Top Engineering Jobs in Singapore

The role involves reliability test program coding, root cause analysis, innovation promotion, cross-functional collaboration, data analysis, technical decision-making, project management, and mentorship for product system engineering.

Lead the reliability testing and process improvement for HBM products, ensuring quality and efficiency while mentoring team members and managing projects.

As an AI/Data Science Intern in NAND Device Engineering, you will develop AI-driven automation workflows, intelligent decision-support tools, and data pipelines to enhance engineering processes in NAND technology.

Senior Engineer for Water within Global Facilities Engineering provides technical leadership for UPW, WWT, and waste chemical systems across global semiconductor sites. Develops standards, supports design and construction, drives standardization and sustainability programs, applies AI/digital tools for optimization, and leads reliability and capacity initiatives.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

Provide technical leadership and field expertise for chemical and slurry facilities systems across global semiconductor sites. Develop and standardize global systems, specifications, and BKMs; support design, construction, cost/schedule estimates, and operations; lead global programs including sustainability and AI/digital initiatives; benchmark best practices; and travel internationally to support projects and site activities.

Lead manufacturing test development and validation for next-generation HBM products. Drive test coverage optimization, yield improvement, DFT strategy, reliability, and test-time reduction. Perform circuit debug and cross-functional execution with Fab, design, and test teams while mentoring others and making technical risk/prioritization decisions to enable scalable, cost-effective production.

Lead development and delivery of wafer/cube probe test solutions for HBM devices across NPI to HVM. Drive probe test plans, ATE program development, silicon debug, data-driven yield improvements, probe hardware validation, cost and test-time optimization, and cross-functional alignment. Mentor engineers and standardize probe practices to ensure production readiness and sustained issue closure.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.

Lead and manage New Product Introduction (NPI) activities as a Product Owner, collaborating with cross-functional teams to achieve business objectives, ensuring timely product start-up, and owning the product lifecycle from NPI to EOL.

Lead development of reliability stress flows, test plans, and qualification execution for HBM products. Drive DPM reduction via optimized test strategies, perform root-cause analysis (EFA/PFA), recommend process conversions for HVM, manage risk with product leads, mentor engineers, and collaborate cross-functionally with fab, design, and quality teams.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Lead and mentor a backend engineering team to design, build, and operate a distributed, multi-currency wallet and transaction engine focused on scalability and financial accuracy. Drive technical decisions, collaborate with product and cross-functional teams, improve observability and testing, and explore AI-driven productivity enhancements.

Lead and mentor an engineering team building a distributed, multi-currency wallet and transaction engine. Provide hands-on technical leadership, design and implement scalable, accurate financial systems, collaborate with product and engineering teams, and improve productivity and observability (including exploring AI opportunities).

Lead the IAM and Account Infrastructure team to design, build, and scale identity, authentication/authorization, and account systems. Drive engineering excellence, security, high availability, and data-driven product decisions while collaborating with product, design, and global engineering teams.

Lead and grow the Notification Platform engineering team to design, build, and operate a resilient, high-throughput, low-latency event-driven notification system (SMS, Email, Push). Drive architecture, hands-on distributed-systems guidance, Kafka/event-pipeline management, cross-team collaboration, production troubleshooting, and platform adoption while ensuring engineering quality and scalability.

Lead and manage multiple engineering teams across Transfers, Client Treasury, and GTPN Infrastructure to define technical vision, deliver high-quality payment and treasury products, remove blockers, collaborate with product and design, measure product performance using data, and scale global payment infrastructure.

Lead the technical direction and delivery of automated regulatory reporting: design data pipelines, submission tooling, AI-assisted review, ensure data quality and auditable reports, manage a team of backend/frontend engineers, and partner with Compliance, Legal, Finance, and Core Banking platform teams.

Lead a Singapore-based team to design, build, and maintain scalable data infrastructure and self-service developer tooling. Implement robust, maintainable systems, ensure quality through testing and troubleshooting, collaborate cross-functionally, and mentor engineers while staying current with emerging technologies.

Lead a global multi-discipline facilities engineering team to provide mechanical system ownership and technical support across semiconductor manufacturing sites. Oversee greenfield fab design and construction, ensure standards, compliance, cost and schedule control, and drive innovation, reliability, and sustainability. Coach and develop staff, coordinate with global stakeholders, and support global initiatives, capacity planning, and operations sustaining activities.

The role involves enhancing DRAM/NAND process yields through collaboration, data analysis, and experimental design, ensuring quality and reliability in production.

The role involves collaborating with cross-functional teams to develop NAND products, integrating AI solutions, and ensuring timely delivery of technology with strategic partners in various departments.

Lead a global multi-discipline facilities engineering team for Electrical and I&C across Micron manufacturing sites. Oversee design through operations for greenfield FAB projects and sustaining activities, drive global standardization, innovation, reliability, and sustainability. Manage project delivery, construction oversight, stakeholder collaboration, technical problem solving, KPI tracking, and team development. Frequent international travel to site projects (50-60%).

This role involves developing and executing reliability test flows, managing qualification processes, analyzing device issues, collaborating on process conversions, and promoting innovation in product engineering within cross-functional teams.

The role involves developing wafer-level process conditions, enhancing equipment capabilities, advocating for new materials, ensuring quality improvements, and facilitating collaboration across teams.