Top Engineering Jobs in Singapore

Lead and mentor an engineering team building a distributed, multi-currency wallet and transaction engine. Provide hands-on technical leadership, design and implement scalable, accurate financial systems, collaborate with product and engineering teams, and improve productivity and observability (including exploring AI opportunities).

Lead and manage multiple engineering teams across Transfers, Client Treasury, and GTPN Infrastructure to define technical vision, deliver high-quality payment and treasury products, remove blockers, collaborate with product and design, measure product performance using data, and scale global payment infrastructure.

Lead a Singapore-based team to design, build, and maintain scalable data infrastructure and self-service developer tooling. Implement robust, maintainable systems, ensure quality through testing and troubleshooting, collaborate cross-functionally, and mentor engineers while staying current with emerging technologies.

The internship involves supporting production engineering by monitoring equipment, troubleshooting, participating in investigations, and ensuring compliance with manufacturing practices.

Lead a global multi-discipline facilities engineering team for semiconductor Chemical & Gas systems across U.S. and Asia. Own engineering design, construction, commissioning, operations, and maintenance for greenfield FAB projects and sustaining activities. Drive global standardization, reliability, performance, sustainability, continuous improvement, KPI management, stakeholder collaboration, and team development while supporting site technical problem solving and program implementation.

Lead a global multi-discipline facilities engineering team for semiconductor water and waste systems across U.S. and Asia. Oversee design, construction, operations, and sustaining activities for greenfield fabs; drive standardization, reliability, sustainability, cost control, capacity planning, and continuous improvement while mentoring staff and collaborating with cross-functional stakeholders.

Lead a global multi-discipline facilities engineering team to provide mechanical system ownership and technical support across semiconductor manufacturing sites. Oversee greenfield fab design and construction, ensure standards, compliance, cost and schedule control, and drive innovation, reliability, and sustainability. Coach and develop staff, coordinate with global stakeholders, and support global initiatives, capacity planning, and operations sustaining activities.

Lead a global multi-discipline facilities engineering team for Electrical and I&C across Micron manufacturing sites. Oversee design through operations for greenfield FAB projects and sustaining activities, drive global standardization, innovation, reliability, and sustainability. Manage project delivery, construction oversight, stakeholder collaboration, technical problem solving, KPI tracking, and team development. Frequent international travel to site projects (50-60%).

Lead the Site Reliability Engineering team focusing on network infrastructure, ensuring performance, capacity, and reliability of Mastercard applications, and leading incident reviews and proactive issue detection.

Develop and execute reliability stress tests and qualification plans for HBM products, drive DPM reduction through optimized test flows, perform root-cause analysis using EFA/PFA, recommend process conversions for yield and cost improvements, manage qualification risks, lead cross-functional collaboration, mentor team members, and make technical prioritization decisions to ensure product reliability and manufacturability.

Evaluate, select, qualify, and hand over advanced semiconductor assembly and packaging equipment. Drive equipment benchmarking, automation enablement (FDC, APC, IoT, AMHS), maintain equipment capability matrices (EMI, TOR), collaborate with suppliers and production for continuous improvement, and support documentation, training, and production readiness.

The role involves developing reliability test programs and collaborating with various teams on HBM products, focusing on coding, testing, data analysis, and process improvements.

The role involves developing reliability test flows, executing test plans, managing quality qualifications, conducting root cause analysis, and collaborating across teams to optimize product reliability and performance.

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

Coordinate improvements in yield, quality, and output for DRAM/NAND processes. Collaborate with teams to analyze data, optimize processes, and troubleshoot fabrication issues.

The Engineer will drive the execution of Media Health manufacturing for next-gen HBM products, focusing on testing, validation, yield improvement, and cross-functional collaboration.

This role includes driving Media Health manufacturing execution for HBM products, ensuring test coverage, improving yields, and collaborating with cross-functional teams.

The role involves managing BIM processes, maintaining model accuracy, facilitating construction coordination, performing QA/QC checks, and supporting project teams with BIM data and training.

Develop and deploy product disposition solutions, utilize data analysis for yield improvement, create deviation alert systems, and mentor team members while promoting innovation through AI and ML.

Lead global product strategy and roadmap for Razer's PC gaming mice, driving innovation, market relevance, and user experience through cross-functional collaboration.

Lead the reliability and performance of payment infrastructure, assess service quality, drive automation, and collaborate with cross-functional teams to ensure high availability and observability.

Manage cross-functional teams to oversee product development, from concept to manufacturing. Enhance process efficiency and support product documentation and regulatory certifications.

The Engineering Director will lead software engineering teams, set technical direction, ensure product quality, and foster innovation and collaboration.

Early-career engineer supporting NAND package and silicon integration. Assist CPI assessments, DFMEA/PFMEA, wafer dicing/singulation investigations, DOEs and test vehicles, yield and manufacturability problem solving, and prepare technical documentation under mentorship.

Lead and develop a high-performing team to enhance package and HBM product engineering activities, focusing on quality, cost, and cycle time improvements while collaborating across various teams.