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The Process Engineer is responsible for optimizing processes to enhance product quality and reliability, improve yield, reduce costs, and resolve manufacturing issues in the semiconductor industry.

The Engineer, Real Time Defect Analysis will enhance process capability, manage projects, perform root cause analysis, and ensure product specifications are met within the semiconductor industry.

The Engineer in Equipment Development supports R&D for advanced 3D NAND technology through equipment installation, optimization, and collaboration across teams, ensuring timely deployment and safety in operations.

Develop and optimize metrology recipes for semiconductor processes, establish inspection methodologies, analyze data for improvements, and collaborate with teams to ensure quality control.

The role involves managing defect monitoring equipment, data analysis, vendor relations, project management, and providing training and mentoring in a semiconductor environment.

Coordinate with teams to ensure silicon meets product expectations, debug issues, validate equipment, and provide technical training.

As a Senior/Principal NAND Module Process Integration Engineer, you will enhance process solutions for 3D NAND Product Yield, integrate technology, and lead cross-functional teams to develop innovative solutions while supporting R&D efforts.

The role involves developing metrology recipes, optimizing processes, conducting in-line inspections, analyzing data, and collaborating with multiple teams for performance improvement in semiconductor manufacturing.

The Engineer, Scenario Planning will develop scenario models, analyze data, collaborate with teams, and present insights for decision-making.

The role involves validating high bandwidth memory designs, collaborating with multi-functional teams, and debugging hardware and software in a lab environment.