Top Tech Jobs & Startup Jobs in Singapore

Own optical transceiver manufacturing readiness and product execution from development through high-volume production. Lead NPI, product transfers, contract manufacturer qualification, yield improvement, quality and reliability efforts, BOM accuracy, testing, failure analysis, corrective actions, documentation, and cost reduction. Collaborate with design, process engineering, quality, suppliers, and contract manufacturers to launch and scale 800G and 1.6T products. International travel is required.

Own end-to-end recruitment across technical, manufacturing, operations, and corporate roles in Singapore. Lead high-volume hiring campaigns, partner with contract manufacturers and business leaders, develop sourcing strategies, manage candidate experience and onboarding, monitor recruitment metrics, and advise leadership on workforce planning, talent availability, timelines, and hiring competitiveness. Coordinate across US and APAC time zones and support hiring initiatives at the Bulim Square facility.

Lead and grow a process and manufacturing engineering team for silicon photonics transceivers. Define, prove, and deploy HVM processes, drive continuous improvement, own process documentation and change control, partner with design and contract manufacturers, support qualification testing, champion automation, manage suppliers and capital/equipment selection, and develop staff across global sites.

Lead device and PIC characterization and test execution at bench level, architect high-speed measurements, build and scale lab test infrastructure, automate measurement routines, drive root-cause analysis and yield improvements, transition R&D to production test flows, and mentor junior test engineers while collaborating with design, process, and product teams.

Hands-on engineer executing photonics device and PIC characterization, high-speed measurements, and lab test setup. Develops test automation (LabVIEW/Python), supports wafer probing and optical alignment, troubleshoots instrumentation, analyzes data, and aids transition from R&D to early production test flows.

Lead DFM/DFR for optical transceiver designs across assembly processes (SMT, die attach, wire bonding, flip chip, active alignment, TCB bonding). Assess process capability and risks, engage cross-functionally with design, production, NPI and suppliers, collect and analyze data, and produce reports to drive manufacturing decisions and reliability testing.

Lead development, qualification, and supplier management for FR4/PCB substrates (mSAP/Any-Layer HDI). Drive DFM/DFT/DFR, quality control, failure analysis, reliability testing, and support packaging production (SMT, die attach, wire bond, alignment). Interface across design, manufacturing, and global suppliers.

Support People team in sourcing and screening candidates, coordinate interviews, assist university recruiting and career events, manage onboarding documentation, maintain HR records and trackers, and help with HR operations and benefits coordination for a fast-paced startup.

Design and optimize high-speed silicon photonic devices and PICs (modulators, photodetectors, passive components). Perform multi-domain simulations (EM, circuit, thermal) to meet 200G/lane+ targets. Implement PIC layouts (GDS) using foundry PDKs and support tapeouts. Co-design with electronics and packaging for RF, parasitics, signal integrity, and thermal constraints. Support silicon bring-up, characterize devices, correlate measurement with simulation, drive design iterations, and contribute to design libraries and methodology.

Lead development and support of flip chip assembly for silicon photonic wafers. Design and execute DOE, qualify materials, drive reliability validations, root-cause failure analysis, implement SPC and control plans, and produce SOPs/WIs to support NPI and long-term process stability.