Top Tech Jobs & Startup Jobs in Singapore

Sustains and maintains semiconductor fab support systems, leads technician coverage, improves process conditions and safety interlocks, introduces OEM equipment, manages budgets, analyzes abnormalities, and drives capability, reliability, cost, and continuous-improvement initiatives using RMS, SCADA, monitoring dashboards, and AI-assisted tools.

Develop an Agentic AI planning ecosystem prototype for semiconductor fab space utilization, tool placement, capacity optimization, and scenario-based decision support. Analyze planning workflows and data, design coordinated multi-agent workflows, evaluate optimization trade-offs, document findings, and present recommendations. The internship provides experience in generative AI, LLM applications, operations research, manufacturing planning, data analytics, and cross-functional collaboration.

Lead manufacturing test development and validation for next-generation HBM products. Drive test coverage optimization, yield improvement, DFT strategy, reliability, and test-time reduction. Perform circuit debug and cross-functional execution with Fab, design, and test teams while mentoring others and making technical risk/prioritization decisions to enable scalable, cost-effective production.

Develop foundational components of an Enterprise Metrics Hub for semiconductor process control analytics. Responsibilities include gathering stakeholder reporting requirements, defining KPI documentation, inventorying data sources, designing a common data model, and prototyping Power BI dashboards. The intern will gain experience in business intelligence, data visualization, governance, technical documentation, stakeholder engagement, and AI-enabled analytical workflows.

The HBM PE Principal Component Validation Engineer coordinates with teams on validation needs, troubleshoots failures, provides technical training, and works on enhancing product reliability and quality.

The Fab Process & Equipment Engineer will optimize processes and equipment in semiconductor manufacturing, enhancing yield, quality, and cost efficiency while troubleshooting complex issues.

The Package Health Engineer will develop DFT strategies, conduct simulations for package performance, analyze data for degradation indicators, and collaborate with data scientists for predictive modeling.

Develop and debug reliability test programs for HBM products, collaborate across teams, innovate solutions, and conduct data analysis for validation. Ensure product reliability and efficiency through improved processes and project management.

The Firmware Engineer will develop high-performance firmware for SSDs, conducting testing, debugging, and collaborating with multi-disciplinary teams.

The role involves developing advanced packaging processes, ensuring readiness and transition to production, and collaborating with cross-functional teams to resolve issues.