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Internship opportunity with Applied Materials in Singapore. The role offers exposure to a global semiconductor equipment and materials science company, with opportunities to learn, develop, and contribute in a supportive work environment. This is a full-time intern/student position requiring approximately 10% travel. Relocation is not provided.

Designs, troubleshoots, tests, and modifies PECVD chamber hardware and mechanical systems. Provides root-cause analysis, corrective actions, tooling, fixturing, assembly, installation, procurement, qualification, and chamber maintenance support. Conducts experiments, replicates customer issues, supports configuration conversions and safety reviews, and documents engineering evaluations and qualification results while collaborating with global engineering, operations, and facilities teams.

Develops and maintains manufacturing processes, operating sequences, and methods for parts, assemblies, and finished products. Coordinates product improvements, reduces costs, improves quality, establishes time standards, and recommends tooling. Develops test procedures, evaluates work methods, performs process FMEA, identifies root causes, and implements corrective actions. The role applies lean principles, automation, and continuous improvement in a cleanroom manufacturing environment.

Prepare project plans, coordinate deliverables, monitor cost performance, drive team collaboration, and implement process improvements.

Supports project and program planning, execution, documentation, resource and cost tracking, milestone completion, data collection, and compliance with company policies. The role may involve studying new technologies and working in semiconductor cleanroom environments. Physical duties can include standing, walking, bending, lifting, working in tight spaces, using hand and power tools, and wearing required personal protective equipment.

Supports engineers in developing PVD processes for TSV applications. Performs process optimization, metal film property measurements, data analysis, reporting, hardware characterization, troubleshooting, root cause analysis, and resolution of moderately complex process engineering issues while following safety guidelines.

Coordinates technical projects from planning through implementation, including schedules, budgets, resources, reports, quality metrics, and customer communications. Supports process improvements, supplier coordination, executive reporting, and cross-functional problem solving using 8D methodology. Requires Applied Materials customer engineering experience, familiarity with Applied products, customer-facing skills, and proficiency with SAP, Copilot, and Teamcenter. International travel to customer sites may reach 25%.

Designs, analyzes, troubleshoots, and documents mechanical systems, tooling, fixtures, layouts, and specifications for semiconductor equipment. Performs FEA, thermal, flow, and tolerance analyses; leads engineering tests and projects; develops suppliers; coordinates component procurement, manufacturing, assembly, and installation; and resolves complex mechanical issues throughout the product life cycle.

Designs and optimizes semiconductor and display manufacturing processes through experiments, data analysis, hardware characterization, film measurement, troubleshooting, and root cause analysis. The role produces technical documentation, supports customers, collaborates with vendors and suppliers, and implements new technologies and instrumentation for semiconductor packaging research and development.

Designs, modifies, tests, and troubleshoots electrical and electronic assemblies, schematics, layouts, and equipment for semiconductor manufacturing systems. Responsibilities include engineering analysis, test report generation, product release documentation, component procurement and assembly coordination, resolving technical issues, and developing electrical solutions and specifications.