Top Engineering Jobs in Singapore

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

The Global FE Planning Modeling Engineer optimizes manufacturing processes, analyzes capital impacts, and leads network tool utilization strategies within a multi-functional team environment.

The Shift Equipment Engineer is responsible for improving equipment efficiency, providing manufacturing support, leading continuous improvement projects, and conducting training in a semiconductor environment.

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

The Senior Manager will develop global TIQ strategy, lead materials cost engineering, manage TIQ programs, and mentor teams to optimize semiconductor manufacturing costs and processes.

The Manufacturing Engineer is responsible for production planning, ensuring on-time delivery, driving continuous improvements, and maintaining safety standards.

The Engineer for Product Development will evaluate new equipment, integrate AI tools for efficiency, and manage supplier engagement while supporting continuous improvement initiatives.

Intern will perform data analysis and develop predictive models using machine learning for semiconductor manufacturing datasets, contributing to insights and decision-making.

Intern will validate High Bandwidth Memory (HBM) designs: interpret JEDEC specs, create architecture documentation, perform schematic/layout review, run circuit simulations, debug hardware/software in the lab, analyze data, and collaborate with design, manufacturing, test, and quality through bring-up, qualification, and production.

Lead design and implementation of process-mining and labor data engineering for Front End operations. Build digital footprint capabilities, dashboards, AI-driven optimizations, and standardized processes to drive labor productivity, savings, and scalable operational improvements across global sites.

As a transformative engineer at Micron, you will lead initiatives for process capability improvements and collaborate with multi-functional teams to enhance product integration and yield.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Support NPI transfers and qualification builds for semiconductor packages; troubleshoot and document process deviations; assist engineers with DOE, equipment/material qualification, procedure maintenance, and training. Work day/night shifts and adopt AI-enabled manufacturing tools.

Lead data-driven process and test integration initiatives to improve high-value-bits yield (PG2+). Develop models and monitoring for tool performance, equipment prognostics, and test optimization. Prototype solutions with cross-functional teams, deploy best-known-methods to production, and integrate AI-assisted tools to drive continuous improvement and operational excellence.

Own probe strategy and silicon learning at wafer test from pre-silicon to high-volume manufacturing. Define probe coverage, limits, and guard-bands; enable first-silicon bring-up and device characterization; drive yield, quality, and test-cost optimization; collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability; leverage data and AI/ML for predictive probe and test optimization.

Design and enable engineering tools and tester frameworks for NAND characterization, bring-up, debug, and failure analysis. Integrate lab instrumentation with testers, support tester workflows, collaborate with Device PE and Validation teams, and apply AI-enabled methods to accelerate test program development and diagnostics.

The role involves reliability test program coding, root cause analysis, innovation promotion, cross-functional collaboration, data analysis, technical decision-making, project management, and mentorship for product system engineering.

Lead the reliability testing and process improvement for HBM products, ensuring quality and efficiency while mentoring team members and managing projects.

As an AI/Data Science Intern in NAND Device Engineering, you will develop AI-driven automation workflows, intelligent decision-support tools, and data pipelines to enhance engineering processes in NAND technology.

Senior Engineer for Water within Global Facilities Engineering provides technical leadership for UPW, WWT, and waste chemical systems across global semiconductor sites. Develops standards, supports design and construction, drives standardization and sustainability programs, applies AI/digital tools for optimization, and leads reliability and capacity initiatives.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

Provide technical leadership and field expertise for chemical and slurry facilities systems across global semiconductor sites. Develop and standardize global systems, specifications, and BKMs; support design, construction, cost/schedule estimates, and operations; lead global programs including sustainability and AI/digital initiatives; benchmark best practices; and travel internationally to support projects and site activities.

Lead manufacturing test development and validation for next-generation HBM products. Drive test coverage optimization, yield improvement, DFT strategy, reliability, and test-time reduction. Perform circuit debug and cross-functional execution with Fab, design, and test teams while mentoring others and making technical risk/prioritization decisions to enable scalable, cost-effective production.

Lead development and delivery of wafer/cube probe test solutions for HBM devices across NPI to HVM. Drive probe test plans, ATE program development, silicon debug, data-driven yield improvements, probe hardware validation, cost and test-time optimization, and cross-functional alignment. Mentor engineers and standardize probe practices to ensure production readiness and sustained issue closure.