Top Engineering Jobs in Singapore

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

The Senior Manager will develop global TIQ strategy, lead materials cost engineering, manage TIQ programs, and mentor teams to optimize semiconductor manufacturing costs and processes.

The Manufacturing Engineer is responsible for production planning, ensuring on-time delivery, driving continuous improvements, and maintaining safety standards.

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

The Global FE Planning Modeling Engineer optimizes manufacturing processes, analyzes capital impacts, and leads network tool utilization strategies within a multi-functional team environment.

The Shift Equipment Engineer is responsible for improving equipment efficiency, providing manufacturing support, leading continuous improvement projects, and conducting training in a semiconductor environment.

The role involves troubleshooting, repairing, and maintaining electrical and mechanical equipment in a manufacturing environment, including documentation and customer requests.

Lead the reliability and performance of payment infrastructure, assess service quality, drive automation, and collaborate with cross-functional teams to ensure high availability and observability.

The role involves developing reliability test programs and collaborating with various teams on HBM products, focusing on coding, testing, data analysis, and process improvements.

The role involves developing reliability test flows, executing test plans, managing quality qualifications, conducting root cause analysis, and collaborating across teams to optimize product reliability and performance.

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

This role includes driving Media Health manufacturing execution for HBM products, ensuring test coverage, improving yields, and collaborating with cross-functional teams.

Coordinate improvements in yield, quality, and output for DRAM/NAND processes. Collaborate with teams to analyze data, optimize processes, and troubleshoot fabrication issues.

The Engineer will drive the execution of Media Health manufacturing for next-gen HBM products, focusing on testing, validation, yield improvement, and cross-functional collaboration.

The role involves managing BIM processes, maintaining model accuracy, facilitating construction coordination, performing QA/QC checks, and supporting project teams with BIM data and training.

Lead the HBM Package Product Engineering team, focusing on yield improvement, cross-functional collaboration, innovation, and mentorship, while managing project execution and technical decision-making.

Own probe strategy and silicon learning at wafer test from pre-silicon to high-volume manufacturing. Define probe coverage, limits, and guard-bands; enable first-silicon bring-up and device characterization; drive yield, quality, and test-cost optimization; collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability; leverage data and AI/ML for predictive probe and test optimization.

Lead and grow a Data Engineering team to design and deliver reliable batch and near-real-time pipelines, data models, and analytics-ready datasets. Define technical direction for data modeling, pipeline architecture, observability, and governance; improve standards across SQL, dbt, Spark, Airflow, and Databricks; partner with stakeholders to translate business needs into scalable, production-ready data solutions.

Intern will analyze variability and predict failures using data analysis and AI, support predictive and preventive maintenance, develop data models and visualizations, automate reports, and assist with semiconductor test tool hardware projects.

Develop and execute reliability test flows and qualification plans for HBM products, drive DPM reduction, root-cause failure analysis (EFA/PFA), recommend process conversions for HVM, manage risk and cross-functional collaboration, mentor team members, and make technical decisions to improve yield, quality, and reliability.

Lead technology development programs for execution against market timelines, manage operations, develop schedules, and coordinate with stakeholders and teams while ensuring project requirements are met.

Early-career engineer supporting NAND package and silicon integration. Assist CPI assessments, DFMEA/PFMEA, wafer dicing/singulation investigations, DOEs and test vehicles, yield and manufacturability problem solving, and prepare technical documentation under mentorship.

Lead and develop a high-performing team to enhance package and HBM product engineering activities, focusing on quality, cost, and cycle time improvements while collaborating across various teams.

Manage cross-functional teams to oversee product development, from concept to manufacturing. Enhance process efficiency and support product documentation and regulatory certifications.

The Engineering Director will lead software engineering teams, set technical direction, ensure product quality, and foster innovation and collaboration.