Top Engineering Jobs in Singapore

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

The Senior Manager will develop global TIQ strategy, lead materials cost engineering, manage TIQ programs, and mentor teams to optimize semiconductor manufacturing costs and processes.

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

Lead and grow engineering teams that build and operate card issuing, transaction processing, and settlement platforms. Provide people leadership, technical and architectural direction, ensure reliability, scalability, observability, and compliance, drive platform improvements, and collaborate with product and operations to deliver high-impact systems.

Provide strategic and technical leadership for construction engineering governance and Asia regional support for large-scale semiconductor fab programs. Define standards, playbooks, and execution methodologies; lead constructability reviews, commissioning readiness, and multi-discipline teams; support design integration, cost/schedule input, risk mitigation, and global stakeholder alignment to ensure safe, consistent, and high-quality facility delivery.

The PI Engineer drives process integration for HBM products during NPI, collaborating cross-functionally to ensure readiness and resolve issues while leveraging AI tools for efficiency.

The role focuses on product reliability, involving test development, execution, problem-solving, risk management, and cross-functional collaboration to drive innovations in high bandwidth memory technology.

The Engineering Execution Manager will lead HBM product development through all phases, manage schedules, coordinate cross-functional teams, and communicate status and project priorities.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.

Own probe strategy and silicon learning at wafer test from pre-silicon to high-volume manufacturing. Define probe coverage, limits, and guard-bands; enable first-silicon bring-up and device characterization; drive yield, quality, and test-cost optimization; collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability; leverage data and AI/ML for predictive probe and test optimization.

Lead electrical construction engineering for semiconductor fab projects across design, construction, commissioning, and handover. Ensure compliance with standards, manage cost/schedule/risk, resolve technical construction issues, coordinate contractors and consultants, support sustainability and BKMs, and apply AI tools to improve engineering analysis and project delivery.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Lead a global multi-discipline facilities engineering team for semiconductor Chemical & Gas systems across U.S. and Asia. Own engineering design, construction, commissioning, operations, and maintenance for greenfield FAB projects and sustaining activities. Drive global standardization, reliability, performance, sustainability, continuous improvement, KPI management, stakeholder collaboration, and team development while supporting site technical problem solving and program implementation.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

Develop and execute reliability stress tests, qualification plans, and test flows for HBM products. Drive DPM reduction, perform root-cause analysis using EFA/PFA, recommend process conversions for HVM, manage qualification risks, collaborate cross-functionally, make technical prioritization decisions, and embed AI/ML tools (Python, JMP, Claude) into reliability workflows to improve analytics and automation.

The role involves developing and optimizing advanced packaging assembly processes, ensuring quality improvements, coordinating with stakeholders, and supporting technology transfers to manufacturing.

Lead Fab10 electrical and control engineering for safe, reliable semiconductor facility operations. Manage team performance, HVAC/PDU/HV-MV-LV power systems, PLC/SCADA, predictive maintenance, asset management, and obsolescence strategies. Support capacity expansions, tool installs, contractor oversight, energy efficiency, and adoption of AI/ML and digital technologies to improve reliability and operational excellence.

The role involves leading reliability tests for HBM products, addressing issues in performance and quality, and collaborating across teams for process improvements.

Develop and deploy product-disposition workflows and deviation alert systems using statistical tools and ML/AI to improve yield, reliability, and quality. Build algorithms for data mining, pattern recognition, and wafer/die screening. Collaborate with Fab, design, and quality teams, mentor team members, and drive technical innovation to meet KPIs like quality, cost, cycle time, and scale.

Lead and grow the Notification Platform engineering team to design, build, and operate a resilient, high-throughput, low-latency event-driven notification system (SMS, Email, Push). Drive architecture, hands-on distributed-systems guidance, Kafka/event-pipeline management, cross-team collaboration, production troubleshooting, and platform adoption while ensuring engineering quality and scalability.

Lead the Media Health Reliability team in developing reliability tests, driving reliability improvements, and collaborating cross-functionally to ensure product quality and performance.

Lead water and waste construction engineering across full project lifecycle for semiconductor fabs. Review designs, resolve construction issues, manage cost/schedule/risk, coordinate contractors/consultants, support commissioning, sustainability, and standardization of best practices while using AI-assisted tools to optimize performance.

The role focuses on developing product disposition solutions, enhancing yield and reliability through data analysis, and mentoring team members while collaborating across teams.