Top Engineering Jobs in Singapore

Engineers at Citadel work in small teams to develop high-performing technology under quick cycles. They focus on creating tools for trading strategies and data research platforms.

This internship involves assisting in machine learning development, AI automation, data engineering, and exploring innovative projects to enhance test efficiency and engineering productivity.

Own probe strategy and silicon learning from pre-silicon staging through first-silicon bring-up to HVM. Define probe coverage, limits, guard-bands, and test flows; drive yield, quality, and test-cost outcomes. Collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability. Perform device characterization, failure analysis, and data-driven optimization using analytics and AI to enable manufacturable, scalable probe solutions.

Lead probe strategy and silicon learning from pre-silicon staging through first-silicon bring-up and HVM. Define probe coverage, limits, and guard-bands using silicon characterization. Collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability to drive yield, quality, cost, and test-efficiency improvements. Enable NPI, perform device characterization, root-cause analysis, and apply data/AI for probe and test optimization.

The role involves leading data analytics initiatives to improve yield and quality, developing algorithms, enhancing data infrastructure, and collaborating with cross-functional teams to drive innovation in HBM product engineering.

The role involves managing BIM processes, maintaining model accuracy, facilitating construction coordination, performing QA/QC checks, and supporting project teams with BIM data and training.

Lead advanced data analytics and ML initiatives to improve yield, quality, and reliability for HBM products. Develop ML/DL models, build data infrastructure, integrate solutions into disposition workflows, mentor team members, and collaborate cross-functionally to optimize KPIs including quality, cost, cycle time, and scale.

Lead reliability test flow and qualification for HBM products: develop stress tests, drive DPM reduction, root-cause failures via EFA/PFA, recommend process conversions for HVM, collaborate cross-functionally, and apply AI/ML to reliability datasets while mentoring engineers and prioritizing risk and project decisions.

The Probe Product Engineer defines probe coverage strategy, manages silicon learning, and collaborates with teams for probe solutions ensuring yield, quality, and cost efficiency throughout the product lifecycle.

Lead the development of reliability testing for HBM products at Micron, manage teams, improve processes, and drive innovation while collaborating with cross-functional teams.

Perform setup, qualification, preventive maintenance, calibration, troubleshooting, rebuilding, and upgrades for R&D equipment in engineering laboratories. Maintain equipment records, inventory, and documentation; respond to customer requests; support audits; follow laboratory safety procedures; and collaborate with cross-functional engineering teams. The role also identifies automation opportunities and uses AI tools to improve productivity.

Lead and grow engineering teams that build and operate card issuing, transaction processing, and settlement platforms. Provide people leadership, technical and architectural direction, ensure reliability, scalability, observability, and compliance, drive platform improvements, and collaborate with product and operations to deliver high-impact systems.

The PI Engineer drives process integration for HBM products during NPI, collaborating cross-functionally to ensure readiness and resolve issues while leveraging AI tools for efficiency.

Provide strategic and technical leadership for construction engineering governance and Asia regional support for large-scale semiconductor fab programs. Define standards, playbooks, and execution methodologies; lead constructability reviews, commissioning readiness, and multi-discipline teams; support design integration, cost/schedule input, risk mitigation, and global stakeholder alignment to ensure safe, consistent, and high-quality facility delivery.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.

Own probe strategy and silicon learning at wafer test from pre-silicon to high-volume manufacturing. Define probe coverage, limits, and guard-bands; enable first-silicon bring-up and device characterization; drive yield, quality, and test-cost optimization; collaborate with Design, DFT, DV, Process Integration, Backend Test, and Reliability; leverage data and AI/ML for predictive probe and test optimization.

Lead electrical construction engineering for semiconductor fab projects across design, construction, commissioning, and handover. Ensure compliance with standards, manage cost/schedule/risk, resolve technical construction issues, coordinate contractors and consultants, support sustainability and BKMs, and apply AI tools to improve engineering analysis and project delivery.

Lead package/product engineering for High Bandwidth Memory (HBM): drive yield and DPM reduction via test coverage, electrical and physical failure analysis, root-cause resolution, cross-functional projects, and technical/people leadership including mentoring and decision-making on risk and priorities.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Lead mechanical construction engineering for global semiconductor facility projects across design, construction, commissioning, and operations. Provide technical support, review designs, manage scope/schedule/cost/quality, resolve construction issues, support estimating and business cases, coordinate cross-functional teams, drive continuous improvement and sustainability, and integrate AI-assisted tools into engineering workflows.

The role involves developing and optimizing advanced packaging assembly processes, ensuring quality improvements, coordinating with stakeholders, and supporting technology transfers to manufacturing.

Lead Fab10 electrical and control engineering for safe, reliable semiconductor facility operations. Manage team performance, HVAC/PDU/HV-MV-LV power systems, PLC/SCADA, predictive maintenance, asset management, and obsolescence strategies. Support capacity expansions, tool installs, contractor oversight, energy efficiency, and adoption of AI/ML and digital technologies to improve reliability and operational excellence.

The role involves leading reliability tests for HBM products, addressing issues in performance and quality, and collaborating across teams for process improvements.

Develop and deploy product-disposition workflows and deviation alert systems using statistical tools and ML/AI to improve yield, reliability, and quality. Build algorithms for data mining, pattern recognition, and wafer/die screening. Collaborate with Fab, design, and quality teams, mentor team members, and drive technical innovation to meet KPIs like quality, cost, cycle time, and scale.

The role focuses on developing product disposition solutions, enhancing yield and reliability through data analysis, and mentoring team members while collaborating across teams.