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Top Tech Jobs & Startup Jobs in Singapore
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Artificial Intelligence • Hardware • Information Technology • Machine Learning
The role involves developing reliability test programs and collaborating with various teams on HBM products, focusing on coding, testing, data analysis, and process improvements.
Top Skills:
C++Python
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Investigate semiconductor yield, quality, and technology issues through electrical and physical failure analysis. Use EMMI, OBIRCH, thermal analysis, SEM, FIB, TEM, and nanoprobing to isolate failures, determine root causes, and improve memory product yield. Collaborate with engineering and R&D teams on process and design improvements, technology introduction, product qualification, yield ramp, and high-volume manufacturing. Develop analytical methods and support continuous improvement initiatives.
Top Skills:
Ai-Enabled ToolsEmmiFibNanoprobingObirchSemSemiconductor DevicesSemiconductor Manufacturing ProcessesTemThermal Analysis
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Supports 24x7 advanced semiconductor packaging operations during NPI and early production ramps. Monitors equipment health, SPC/FDC alerts, alarms, process excursions, and operational metrics; performs first-pass troubleshooting and root cause analysis; documents shift events and handovers; supports tool installation, qualification, recovery, and stabilization; and deploys RDA capabilities, dashboards, scripts, and monitoring logic. Collaborates with Process, Equipment, NPI, Automation, IT, and global RDA teams to improve equipment reliability, data integrity, and manufacturing readiness.
Top Skills:
Advanced Packaging EquipmentAi-Assisted ToolsDashboardsFab It SystemsFault Detection And Classification (Fdc)Manufacturing AutomationRdaScriptingStatistical Process Control (Spc)
Reposted YesterdaySaved
Artificial Intelligence • Hardware • Information Technology • Machine Learning
The DMTS will lead CMP technology development, overcoming complex challenges and mentoring teams while shaping process innovations and strategy.
Top Skills:
Artificial IntelligenceChemical EngineeringCmpElectrical EngineeringMaterials ScienceNandPhysics
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead PAC business processes and projects at Micron, aiming for best-in-class performance, while supporting global teams and driving continuous improvements.
Top Skills:
EngineeringManufacturing TechnologyProject Management
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Artificial Intelligence • Hardware • Information Technology • Machine Learning
Owns NAND Flash memory test programs from development through production release. Develops wafer and package functional test strategies, improves yield and reliability through test optimization and data analysis, reduces test time, and ensures readiness for new product introduction and high-volume manufacturing. Collaborates with test, production, process, and engineering teams while applying programming, semiconductor, analytical, and AI-assisted problem-solving skills.
Top Skills:
Ai-Assisted ToolsCC++Nand FlashPackage TestingPythonSemiconductor Functional TestingUnix/LinuxWafer Testing
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Facilities Operations Technicians ensure safe operation of facilities equipment, monitor systems, respond to issues, and support maintenance activities, including drafting SOPs and coordinating with teams.
Top Skills:
MS Office
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead the NAND product development team, focusing on driving product development strategies, cross-functional collaboration, and adoption of AI-enabled workflows to enhance performance and execution.
Top Skills:
Ai PlatformsData-Driven ApproachesNand Technology
Reposted YesterdaySaved
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Lead technical authority in 3D NAND cell film development, overseeing multi-functional projects, technical strategy, mentorship, and advanced process development.
Top Skills:
3D NandAldCvdEdxEelsSimsTdsTemXps
Artificial Intelligence • Hardware • Information Technology • Machine Learning
Performs electrical and physical failure analysis on semiconductor advanced packaging products. Prepares samples, conducts cross-sectioning, decapsulation, polishing, microscopy, and analytical testing using SEM/EDX, FIB, X-ray, and C-SAM equipment. Documents findings in technical failure analysis reports, maintains laboratory equipment and safety compliance, and supports quality systems and continuous improvement initiatives.
Top Skills:
C-SamEdxFibMS OfficeOptical MicroscopySemX-Ray
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