Top Engineering Jobs in Singapore

The role involves enhancing DRAM/NAND process yields through collaboration, data analysis, and experimental design, ensuring quality and reliability in production.

Client-facing solutions engineer for Aladdin/eFront focused on pre-sales, RFP/RFI responses, product demonstrations, scoping technical solutions, coordinating internal resources, and communicating client feedback to Product. Works closely with sales, services and product teams and supports marketing events; requires alternatives/private equity domain expertise.

Develop and deploy machine learning models, predictive analytics, and agentic AI solutions for semiconductor manufacturing and engineering. Build scalable data pipelines and ML workflows using large-scale manufacturing datasets to improve yield, quality, reliability, cycle time, and cost. Integrate AI agents with enterprise platforms, mentor Citizen Data Scientists, lead technical initiatives, and support production deployment, MLOps, innovation, and AI adoption across Product Engineering.

Lead a team of five Solutions Engineers supporting Enterprise and SME sales across EMEA. Oversee technical pre-sales, product demonstrations, solution design, RFP responses, customer integrations, and successful go-lives. Partner with sales, product, engineering, legal, operations, and senior customer stakeholders. Manage team performance, resource allocation, OKRs, processes, and complex customer solution projects while helping scale the global Solutions Engineering function.

Intern will analyze NAND wafer probe and device-level test data, evaluate yield trends and failure signatures, optimize test coverage and efficiency, and develop AI-enabled analytics or automation solutions. Responsibilities include statistical analysis, anomaly detection, data visualization, technical reviews, and collaboration with design, manufacturing, reliability, and test engineering teams. The intern will deliver technical recommendations, an analytical prototype or workflow, and a final report and presentation.

Leads Micron’s HBM Product System Engineering and Media Health Manufacturing team. Responsibilities include manufacturing test-flow development and validation, test coverage optimization, yield improvement, circuit debugging, reliability qualification, cost and test-time reduction, root-cause resolution, DFT strategy, and cross-functional product development. The role also involves technical decision-making, innovation, project leadership, mentoring, and team development for next-generation HBM products.

Develop, deploy, and support wafer probe equipment and processes for global semiconductor manufacturing, with emphasis on HBM. Evaluate equipment and probe cards, establish standardized processes, engage suppliers, analyze manufacturing data, define equipment specifications, resolve production issues, and support high-volume manufacturing integration. The role collaborates with global manufacturing, test, process engineering, and quality teams while driving continuous improvement and responsible use of AI-enabled tools.

Develop an AI-enabled application, analytical model, or automated workflow addressing a semiconductor process or equipment engineering challenge. Analyze manufacturing and engineering data using statistics, machine learning, Generative AI, large language models, visualization, or automation. Test, validate, document, and present the solution, demonstrating potential improvements in yield, quality, cost, productivity, or cycle time.

Supports semiconductor device, package, wafer, and HBM reliability testing, failure analysis, debugging, laboratory operations, inventory, logistics, audits, safety, and continuous improvement. Uses AI-assisted tools, automation, data analysis, dashboards, and digital transformation to improve reliability operations. Requires rotating day/night shifts and collaboration with cross-functional teams, with opportunities to mentor junior technicians.

Supports semiconductor HBM reliability, device/package/wafer testing, failure analysis, product debugging, laboratory operations, inventory and logistics, audits, safety compliance, automation, data analysis, and continuous improvement. Uses AI-assisted tools, Power BI, Python, SQL, and manufacturing systems to improve reliability workflows and debug efficiency. Requires rotating day/night shifts, including occasional weekends and public holidays, and collaborates with cross-functional teams while mentoring junior technicians.

Develop Python automation tools and AI-enabled engineering solutions using Generative AI, LLMs, AI assistants, and agentic workflows. Build reusable integrations and analytics capabilities, evaluate proof-of-concept solutions, document findings, analyze performance, and present recommendations. Collaborate with cross-functional engineering teams in a semiconductor test environment while gaining experience in software development, workflow orchestration, APIs, version control, and RAG.

Develop an AI-enabled automation solution for low-yield analysis in semiconductor memory testing. The intern will study test operations, manufacturing systems, test methodologies, data flows, and lot-disposition processes; apply programming, analytics, visualization, and AI tools; validate improvements in efficiency, accuracy, and consistency; and document findings through a final report and presentation.

