Top Tech Jobs & Startup Jobs in Singapore

The role involves developing and optimizing advanced packaging equipment, improving quality assurance processes, and collaborating with various teams to enhance manufacturing capabilities.

Leads validation strategy and technical direction for advanced HBM products. Responsibilities include defining coverage, debugging silicon and circuit failures, performing electrical failure analysis, interpreting timing-accurate simulations, developing ATE test programs, automating workflows, optimizing test execution, and partnering with design, reliability, and systems teams. The role also mentors engineers, influences cross-functional decisions, presents technical findings, and applies AI-enabled tools to accelerate validation and root-cause analysis.

Build and productionize machine learning models for semiconductor quality and manufacturing processes. Develop agentic AI, LLM, retrieval-augmented generation, tool-use, and memory capabilities for predictive quality workflows. Create maintainable analytical pipelines, optimize performance and token efficiency, and support testing, deployment, and monitoring. Communicate analytical findings to technical and non-technical stakeholders while applying AI tools responsibly.

Develops and optimizes semiconductor manufacturing process control systems to improve yield, quality, reliability, productivity, and cost. Responsibilities include data analysis, modeling, SPC, APC, FDC, process and equipment evaluation, baseline qualification, supplier coordination, control solution implementation, training, and network-wide Industry 4.0 deployment. The role uses machine learning, IIoT, deep learning, and big data platforms to identify process variation and implement smart manufacturing solutions.

Develop and sustain real-time defect analysis capabilities for advanced packaging and semiconductor manufacturing. Translate process and equipment knowledge into SPC, FDC, alarms, diagnostics, dashboards, scripts, and automation logic. Support equipment bring-up, qualification, NPI, pilot, ramp, and high-volume manufacturing readiness. Analyze performance metrics, identify failure modes and chronic issues, support root cause analysis, improve tool stability and reliability, and standardize monitoring strategies across sites through cross-functional collaboration.

Design, develop, and deploy software and system solutions for semiconductor manufacturing to improve productivity, yield, and quality. Integrate AI-powered analytics and automation, build user interfaces and databases, manage enterprise applications, lead projects, mentor teammates, and collaborate with vendors and stakeholders to commission and maintain reliable production systems.

Lead global teams for HBM customer integration and system engineering, drive technical interlocks, design reviews, escalations, and integration. Partner with design, product, manufacturing to translate customer requirements into product solutions. Own HBM architecture, packaging, manufacturing, customer enablement, scalable engagement models, governance, and executive communications. Resolve complex technical issues and influence product roadmaps. Develop and deploy AI systems to automate processes and solve technical challenges.

Drive 3D NAND technology integration, roadmap development, architecture enablement, and end-to-end R&D validation. Apply semiconductor device physics, process integration, experiment design, data analytics, AI-assisted modeling, and cross-functional collaboration to solve scaling challenges, improve performance and yield, and develop manufacturable memory technologies.

Qualifies semiconductor packaging materials, performs testing and failure analysis, manages supplier quality issues, drives corrective actions, supports material changes, and maintains laboratory equipment and compliance. Collaborates with manufacturing, quality, suppliers, and global engineering teams to improve cost, quality, delivery, and risk outcomes using statistical and quality tools.

Develops, evaluates, qualifies, and deploys automated semiconductor packaging equipment. Responsibilities include defining equipment requirements, benchmarking suppliers, managing capital requests and purchasing specifications, establishing qualification criteria, transferring equipment to production, maintaining equipment maturity and capability records, enabling automation and process-control systems, and supporting supplier improvement initiatives and continuous improvement projects.