Top Design Jobs in Singapore

Leads mechanical design and development of precision electro-mechanical, fluidic, optical, and thermal subsystems for DNA sequencing instruments. Responsibilities include requirements definition, subsystem specifications, mechanical and thermal analysis, tolerance optimization, verification testing, risk analysis, outsourced manufacturing coordination, project scheduling, and product transfer to manufacturing. The role requires cross-functional collaboration, supplier management, and resolution of manufacturing and field issues.

Lead verification of digital and mixed-signal SoC designs. Develop block, subsystem, and chip-level test plans; implement scalable UVM/SystemVerilog testbenches; write C-based SoC tests; apply power-aware CPF/UPF flows; automate randomized testing and scoreboards; debug, perform root-cause analysis, track coverage metrics, and collaborate with design and software teams to deliver chips to spec.

Manages creative and packaging design accounts from briefing through delivery, serving as the primary client liaison and coordinating internal creative and production teams. Responsibilities include project scheduling, budget and scope control, quality reviews, status reporting, capacity planning, invoicing support, profitability reporting, and identifying account growth opportunities. The role requires strong project management, branding knowledge, communication skills, and business-level Japanese and English proficiency. It is onsite in Tokyo.

Lead system and subsystem integration, testing, characterization, and specification activities for semiconductor inspection systems. Define architectures, create test plans, resolve complex optical-mechanical and system issues, and support manufacturing and field service teams. Deliver technical training, maintain documentation, coordinate cross-functional projects, report progress and risks, and contribute to product strategy and roadmap alignment. Requires an advanced technical degree and preferably more than three years of relevant experience, with up to 20% international travel.

Own core product surfaces from concept through launch, creating high-fidelity coded prototypes and improving the coss ui design system. Collaborate asynchronously with product and design engineering, emphasizing accessibility, web standards, interaction details, evidence-based decisions, and reusable component architecture. Frame hypotheses, measure outcomes, document decisions, incorporate critique, and deliver prototypes that engineers can implement directly.

Leads end-to-end ATE test hardware development for wafer sort and final test, including architecture, schematic design, PCB layout, SI/PI analysis, validation, debugging, release, and production support. Partners with engineering, operations, quality, procurement, suppliers, and manufacturing teams to deliver high-performance hardware. Establishes design methodologies, manages technical risks and initiatives, mentors engineers, and drives supplier capability and continuous improvement across semiconductor test programs.

Manage optical alignment equipment and methodologies for wafer inspection tools, improve optical integration yield and predictability, troubleshoot manufacturing issues, resolve supplier quality problems, support quality and purchasing improvements, and ensure manufacturing readiness through design reviews.

Designs, sustains, debugs, and troubleshoots PCBs, power supplies, electronic test fixtures, and board-level subsystems. Performs failure analysis and root-cause investigations across analog, digital, and mixed-signal electronics. Supports engineering validation, manufacturing improvements, corrective actions, ECO execution, and technical documentation. Collaborates with vendors and global cross-functional teams while communicating technical findings, risks, and project status.

Supports manufacturing, integration, and sustaining of electronic subsystems and assemblies. Troubleshoots PCB, wiring, and system-level issues; performs root-cause analysis; implements corrective actions; improves yield, reliability, quality, and cost; develops manufacturing documentation; supports validation and qualification testing; resolves supplier issues; and manages engineering changes across the product lifecycle.

Supports production builds, system integration, manufacturing ramp, and sustaining engineering for electrical systems. Troubleshoots electronic and system-level issues, performs root cause analysis, implements corrective actions, and develops manufacturing documentation. Collaborates with design, quality, supply chain, suppliers, and contract manufacturers. Supports validation, qualification, reliability testing, engineering changes, yield improvement, cost reduction, and continuous improvement initiatives.

Lead physical design and implementation for complex SoC and SerDes/interconnect designs from RTL through GDSII tapeout. Responsibilities include floorplanning, power and clock planning, place-and-route, PPA optimization, timing, power, noise, EM/IR-drop analysis, physical verification, signoff, IP integration, flow automation, and methodology development.

