Top Tech Jobs & Startup Jobs in Singapore

The Failure Analysis Engineer investigates failures of optical transceivers, troubleshooting using schematics and test equipment, documenting results, and collaborating with cross-functional teams to improve product reliability.

Lead cross-functional programs across silicon, photonics, packaging, bring-up, validation, and system delivery. Create and execute project plans, manage risks and schedules, coordinate vendors and partners, and communicate status to leadership to drive product readiness on aggressive timelines.

Lead reliability and qualification for photonic components (silicon photonics, lasers, SiPs). Define/execute qualification plans to Telcordia/JEDEC standards, run accelerated life tests, failure analysis, predictive modeling, and supplier qualification. Collaborate across R&D, packaging, manufacturing, and supply chain to enable NPI and production transfers, and produce reliability reports and risk assessments.

Manage supplier quality relationships, define quality requirements, conduct audits, and improve supplier performance through structured reviews and corrective actions.

The Director of FP&A will lead financial planning, operational KPIs, and analysis for Lumilens, collaborating with R&D and business leaders to strengthen financial discipline in a fast-paced environment.

The Epoxy Engineer will develop and optimize epoxy formulations, troubleshoot adhesive failures, support manufacturing scale-up, ensure reliability, and provide global technical support.

The Silicon Test Engineer develops test solutions for silicon photonics and semiconductor products, optimizing test processes, collaborating with teams, and ensuring production readiness.

The Director/Sr. Director of Controlling leads corporate controllership across APAC, managing consolidations, statutory reporting, SOX compliance, and audit relations while partnering with finance and operations.

The Component Engineer is responsible for ensuring the quality, performance, and reliability of electronic components, supporting production and testing, coordinating with internal teams and vendors, and preparing technical documentation for products.

Lead development and support of flip chip assembly for silicon photonics, including DOE, material qualification, reliability validation, failure analysis, SPC, and NPI documentation to improve yield and manufacturability.