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The Supply Manager will focus on innovative memory and storage solutions to enhance operational excellence and customer experience.

The Product Integration Lead is responsible for integrating HBM products into system requirements, managing technical alignment and resolution of issues, and collaborating across teams to meet customer demands.

The role involves process module ownership in CMP, developing next-gen NAND technology, leading projects, and collaborating globally.

Lead the execution of HBM products through all phases by managing cross-functional teams, schedules, and risk while ensuring product development aligns with company objectives.

As a Product Integration Lead, you will manage HBM product integration, drive development priorities, resolve technical issues, and ensure alignment with system requirements.

As a NAND Design Rule Engineer, drive next-gen NAND development, ensuring quality in design rule releases and collaborating with multiple teams while addressing process issues.

Guide HBM products through concept to production by leading cross-functional teams, managing schedules, and ensuring project alignment and communication.

Support the Receiving team by streamlining operations through automation, analyzing workflows, developing automation tools, and integrating systems.

Manage global high-volume manufacturing projects, leading cross-functional teams and initiatives in photolithography and metrology, ensuring alignment with business objectives while fostering innovation and communication.

The Principal Engineer will lead efforts in process integration and yield enhancement in semiconductor manufacturing, optimizing performance and collaborating across teams.