufacturing, test, process engineering, and quality teams while driving continuous improvement and responsible use of AI-enabled tools.

Develop and optimize wafer-level semiconductor packaging processes, including wafer thinning and backside metal interconnects. Evaluate equipment and materials, establish process parameters, improve quality and yield through SPC, DOE, defect analysis, and advanced controls, and coordinate technology transfers from development through high-volume manufacturing. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams while documenting process and model records. Apply AI-enabled tools to improve analysis, efficiency, and operational outcomes.

Identifies and resolves semiconductor process and equipment issues; leads equipment qualification, process optimization, yield improvement, cost reduction, and new process validation. Manages supplier quality and audits, supports manufacturing controls, and maintains MES databases. Analyzes process data, identifies improvement opportunities, collaborates cross-functionally, and applies statistical methods, automation, and AI-enabled tools in manufacturing operations.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

Support new non-volatile memory product startups and sustain high-volume yields by performing yield and failure analysis, designing and running DOE, driving cross-functional mitigation taskforces, collaborating with fab/process/test teams, presenting statistical analysis, and integrating AI-assisted tools to improve yield, product grades, and reliability.

Monitor and drive quality and reliability for NAND memory products in Fab10. Collect and analyze wafer-level reliability data, manage reliability scorecards, lead continuous improvement, support customer RMA responses, risk assessments, MRB, and follow-on qualifications during HVM. Partner with global quality and PE teams and integrate AI-assisted tools to improve processes and outcomes.

Develop and deploy advanced semiconductor packaging technologies for high-performance memory products. Drive package integration, yield and quality improvements, cost reduction, process control, data analytics, and manufacturing readiness. Collaborate with process, product, assembly, test, reliability, and quality teams from technology development through high-volume production. Create process and model-of-record documentation and use Python, R, SQL, Visual Basic, and semiconductor control systems to analyze data and improve integration flows.

Supports engineering program planning and execution for HBM semiconductor development programs. Tracks milestones, dependencies, risks, and action items; consolidates engineering information into reports and insights; and collaborates with cross-functional teams. Identifies inefficient workflows and prototypes AI, automation, dashboard, and data analytics solutions to improve reporting, information retrieval, risk tracking, and program visibility. Presents recommendations and documents results.

The role focuses on developing advanced packaging technology for semiconductors, improving yields, quality control, and collaborating with various engineering teams for optimal manufacturing processes.

Identify and resolve semiconductor manufacturing process and equipment issues; optimize processes, materials, tools, yield, and costs; support equipment qualification, process validation, audits, and new product introductions. Manage MES data, analyze trends, and support SPC, FDC, RMS, and APC systems. Collaborate cross-functionally with engineering, operations, quality, and suppliers while applying AI-enabled tools and continuous improvement methods.

Drives semiconductor product lifecycle execution, new product introduction, inventory and material health, cost reduction, operational readiness, governance, and continuous improvement. Leads cross-functional initiatives across engineering, manufacturing, planning, supply chain, quality, and business teams. Develops analytics, dashboards, automation, AI-enabled applications, and decision-support tools to improve operational performance, risk detection, execution speed, and business outcomes.

Develop advanced analytics solutions for High Bandwidth Memory manufacturing. Analyze engineering datasets, build automated data pipelines and monitoring workflows, apply statistical and machine learning methods to detect deviations, investigate process-to-product relationships, and create dashboards that improve yield, quality, reliability, and performance insights. The intern will present findings to engineering stakeholders and gain experience in semiconductor product engineering, manufacturing analytics, and AI-enabled engineering solutions.

Lead the Site Reliability Engineering team focusing on network infrastructure, ensuring performance, capacity, and reliability of Mastercard applications, and leading incident reviews and proactive issue detection.

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

The role involves developing AI and ML solutions for semiconductor workflows, training Citizen Data Scientists, and integrating intelligent agents into engineering processes.

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

The role involves developing wafer-level process conditions, enhancing equipment capabilities, advocating for new materials, ensuring quality improvements, and facilitating collaboration across teams.

The role involves developing and optimizing packaging processes, improving product quality, evaluating new materials, and collaborating with various teams to enhance manufacturing efficiency.