Validate HBM design and test modes through simulation, lab and ATE analysis, root-cause manufacturing/test issues, collaborate with design, manufacturing, test and quality teams, document architecture per JEDEC, and apply data analysis and AI-enabled improvements to improve product reliability and performance.

Integrate and customize a commercial RISC-V core soft IP, perform RTL (Verilog/SystemVerilog) front-end and control-path modifications, tailor microarchitecture for PPA, support ASIC front-end tasks (synthesis, STA, power, floorplanning), collaborate across performance/middle-end/back-end teams, and contribute to pre- and post-silicon verification and debugging.

Lead a team in verifying complex IC designs, develop verification strategies, and ensure high-quality silicon through advanced methodologies and collaboration.

Develop and execute test plans for digital design verification, manage regressions and coverage, and collaborate with design teams to ensure design correctness.

Develop and execute comprehensive, coverage-driven verification environments using SystemVerilog/UVM. Implement testbenches, run RTL simulations/emulation (Palladium/HAPS/Zebu), debug RTL, maintain regression suites, improve coverage metrics, and document verification results.

Lead mechanical design for consumer electromechanical products from concept through production. Responsibilities include CAD modeling, prototyping, testing, thermal/fluid/structural analysis, cross-functional collaboration, DFM/DFA, tolerance analysis, and manufacturing ramp support in Asia. The role requires designing plastic, metal, and soft goods components integrated with sensors and actuators, supporting high-volume manufacturing, and traveling to China as needed.

Design and evolve OKG’s OKDS design system across foundations, components, templates, and AI tooling. Own design-system initiatives from research through release and adoption, maintain token architecture, create reusable components, partner with engineers across Web, iOS, and Android, and improve AI-assisted design workflows. Drive accessibility, compliance, implementation quality, documentation, migration support, and adoption while tracking reuse, delivery speed, and reduced rework.

Design high-impact motion graphics, animated ads, Lottie and Rive animations, and interactive motion projects for global brands. Collaborate with account teams across time zones, manage multiple projects on time and budget, support creative leads, explore motion innovations and AI-enhanced tools, and help evolve Superside's motion capabilities.

Design, develop, and validate high-speed networking hardware from component selection and schematics through board bring-up, debugging, and production readiness. Perform feasibility studies, signal integrity and power distribution analysis, empirical testing, and root-cause investigations. Collaborate with cross-functional global teams to integrate hardware deliverables and ensure manufacturable, high-performance designs.

Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G. Responsibilities include package layout and routing, high-speed SerDes and RF structures, impedance matching, signal and power integrity, thermal management, manufacturability, reliability, and coordinating multiple projects with global teams and external vendors.

Design and optimize ultra-low-power embedded SRAM and register file IPs, develop/enhance SRAM compilers, implement memory peripheral circuits, perform timing/power/low-voltage characterization, correlate silicon measurements, drive yield improvements, build automation scripts, and support IP integration through production.

Define and implement NAND Flash reliability test flows, perform large-scale statistical analysis and electrical failure analysis, develop countermeasures and qualification controls, collaborate with cross-functional teams, integrate AI-assisted tools, support customer reliability inquiries, and drive strategic reliability initiatives to ensure robust NAND product performance and prevent field escapes.

Manage optical alignment equipment and methodologies for semiconductor wafer inspection tools. Improve optical integration yield and predictability, troubleshoot manufacturing issues, coordinate supplier quality improvements, and support cost reductions. The role requires hands-on assembly, alignment, calibration, integration, and testing of opto-mechanical systems, plus manufacturing procedure development, team leadership, problem solving, and 25% international travel.

Manage optical alignment equipment and methodologies for semiconductor wafer inspection tools. Improve optical integration yield and predictability, troubleshoot manufacturing issues, resolve supplier quality problems, support cost reduction initiatives, participate in design reviews, and ensure product manufacturing readiness. The role also develops manufacturing procedures and leads teams assembling, aligning, calibrating, and testing opto-mechanical systems.