Top Engineering Jobs in Singapore

Leads functional and design validation for advanced NAND products using silicon and simulation platforms. Develops deterministic tests, random sequence generators, and automation frameworks in C, Python, and Perl. Performs electrical failure analysis, root-cause investigations, and cross-functional issue resolution. Uses Verilog, Synopsys VCS, dashboards, data analytics, and AI/ML techniques to improve validation coverage, test efficiency, defect triage, and debug productivity.

Internship focused on semiconductor process integration, device reliability, and data-driven improvement for NAND, DRAM, and HBM manufacturing. The intern will study process interactions, failure mechanisms, yield, reliability, and manufacturing data while gaining exposure to analytics, automation, dashboards, and AI/ML tools. Deliverables include technical documentation, analysis reports, improvement evaluations, and an analytics or automation demonstration. The role involves collaboration across process, manufacturing, yield, product, and failure analysis teams.

Interns will develop AI-enabled and digital solutions for semiconductor failure analysis workflows. Responsibilities include analyzing laboratory metrics and engineering datasets, creating dashboards and automation tools, exploring AI and knowledge-management applications, collaborating with Test Engineering stakeholders, and presenting project findings. The role provides exposure to electrical and physical failure analysis, semiconductor manufacturing, data analytics, workflow automation, and engineering decision-making.

Five-month internship focused on SSD depanel process characterization and optimization in semiconductor manufacturing. Responsibilities include executing statistical Design of Experiments, analyzing process and equipment data, identifying variation sources, establishing operating windows, developing visualizations, collaborating with engineering stakeholders, and evaluating AI-enabled tools for automated analysis, anomaly detection, reporting, and knowledge capture.

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

The MTS/Principal Engineer leads WET process development for NAND technology, conducting experiments, supporting process integration, and mentoring junior staff, while collaborating across teams to drive innovation and optimize processes.

Lead global teams for HBM customer integration and system engineering, drive technical interlocks, design reviews, escalations, and integration. Partner with design, product, manufacturing to translate customer requirements into product solutions. Own HBM architecture, packaging, manufacturing, customer enablement, scalable engagement models, governance, and executive communications. Resolve complex technical issues and influence product roadmaps. Develop and deploy AI systems to automate processes and solve technical challenges.

Supports semiconductor HBM reliability, device/package/wafer testing, failure analysis, product debugging, laboratory operations, inventory and logistics, audits, safety compliance, automation, data analysis, and continuous improvement. Uses AI-assisted tools, Power BI, Python, SQL, and manufacturing systems to improve reliability workflows and debug efficiency. Requires rotating day/night shifts, including occasional weekends and public holidays, and collaborates with cross-functional teams while mentoring junior technicians.

Five-month internship developing AI and machine learning solutions for semiconductor facilities engineering. Responsibilities include analyzing operational and sensor data, building predictive maintenance and anomaly-detection prototypes, creating dashboards and automation workflows, and developing AI-enabled knowledge-management tools. The intern will collaborate with facilities engineers, apply software-engineering principles, document findings, and present recommendations and business value.

Develops, evaluates, qualifies, and deploys automated semiconductor packaging equipment. Responsibilities include defining equipment requirements, benchmarking suppliers, managing capital requests and purchasing specifications, establishing qualification criteria, transferring equipment to production, maintaining equipment maturity and capability records, enabling automation and process-control systems, and supporting supplier improvement initiatives and continuous improvement projects.

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

Analyze and improve yield during High Bandwidth Memory new product introduction, from first silicon through early high-volume manufacturing. Responsibilities include yield monitoring, excursion management, defect breakdown, failure analysis coordination, yield deviation analysis, dashboard maintenance, SPC/FDC monitoring, and identifying improvement opportunities. The engineer collaborates with process integration, process engineering, manufacturing, quality, and data analysis teams while applying AI-assisted tools and data-driven problem-solving methods.

