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Coordinates and executes semiconductor tape-out processes, verifies physical and logical design data, ensures compliance with foundry requirements, resolves technical issues with cross-functional teams, and maintains detailed tape-out documentation. The role supports timely delivery of accurate integrated circuit designs to manufacturing and requires semiconductor design-tool experience, precision, and flexibility during critical tape-outs.

Coordinate semiconductor tape-out processes and ensure integrated circuit design data meets foundry manufacturing requirements. Review physical design databases and documentation, resolve discrepancies, collaborate with design and process engineering teams, and maintain detailed records of tape-out procedures and outcomes. The role requires semiconductor design tool experience, strong attention to detail, effective cross-functional communication, and flexibility to support critical tape-outs.

Coordinates semiconductor IC tape-out activities and serves as the final design-data checkpoint before fabrication. Reviews physical and logical design databases, documentation, and foundry requirements; resolves discrepancies with design, process engineering, technology, program management, and manufacturing teams; maintains tape-out records; and supports timely, accurate delivery of manufacturable design data.

Leads end-to-end ATE test hardware development for wafer sort and final test, including architecture, schematic design, PCB layout, SI/PI analysis, validation, debugging, release, and production support. Partners with engineering, operations, quality, procurement, suppliers, and manufacturing teams to deliver high-performance hardware. Establishes design methodologies, manages technical risks and initiatives, mentors engineers, and drives supplier capability and continuous improvement across semiconductor test programs.

Provide global technical leadership across outsourced semiconductor assembly and test sites, driving yield, quality, reliability, productivity, qualification, site transfer, and capacity expansion initiatives. Lead subcontractor assessments, process changes, Safe Launch activities, root-cause investigations, and quality incident resolution. Partner with cross-functional teams on commercialization, supply resilience, and package documentation while advancing AI/ML, Smart Factory, and manufacturing digitalization programs.

The Senior Principal Foundry Engineer will lead product ramp up during new technology introduction, collaborating with foundries and stakeholders to ensure manufacturability, yield improvement, and timely project completion.

Lead yield enhancement for lead products during new technology introductions and foundry transfers. Develop automated yield monitoring, analyze yield data, define enhancement strategies, standardize Best Known Methods, drive foundry improvements, and coordinate with global product and technology teams to meet corporate yield goals.

Lead local ramp-up and process integration for foundry-produced chips, driving manufacturability, yield improvement, and timely NTI process transfers. Collaborate with foundries, NXP technology groups, business lines, and customers; make process-integration decisions, manage resources and schedules, and steer cross-functional projects to support production ramps and new fab enablement.

Lead coordination and program management for 3rd-party foundry wafer manufacturing, capacity planning, process integration, yield and quality improvements, product transfers, qualifications, and cross-functional stakeholder communication.

The role involves leading technology ramp-up and process transfers for logic/RF devices, collaborating with foundries, and ensuring manufacturability and performance targets are met.