Top Process Engineer Jobs in Singapore

Analyze NAND structural integration using inline characterization data to correlate structural parameters with probe yield and device performance. Define inline monitoring specifications, collaborate across process areas, produce a technical report, and present findings to stakeholders.

The role involves leading a semiconductor dry etch team, managing process technology development, ensuring product quality, mentoring team members, and driving operational efficiency improvements.

The Senior Engineer supports photolithography process development by executing optimization tasks, conducting statistical analyses, documenting results, and collaborating with cross-functional teams.

The Staff Engineer in Process Development focuses on optimizing thin film processes and ensuring integration readiness, while mentoring junior engineers and driving continuous improvement through AI tools.

The role involves leading lab enablement, maintaining reliability test processes, analyzing performance data, and partnering with Automation Engineers for improvements.

The Principal Engineer leads advanced photolithography development, defining technology roadmaps, mentoring engineering teams, and driving innovation for semiconductor processes.

Responsible for leading product manufacturing, developing operating instructions, troubleshooting process issues, and ensuring safety and quality standards.

The role involves optimizing NAND module processes, leading cross-functional teams, developing solutions to improve product yield and quality, and managing technology transfer from R&D to manufacturing.

Provide on-site customer support for semiconductor equipment installations, diagnostics, service and repair. Develop and optimize thin-film processes (CVD, ALD, PVD, RIE, anneal, implant), design experiments, analyze statistical data, perform root cause analysis, and collaborate with customers and R&D to resolve complex process issues.

Lead development and support of flip chip assembly for silicon photonics, including DOE, material qualification, reliability validation, failure analysis, SPC, and NPI documentation to improve yield and manufacturability.

The Engineer, Process Development will support NPI through process qualification, data analysis for improvements, and cross-functional collaboration in semiconductor packaging.

Owns 3D IC and advanced-package process integration, including TSV and hybrid-bond interfaces, 3D-aware floorplanning, DFM rules, thermal and SI/PI signoff, DFT strategy, and package/substrate co-design. Coordinates foundry, memory-partner, and OSAT deliverables, milestones, yield, reliability, and integration risks through tapeout and assembly. The role establishes 3D integration methodology for high-power AI/HPC products.

Develop and optimize optical active alignment processes for photonic transceiver production. Operate, control, qualify, and buy off alignment equipment; develop alignment algorithms; manage epoxy dispensing and curing; design alignment fixtures; troubleshoot production issues; and collaborate with R&D and manufacturing teams to improve yield, quality, documentation, and continuous improvement.

Leads process engineering support for medical device manufacturing, including automation projects, equipment upgrades, maintenance, calibration, validation, and continuous improvement. Improves machine uptime, yield, output, quality, process capability, and OEE while managing engineering resources, capital expenditures, risk assessments, and compliance. Collaborates with production, technical teams, suppliers, plants, and regulatory stakeholders to maintain safe, efficient, and compliant operations.

Lead development, optimization, and transfer of wafer fabrication processes (thin-film deposition, wafer thinning, thermal processes, implantation) to meet yield, quality, cost, and reliability targets. Drive yield improvement, defect reduction, DOE/SPC experiments, root-cause analysis, and process transfer to high-volume manufacturing. Collaborate cross-functionally, mentor junior staff, and manage supplier process and material improvements.

Lead development, optimization, and transfer of wafer fab processes (thin film, wafer thinning, thermal). Drive yield improvement and defect reduction using SPC/DOE/FMEA, perform root-cause analysis and corrective actions, define control plans and OCAP, support NPI and high-volume transfer, collaborate cross-functionally, mentor junior staff, and interface with suppliers.

Provide on-site customer support and system service for semiconductor equipment, develop and optimize plating and other process flows, design and analyze DOEs, perform statistical data analysis, troubleshoot and perform root cause analysis, and lead small projects while mentoring junior staff.

Develop and optimize optical alignment and assembly processes for photonic products from prototype through NPI and volume manufacturing. Responsibilities include active and passive alignment, epoxy dispensing and curing, equipment qualification, DOE, process characterization, statistical capability analysis, root-cause investigation, yield improvement, documentation, DFM/DFA support, and manufacturing transfer. The engineer will collaborate with R&D, manufacturing, suppliers, quality teams, and contract manufacturers to establish robust processes and production controls.

Manage end-to-end reliability stress tests and package qualification (thermal cycling, HAST, HTS, CSAM). Maintain process of record and SOP adherence, qualify equipment/layout changes, define process windows and control plans, and drive continuous improvement. Collaborate with Quality, NPI, Product and Equipment Engineering. Analyze process data using statistical and AI-assisted techniques, integrate AI tools responsibly, and ensure compliance with quality, audit, and EHS requirements.

Lead R&D and operations in advanced metrology processes, develop methods for accuracy and precision, and mentor engineers in a semiconductor manufacturing context.

Lead development, qualification, and supplier management for FR4/PCB substrates (mSAP/Any-Layer HDI). Drive DFM/DFT/DFR, quality control, failure analysis, reliability testing, and support packaging production (SMT, die attach, wire bond, alignment). Interface across design, manufacturing, and global suppliers.

Develop, qualify, and sustain photolithography and etch processes for III-V wafer fabrication. Establish process windows, qualify materials and equipment, perform DOE and statistical analysis, support manufacturing and yield improvement, troubleshoot process excursions, and maintain process control documentation (WI, PFMEA, OCAP, recipes, ECO).

Own and improve wafer-level testing operations, including process development, qualification, production execution, process control, yield improvement, failure debugging, data analysis, documentation, and cycle-time optimization. Lead continuous improvement using DOE, SPC, Six Sigma, and root-cause analysis while collaborating with engineering, quality, supply chain, and manufacturing partners to support product qualification and production ramp.

Lead lithography process development for photonics and power semiconductor platforms within a 200mm fab. Responsibilities include establishing and qualifying processes, troubleshooting process issues, improving stability, robustness, quality, margins, and cost, coordinating with equipment, integration, and customer engineering teams, tracking project milestones, training engineers, and deputizing for the lithography process section manager.

Lead development and optimization of photolithography processes, define specifications, drive process innovations, and collaborate with teams for technology transfer.