Top Process Engineer Jobs in Singapore

The Senior Process Engineer will lead manufacturing campaigns, develop operating instructions, troubleshoot quality issues, ensure adherence to GMP standards, and collaborate with cross-functional teams to improve processes.

Design, monitor and improve pharmaceutical manufacturing processes to ensure GMP, quality, EHS and data integrity. Lead production campaigns, troubleshoot process issues, develop SOPs, train technicians, drive continuous improvements and support cross-functional investigations and transfers.

Lead development, qualification, and manufacturing transfer of advanced packaging (hybrid bonding, TCB, flip chip). Design and analyze DOEs, perform process characterization, root-cause analysis, and yield/reliability improvement. Collaborate cross-functionally, evaluate materials/equipment, apply AI/automation and analytics, and support sample builds and supplier engagements toward high-volume readiness.

Lead development, characterization, integration, and qualification of wafer-level advanced packaging processes (hybrid bonding, TCB, flip chip). Drive process and equipment selection, data-driven yield and quality improvements (SPC, DOE, FDC), and transfer technologies to high-volume manufacturing while collaborating across materials, equipment, reliability, design, manufacturing, and quality teams.

Lead and support pharmaceutical manufacturing campaigns and NPI technical transfers. Develop SOPs and manufacturing instructions, maintain process control recipes, troubleshoot quality and EHS issues, implement preventive measures and process improvements, train plant personnel, and coordinate with engineering, quality, and external subject-matter experts to ensure safe, compliant production and successful material release.

Optimize test processes, tools, and AI-enabled solutions to improve product quality and operational efficiency. Lead process characterization, problem resolution (excursions, RMAs), new process/equipment qualification, and high-volume product integration. Drive continuous improvement across quality, cycle time, delivery, and cost using analytics, automation, and AI. Ensure QMS compliance and participate in projects delivering digital and smart manufacturing solutions.

The F10 Probe Process Engineer will define and maintain probe process recipes, collaborate with teams for system configuration, and support automation in probe operations.

The FE Central Quality Process Engineer will lead new product quality risk assessments and deploy quality control systems while supporting improvements in semiconductor manufacturing processes.

The Principal Engineer leads wet process development for NAND memory technology, driving experiments, cross-functional collaboration, and innovation in process solutions.

The Staff Engineer supports advanced NAND technology deployment by optimizing wet processes, managing experiments, and collaborating cross-functionally to enhance yield and quality.

Lead dry etch process development for NAND modules, overseeing complex projects, driving technology roadmaps, and mentoring peers in specialized skills.

Lead technical strategy for NAND thin film processes, develop and integrate advanced film technologies, mentor engineers, and drive technology transitions to manufacturing.

The Senior Engineer develops advanced dry etch processes for 3D NAND technology, optimizing recipes and enhancing yield and quality through cross-functional collaboration and analysis.

Manage end-to-end reliability stress tests and package qualification (thermal cycling, HAST, CSAM, HTOL, etc.). Maintain process of record, lead equipment qualification, define control plans, analyze performance data, drive continuous improvements, and integrate AI-enabled reporting and automation with lab systems.

Lead development and optimization of wet etch unit processes for advanced NAND, drive experiments and DoE, integrate processes with cross-functional teams, troubleshoot yield/quality issues, evaluate hardware, generate IP, implement process monitoring/control, and collaborate globally including suppliers while incorporating AI-assisted tools.

The Principal Engineer coordinates advanced thin film process development for NAND memory technology, focusing on innovation, technical strategy, and team leadership.

Lead cross-functional semiconductor process integration efforts to improve fab yield and reliability. Design, run, and analyze experiments, collaborate with global fab teams, communicate module issues, and standardize best-known methods to optimize processes and forecast yield and output.

Develop and sustain real-time defect analysis monitoring for advanced packaging and semiconductor manufacturing. The role integrates process, equipment, automation, and manufacturing data to improve tool stability, process control, equipment performance, and NPI readiness. Responsibilities include creating SPC/FDC/RDA rules and diagnostics, supporting tool qualification and ramp activities, analyzing performance metrics, resolving excursions, reducing recovery time, standardizing monitoring practices, and driving continuous improvement across site and global teams.

This role involves leading NAND technology integration, solving technology gaps, designing experiments, and driving technical innovation in memory solutions.

Responsible for improving yield, quality, and output in NAND Flash production, coordinating with teams, and analyzing process experiments.

The Process & Equipment Engineer will enhance semiconductor processes, focusing on development, yield improvement, cost reduction, and troubleshooting complex issues.

Responsible for semiconductor process start-up, development, optimization, and equipment parameterization to improve yield, quality, cost, and cycle time. Diagnose and resolve complex process issues using failure analysis, FMEA, 8D, SPC and DOE, run evaluations and qualifications for new equipment/materials, and integrate AI-assisted tools to drive continuous improvement and productivity gains.

Lead process integration efforts for next-generation 3D NAND: identify yield gaps, develop process solutions, coordinate R&D-to-manufacturing transfers, run experiments, support ramp and qualification, and apply AI to optimize workflows and decisions.

The PI Engineer drives process integration for HBM products during NPI, collaborating cross-functionally to ensure readiness and resolve issues while leveraging AI tools for efficiency.

This role involves optimizing semiconductor processes and equipment, improving production efficiency, resolving process issues, and integrating AI tools for better outcomes.