Top Tech Jobs & Startup Jobs in Singapore

Lead device and PIC characterization and test execution at bench level, architect high-speed measurements, build and scale lab test infrastructure, automate measurement routines, drive root-cause analysis and yield improvements, transition R&D to production test flows, and mentor junior test engineers while collaborating with design, process, and product teams.

Hands-on engineer executing photonics device and PIC characterization, high-speed measurements, and lab test setup. Develops test automation (LabVIEW/Python), supports wafer probing and optical alignment, troubleshoots instrumentation, analyzes data, and aids transition from R&D to early production test flows.

Lead DFM/DFR for optical transceiver designs across assembly processes (SMT, die attach, wire bonding, flip chip, active alignment, TCB bonding). Assess process capability and risks, engage cross-functionally with design, production, NPI and suppliers, collect and analyze data, and produce reports to drive manufacturing decisions and reliability testing.

Lead development, qualification, and supplier management for FR4/PCB substrates (mSAP/Any-Layer HDI). Drive DFM/DFT/DFR, quality control, failure analysis, reliability testing, and support packaging production (SMT, die attach, wire bond, alignment). Interface across design, manufacturing, and global suppliers.

Support People team in sourcing and screening candidates, coordinate interviews, assist university recruiting and career events, manage onboarding documentation, maintain HR records and trackers, and help with HR operations and benefits coordination for a fast-paced startup.

Design and optimize high-speed silicon photonic devices and PICs (modulators, photodetectors, passive components). Perform multi-domain simulations (EM, circuit, thermal) to meet 200G/lane+ targets. Implement PIC layouts (GDS) using foundry PDKs and support tapeouts. Co-design with electronics and packaging for RF, parasitics, signal integrity, and thermal constraints. Support silicon bring-up, characterize devices, correlate measurement with simulation, drive design iterations, and contribute to design libraries and methodology.

Lead development and support of flip chip assembly for silicon photonic wafers. Design and execute DOE, qualify materials, drive reliability validations, root-cause failure analysis, implement SPC and control plans, and produce SOPs/WIs to support NPI and long-term process stability.

Develop, qualify, and deploy manufacturing processes for optical transceivers (die attach, wire bond, active alignment, assembly) through high-volume production. Own process documentation, change control, equipment selection and introduction, SPC and yield analysis, failure analysis, and automation. Collaborate with suppliers, contract manufacturers, design, and quality teams; support qualification and reliability testing. International travel required.

Lead development and optimization of optical active alignment processes for transceiver production. Operate, qualify, and maintain alignment equipment; develop and improve alignment algorithms; manage epoxy dispensing/curing and fixture design; perform equipment buyoff; collaborate with R&D and manufacturing to improve yield, troubleshoot equipment and processes, and maintain process documentation for continuous improvement.

Lead material and supply planning for new product introductions from prototype through pilot and design qualification. Translate engineering build plans into material and procurement plans, ensure BOM and component readiness, identify long-lead and single-source risks, track equipment procurement, align materials with CM partners, support ECO-driven plan updates, and deliver planning analytics and supply readiness reporting to cross-functional leadership.