Lead the reliability testing and process improvement for HBM products, ensuring quality and efficiency while mentoring team members and managing projects.

Maintain and support R&D engineering lab equipment through setup, qualification, preventive maintenance, calibration, troubleshooting, rebuilding, modifications, and upgrades. Document equipment activity, manage product tracking and inventory, respond to customer requests, support audits, follow safety procedures, and collaborate with engineering teams. Identify automation opportunities and use AI tools to improve productivity.

Leads HBM product system engineering and manufacturing test development for next-generation memory products. Responsibilities include test coverage optimization, product validation, circuit debugging, yield improvement, cost and test-time reduction, root-cause analysis, DFT strategy, technical decision-making, cross-functional collaboration, and team mentorship. The role also drives innovation, project execution, and productivity improvements using AI tools.

Drive manufacturing execution and product engineering for next-generation HBM products. Responsibilities include test flow development and validation, optimized test coverage, circuit debug, yield improvement, test-time reduction, reliability enhancement, cost reduction, and design-for-test strategy. The role supports product validation using CAD tools and Verilog simulations, resolves manufacturing and quality issues, collaborates cross-functionally, mentors engineers, and makes technical decisions on risk and project priorities.

Leads multiple hardware engineering teams and managers developing high-performance networking platforms. Owns technical strategy, architecture through mass production, quality, reliability, cost, budgets, schedules, and delivery. Partners with program management, manufacturing, supply chain, executives, suppliers, and outsourced development partners. Responsibilities include organizational design, hiring, talent development, performance management, succession planning, process improvement, and strategic technology direction.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Five-month internship developing AI and machine learning solutions for semiconductor facilities engineering. Responsibilities include analyzing operational and sensor data, building predictive maintenance and anomaly-detection prototypes, creating dashboards and automation workflows, and developing AI-enabled knowledge-management tools. The intern will collaborate with facilities engineers, apply software-engineering principles, document findings, and present recommendations and business value.

Supports NAND product development from silicon through system integration. Responsibilities include translating business and SSD requirements into qualification specifications, developing AI-enabled data workflows, coordinating technology, design, fabrication, assembly, test, quality, supply chain, and business teams, and managing product qualification priorities. The role leads reviews, cross-functional meetings, capability assessments, and resolution of NAND-system issues to enable timely customer product qualification.

Leads HBM product engineering reliability teams responsible for reliability test development, qualification execution, DPM reduction, failure analysis, root-cause resolution, manufacturing test optimization, and process conversions. Collaborates with fabrication, technology development, design, quality, and system teams to improve yield, cost, cycle time, quality, and product reliability. Provides technical decisions, risk management, project leadership, mentoring, and innovation while supporting HBM products across DRAM, interface die, and stacked components.

Leads a team developing and productionizing predictive, machine learning, deep learning, and GenAI solutions for semiconductor manufacturing and HBM product engineering. Responsibilities include yield and reliability modeling, large-scale data pipelines, MLOps, model monitoring and drift control, distributed analytics, deployment, and engineering decision support. The role also requires mentoring engineers, setting technical direction, collaborating cross-functionally, and translating model outputs into improvements in quality, cost, cycle time, and manufacturing efficiency.

Participate in functional and design validation of advanced NAND products using silicon and simulation platforms. Develop test cases, automation scripts, and engineering tools; analyze performance, timing, and power characteristics; investigate failures through log review and root-cause analysis; and document findings in technical reports and presentations.

Leads pre-sales solution engineering for Mastercard issuer loyalty products across Singapore and Southeast Asia. Acts as the technical advisor and solution designer for sales teams, supporting product demonstrations, technical discovery, RFIs/RFPs, integration analysis, solution documentation, stakeholder approvals, and handoffs to delivery. Partners with product teams on customer insights, competitive intelligence, go-to-market execution, and roadmap strategy.

Leads functional and design validation for advanced NAND products using silicon and simulation platforms. Develops deterministic tests, random sequence generators, and automation frameworks in C, Python, and Perl. Performs electrical failure analysis, root-cause investigations, and cross-functional issue resolution. Uses Verilog, Synopsys VCS, dashboards, data analytics, and AI/ML techniques to improve validation coverage, test efficiency, defect triage, and debug productivity.