Top Process Engineer Jobs in Singapore

The FE Central Quality Process Engineer will lead new product quality risk assessments and deploy quality control systems while supporting improvements in semiconductor manufacturing processes.

Design and implement process solutions to improve next-generation 3D NAND yield and quality. Lead cross-functional teams, define CSPEC, coordinate manufacturing experiments, transfer R&D to production, and support ramp-up and qualification while integrating AI-assisted tools.

Execute and support thin-film ALD/CVD process development for advanced NAND cell-film modules. Run experiments, analyze data, document findings, support equipment qualification and troubleshooting, and assess process impacts on device behavior, yield, and reliability. Collaborate with senior, equipment, and integration engineers while developing expertise in materials, chemistry, vacuum systems, process physics, and semiconductor fabrication.

Lead wet-process equipment and process development to improve yield, quality, cost, and sustainability. Drive tool startup, qualification, CIP roadmaps, defect reduction, IoT sensor integration, AI-assisted process improvements, supplier collaboration, and root-cause analysis across global fab sites.

Develops and optimizes semiconductor fabrication processes and equipment to improve yield, quality, reliability, cost, cycle time, and productivity. Responsibilities include setting process parameters, troubleshooting manufacturing issues, conducting root-cause and failure analyses, qualifying new processes and equipment, managing process improvements, analyzing statistical data, supporting audits, and collaborating with material suppliers. The engineer also uses AI-enabled tools responsibly to improve operational effectiveness.

Coordinates process improvements for NAND Flash manufacturing, focusing on yield, quality, reliability, and output. Designs and analyzes experiments, investigates process and quality issues, interprets complex data, and collaborates with process, equipment, production, industrial engineering, and global teams. Leads cross-functional efforts, supports process alignment across fabs, and uses AI-assisted tools to improve operational efficiency and decision-making.

Drive manufacturing performance and yield improvement for backend assembly and test by applying statistical and data-driven analysis. Identify root causes, lead cross-functional corrective actions, maintain Pareto analyses, and integrate AI-assisted tools to improve quality, reliability, and production issue resolution in high-volume semiconductor manufacturing.

Supports contamination control and process engineering in semiconductor fabrication. Responsibilities include responding to alerts, sampling Fab and FOUP environments, investigating contamination issues, monitoring systems, enforcing cleanroom protocols, optimizing process conditions, configuring semiconductor equipment parameters, evaluating materials and equipment, and driving continuous improvement through special projects and AI-enabled tools.

Coordinates process improvements for NAND Flash production, focusing on yield, quality, reliability, and output. Responsibilities include designing and analyzing experiments, investigating yield and quality issues, interpreting complex fab data, optimizing processes, communicating module issues, and leading cross-functional engineering initiatives. The role collaborates with production, process and equipment engineering, industrial engineering, technology development, and global partner teams while using AI-assisted tools to improve efficiency and operational outcomes.

Identifies and resolves semiconductor process and equipment issues; leads equipment qualification, process optimization, yield improvement, cost reduction, and new process validation. Manages supplier quality and audits, supports manufacturing controls, and maintains MES databases. Analyzes process data, identifies improvement opportunities, collaborates cross-functionally, and applies statistical methods, automation, and AI-enabled tools in manufacturing operations.

Responsible for semiconductor fab process and equipment start-up, development, optimization, yield and quality improvement, cost reduction, and productivity enhancement. Troubleshoots complex manufacturing issues using failure analysis, FMEA, 8D, SPC, and root cause analysis. Establishes process parameters, evaluates new equipment and materials, supports process qualifications, manages audits, and collaborates with suppliers. Uses AI-enabled tools and data analysis to improve process effectiveness and manufacturing outcomes.

Develops and optimizes semiconductor manufacturing process control systems to improve yield, quality, reliability, productivity, and cost. Responsibilities include data analysis, modeling, SPC, APC, FDC, process and equipment evaluation, baseline qualification, supplier coordination, control solution implementation, training, and network-wide Industry 4.0 deployment. The role uses machine learning, IIoT, deep learning, and big data platforms to identify process variation and implement smart manufacturing solutions.

Design and implement advanced process control, automation, and analytics solutions for semiconductor manufacturing. Collaborate with process teams, apply statistical analysis and machine learning to improve yields, maintain global control applications, and deliver training while promoting continuous improvement and responsible use of AI tools.

Develops, optimizes, characterizes, and qualifies photolithography processes for advanced NAND nodes. The role applies experimentation, process modeling, DOE, AI, machine learning, and advanced analytics to improve yield, defectivity, overlay, critical dimensions, reliability, and process windows. Responsibilities include evaluating lithography equipment and materials, supporting technology transfer and manufacturing ramp, resolving integration challenges, collaborating globally, communicating technical findings, and contributing to patents and technical methodologies.

Develops and improves semiconductor fabrication processes for advanced memory products. Investigates process interactions, yield, quality, and production issues through data analysis, diagnostics, and designed experiments. Collaborates with engineering, quality, planning, technology development, and global fab teams to implement improvements, support technology transfers, and communicate technical findings. Uses AI-assisted tools responsibly to improve efficiency and problem-solving.

Develop, deploy, and sustain process control systems (SPACE SPC, Applied E3, MES/MAM/RMS) for Assembly & Test. Configure SPC/FDC models, ensure equipment-to-host connectivity (SECS/GEM), govern OCAP/recipes, monitor metrics, perform RCA, automate tasks with SQL/Python, and maintain audit-ready documentation while collaborating with cross-functional teams.

The Principal Engineer coordinates advanced thin film process development for NAND memory technology, focusing on innovation, technical strategy, and team leadership.

Identify and resolve semiconductor manufacturing process and equipment issues; optimize processes, materials, tools, yield, and costs; support equipment qualification, process validation, audits, and new product introductions. Manage MES data, analyze trends, and support SPC, FDC, RMS, and APC systems. Collaborate cross-functionally with engineering, operations, quality, and suppliers while applying AI-enabled tools and continuous improvement methods.

Develop and optimize CMP processes for 3D NAND parts, focusing on product quality and reliability, while managing complex projects and mentoring team members.

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

The engineer will enhance manufacturing performance through yield analysis and data analytics, applying knowledge of semiconductor processes to identify and resolve issues.

Own and improve semiconductor reliability laboratory processes, including qualification, implementation, monitoring, troubleshooting, and continuous improvement. Lead technicians, root-cause analysis, corrective actions, process controls, data analysis, and automation initiatives. Develop specifications, SOPs, control plans, and reaction plans while partnering with Operations, Equipment, Quality, Product, and Engineering teams to ensure reliable, compliant, and efficient process execution.

Lead innovation and development of dry etch processes, manage equipment roadmaps, mentor engineers, and collaborate across teams for NAND technology.

Leads process integration and yield enhancement for next-generation 3D NAND products. Responsibilities include identifying technology gaps, improving process flows, developing integration schemes, defining process specifications, coordinating manufacturing experiments, transferring technologies from R&D to production, supporting ramp-up and qualification, and leading cross-functional yield reviews. The role also applies AI and analytics to optimize workflows and enable data-driven decisions. Extended travel to the United States may be required for collaborative R&D.

The role focuses on improving RDA tools and processes in semiconductor manufacturing, managing logistics, supporting operations, and driving performance metrics.