Supports semiconductor device, package, wafer, and HBM reliability testing, failure analysis, debugging, laboratory operations, inventory, logistics, audits, safety, and continuous improvement. Uses AI-assisted tools, automation, data analysis, dashboards, and digital transformation to improve reliability operations. Requires rotating day/night shifts and collaboration with cross-functional teams, with opportunities to mentor junior technicians.

This internship involves assisting in machine learning development, AI automation, data engineering, and exploring innovative projects to enhance test efficiency and engineering productivity.

Develop and optimize advanced semiconductor packaging assembly processes, including wafer-level packaging, wafer bonding, and die stacking. Evaluate equipment and materials, establish process parameters, improve yield and quality, reduce costs, and implement process controls. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams to transition technologies from development through high-volume manufacturing. Use statistical analysis, automation, defect analysis, and AI-enabled tools to support process improvement and production readiness.

Client-facing solutions engineer for Aladdin/eFront focused on pre-sales, RFP/RFI responses, product demonstrations, scoping technical solutions, coordinating internal resources, and communicating client feedback to Product. Works closely with sales, services and product teams and supports marketing events; requires alternatives/private equity domain expertise.

Develop and deploy advanced semiconductor packaging technologies for high-performance memory products. Drive package integration, yield and quality improvements, cost reduction, process control, data analytics, and manufacturing readiness. Collaborate with process, product, assembly, test, reliability, and quality teams from technology development through high-volume production. Create process and model-of-record documentation and use Python, R, SQL, Visual Basic, and semiconductor control systems to analyze data and improve integration flows.

Develop and optimize wafer-level semiconductor packaging processes, including wafer thinning and backside metal interconnects. Evaluate equipment and materials, establish process parameters, improve quality and yield through SPC, DOE, defect analysis, and advanced controls, and coordinate technology transfers from development through high-volume manufacturing. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams while documenting process and model records. Apply AI-enabled tools to improve analysis, efficiency, and operational outcomes.

Develop AI-enabled automation workflows for NAND device characterization and engineering data analysis. Build data pipelines, machine learning models, anomaly detection tools, dashboards, AI assistants, and automated reporting solutions using large-scale semiconductor datasets. The role involves applying data science, generative AI, LLMs, and agentic AI to improve engineering productivity and decision-making while collaborating with cross-functional engineering teams.

Lead the Site Reliability Engineering team focusing on network infrastructure, ensuring performance, capacity, and reliability of Mastercard applications, and leading incident reviews and proactive issue detection.

Lead data-driven process and test integration initiatives to improve high-value-bits yield (PG2+). Develop models and monitoring for tool performance, equipment prognostics, and test optimization. Prototype solutions with cross-functional teams, deploy best-known-methods to production, and integrate AI-assisted tools to drive continuous improvement and operational excellence.

The role involves developing reliability test flows, managing qualification plans, driving innovation, mentoring team members, and ensuring project execution through cross-functional collaboration.

Develop an AI-enabled automation solution for low-yield analysis in semiconductor memory testing. The intern will study test operations, manufacturing systems, test methodologies, data flows, and lot-disposition processes; apply programming, analytics, visualization, and AI tools; validate improvements in efficiency, accuracy, and consistency; and document findings through a final report and presentation.

Develop, deploy, and support wafer probe equipment and processes for global semiconductor manufacturing, with emphasis on HBM. Evaluate equipment and probe cards, establish standardized processes, engage suppliers, analyze manufacturing data, define equipment specifications, resolve production issues, and support high-volume manufacturing integration. The role collaborates with global manufacturing, test, process engineering, and quality teams while driving continuous improvement and responsible use of AI-enabled tools.

Leads Micron’s HBM Product System Engineering and Media Health Manufacturing team. Responsibilities include manufacturing test-flow development and validation, test coverage optimization, yield improvement, circuit debugging, reliability qualification, cost and test-time reduction, root-cause resolution, DFT strategy, and cross-functional product development. The role also involves technical decision-making, innovation, project leadership, mentoring, and team development for next-generation HBM products.