Top Engineering Jobs in Singapore

The Staff Engineer will lead chemical system design for construction projects, provide technical support, and align operational initiatives across regional facilities. Responsibilities include driving operational excellence, improving utility quality, and implementing maintenance programs while collaborating with various teams to achieve sustainability goals.

The Senior Manager will develop global TIQ strategy, lead materials cost engineering, manage TIQ programs, and mentor teams to optimize semiconductor manufacturing costs and processes.

The Senior Manager oversees construction projects in Singapore, leading teams, managing scope, schedule, and costs while coordinating with various stakeholders to ensure project execution and resolution of conflicts.

Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.

The Global FE Planning Modeling Engineer optimizes manufacturing processes, analyzes capital impacts, and leads network tool utilization strategies within a multi-functional team environment.

Manage cross-functional teams to oversee product development, from concept to manufacturing. Enhance process efficiency and support product documentation and regulatory certifications.

Lead a regional Specialist Field Engineering team to design, deploy, and optimize large-scale, GPU-accelerated AI/cloud-native environments. Partner with Sales, Product, and Support to drive technical go-to-market strategy, support strategic accounts from POC to production, align capacity and data center operations, and channel field feedback into product and operational improvements.

The role involves coordinating improvements in DRAM/NAND process yield, quality, and output by analyzing data, designing experiments, and collaborating with cross-functional teams.

The role involves integrating AI tools, managing new product introductions, analyzing yields, and collaborating across teams in semiconductor engineering.

The Engineer, Process Development will support NPI through process qualification, data analysis for improvements, and cross-functional collaboration in semiconductor packaging.

The role involves collaborating with cross-functional teams to develop NAND products, integrating AI solutions, and ensuring timely delivery of technology with strategic partners in various departments.

Lead and manage New Product Introduction (NPI) activities as a Product Owner, collaborating with cross-functional teams to achieve business objectives, ensuring timely product start-up, and owning the product lifecycle from NPI to EOL.

Develop and execute reliability stress tests and qualification plans for HBM products, drive DPM reduction through optimized test flows, perform root-cause analysis using EFA/PFA, recommend process conversions for yield and cost improvements, manage qualification risks, lead cross-functional collaboration, mentor team members, and make technical prioritization decisions to ensure product reliability and manufacturability.

Coordinate improvements in yield, quality, and output for DRAM/NAND processes. Collaborate with teams to analyze data, optimize processes, and troubleshoot fabrication issues.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

Develop and deploy product-disposition workflows and deviation alert systems using statistical tools and ML/AI to improve yield, reliability, and quality. Build algorithms for data mining, pattern recognition, and wafer/die screening. Collaborate with Fab, design, and quality teams, mentor team members, and drive technical innovation to meet KPIs like quality, cost, cycle time, and scale.

The role involves enhancing DRAM/NAND process yields through collaboration, data analysis, and experimental design, ensuring quality and reliability in production.

Perform setup, qualification, preventive maintenance, calibrations, electrical/mechanical troubleshooting, rebuilds, modifications and repairs of R&D lab equipment. Maintain equipment records and inventory, follow safety/lockout procedures, support audits, prioritize customer requests, and collaborate with cross-functional teams to deliver timely solutions.

Lead water and waste construction engineering across full project lifecycle for semiconductor fabs. Review designs, resolve construction issues, manage cost/schedule/risk, coordinate contractors/consultants, support commissioning, sustainability, and standardization of best practices while using AI-assisted tools to optimize performance.

Own probe strategy and silicon learning from pre-silicon staging through first-silicon bring-up to HVM. Define probe coverage, limits, guard-bands, and test flows; drive yield, quality, and test-cost outcomes. Collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability. Perform device characterization, failure analysis, and data-driven optimization using analytics and AI to enable manufacturable, scalable probe solutions.

Lead the development of reliability test flows and reduce DPM while managing cross-functional collaboration to enhance HBM product quality and efficiency.

Provide technical leadership and field expertise for chemical and slurry facilities systems across global semiconductor sites. Develop and standardize global systems, specifications, and BKMs; support design, construction, cost/schedule estimates, and operations; lead global programs including sustainability and AI/digital initiatives; benchmark best practices; and travel internationally to support projects and site activities.

Lead and develop a high-performing team for Package Engineering focusing on HBM product quality, yield improvement, and cross-functional collaboration, while mentoring team members and driving innovation.

Lead the Media Health Reliability team in developing reliability tests, driving reliability improvements, and collaborating cross-functionally to ensure product quality and performance.

Lead development and delivery of wafer/cube probe test solutions for HBM devices across NPI to HVM. Drive probe test plans, ATE program development, silicon debug, data-driven yield improvements, probe hardware validation, cost and test-time optimization, and cross-functional alignment. Mentor engineers and standardize probe practices to ensure production readiness and sustained issue closure.