Top Engineering Jobs in Singapore

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

Drive manufacturing execution and product engineering for next-generation HBM products. Responsibilities include test flow development and validation, optimized test coverage, circuit debug, yield improvement, test-time reduction, reliability enhancement, DFT strategy, root-cause analysis, and product qualification. Collaborate with Fab, design, technology development, quality, and test engineering teams while mentoring others and supporting project decisions.

Leads Micron’s HBM Product Engineering Media Health team, overseeing manufacturing test flow development, product validation, yield improvement, reliability, cost reduction, test coverage, DFT strategy, and root-cause resolution. The role requires cross-functional collaboration across design, fabrication, technology development, testing, and quality teams. It also includes technical decision-making, innovation, mentorship, project leadership, and using AI tools to improve productivity. The position is onsite in Singapore with international travel opportunities.

Develops semiconductor memory product reliability test flows, qualification plans, manufacturing test strategies, and root-cause solutions for HBM products. Drives defect and reliability improvements, process conversions, yield, quality, cost, and cycle-time goals through cross-functional collaboration. Applies Python, JMP, machine learning, and AI tools to reliability data and workflows while supporting risk management, technical decisions, and team innovation.

Leads Micron’s HBM Product System Engineering Media Health team in developing, validating, and manufacturing next-generation HBM products. Responsibilities include optimizing test coverage, improving device and stacked-die yields, reducing test time and costs, resolving manufacturing, qualification, and RMA issues, and supporting circuit analysis, CAD, and Verilog validation. The role manages complex technical projects, makes risk and prioritization decisions, collaborates cross-functionally, mentors engineers, and drives AI-enabled automation and innovation. The position is onsite in Singapore with international travel.

The role involves optimizing test coverage, validating HBM products, yielding improvements, supporting new designs with CAD tools, and collaborating across teams while mentoring others.

Leads a team developing and productionizing predictive, machine learning, deep learning, and GenAI solutions for semiconductor manufacturing and HBM product engineering. Responsibilities include yield and reliability modeling, large-scale data pipelines, MLOps, model monitoring and drift control, distributed analytics, deployment, and engineering decision support. The role also requires mentoring engineers, setting technical direction, collaborating cross-functionally, and translating model outputs into improvements in quality, cost, cycle time, and manufacturing efficiency.

The role involves developing AI and ML solutions for semiconductor workflows, training Citizen Data Scientists, and integrating intelligent agents into engineering processes.

The role involves reliability test program coding, root cause analysis, innovation promotion, cross-functional collaboration, data analysis, technical decision-making, project management, and mentorship for product system engineering.

Five-month intern project focused on NAND probe product engineering, test mode integration, Design for Test, silicon validation, and product characterization. The intern will analyze engineering data for yield and failure patterns, develop visualization and automation tools, and explore AI, machine learning, generative AI, and LLM-based solutions for engineering workflows. Deliverables include technical assessments, dashboards, prototypes, reports, and recommendations.

Provide strategic and technical leadership for construction engineering governance and Asia regional support for large-scale semiconductor fab programs. Define standards, playbooks, and execution methodologies; lead constructability reviews, commissioning readiness, and multi-discipline teams; support design integration, cost/schedule input, risk mitigation, and global stakeholder alignment to ensure safe, consistent, and high-quality facility delivery.

The role involves leading reliability tests for HBM products, addressing issues in performance and quality, and collaborating across teams for process improvements.

Leads HBM product engineering and media health manufacturing activities, including test-flow development, validation, yield improvement, reliability, circuit debugging, test coverage optimization, cost reduction, and DFT strategy. Manages technical projects, makes risk and prioritization decisions, mentors engineers, and collaborates with manufacturing, design, technology development, quality, and reliability teams to deliver next-generation HBM products.

Lead global teams for HBM customer integration and system engineering, drive technical interlocks, design reviews, escalations, and integration. Partner with design, product, manufacturing to translate customer requirements into product solutions. Own HBM architecture, packaging, manufacturing, customer enablement, scalable engagement models, governance, and executive communications. Resolve complex technical issues and influence product roadmaps. Develop and deploy AI systems to automate processes and solve technical challenges.

Lead probe strategy and silicon learning from pre-silicon staging through first-silicon bring-up and HVM. Define probe coverage, limits, and guard-bands using silicon characterization. Collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability to drive yield, quality, cost, and test-efficiency improvements. Enable NPI, perform device characterization, root-cause analysis, and apply data/AI for probe and test optimization.

Leads advanced data analytics and AI/ML initiatives for HBM semiconductor products. Develops machine learning, deep learning, anomaly detection, screening, and deviation-monitoring solutions to improve yield, quality, reliability, and engineering efficiency. Strengthens analytics infrastructure and visualization workflows while collaborating across manufacturing, design, technology development, product engineering, and quality teams. Provides technical leadership, mentorship, and innovation guidance for AI-enabled engineering practices.

Develops semiconductor product reliability tests and qualification plans for High Bandwidth Memory products. The role executes reliability testing, investigates device failures through electrical and physical analysis, reduces defect rates, supports process conversions and high-volume manufacturing, manages technical risks, and drives cross-functional resolution with fabrication, design, quality, and technology teams. It also promotes AI-enabled workflow automation, mentors engineers, and supports project prioritization and technical decision-making.

Develop advanced analytics solutions for High Bandwidth Memory manufacturing. Analyze engineering datasets, build automated data pipelines and monitoring workflows, apply statistical and machine learning methods to detect deviations, investigate process-to-product relationships, and create dashboards that improve yield, quality, reliability, and performance insights. The intern will present findings to engineering stakeholders and gain experience in semiconductor product engineering, manufacturing analytics, and AI-enabled engineering solutions.

Leads functional and design validation for advanced NAND products using silicon and simulation platforms. Develops deterministic tests, random sequence generators, and automation frameworks in C, Python, and Perl. Performs electrical failure analysis, root-cause investigations, and cross-functional issue resolution. Uses Verilog, Synopsys VCS, dashboards, data analytics, and AI/ML techniques to improve validation coverage, test efficiency, defect triage, and debug productivity.

As a transformative engineer at Micron, you will lead initiatives for process capability improvements and collaborate with multi-functional teams to enhance product integration and yield.

Three-month internship supporting semiconductor package development, process characterization, engineering data analysis, yield and quality improvement, automation, dashboards, and AI-enabled workflows. The intern will complete a focused engineering project, document findings, develop an analytical or automation solution, and present recommendations to Package Development Engineering leadership.

Leads HBM product reliability engineering, including reliability test-flow development, qualification execution, DPM reduction, failure analysis, root-cause resolution, process conversions, and manufacturing test optimization. Partners with fab, quality, technology development, design, and systems teams to improve yield, cost, cycle time, and product reliability. Mentors engineers, manages technical risks and priorities, and applies AI and machine learning to reliability data and qualification workflows.

Lead the Media Health Manufacturing efforts for Micron's HBM products, focusing on test coverage, product development, yield improvement, and cross-functional collaboration.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.