Top Tech Jobs & Startup Jobs in Singapore

Develop an AI-enabled procurement analytics and process-transformation solution for Front-End Materials Procurement Operations. Analyze procurement and supply-chain data, supplier performance, risks, capacity constraints, and cost opportunities. Build dashboards, tracking systems, AI or automation prototypes, and process improvements using tools such as Power BI, UiPath, Tableau, or Power Automate. Collaborate with global procurement and cross-functional stakeholders, document outcomes, and present project findings to department leaders.

Manages the application lifecycle for software systems in an automated semiconductor manufacturing environment. Translates business requirements into technical solutions, supports secure software development, conducts testing and user training, applies software and hardware updates, monitors systems to prevent downtime, and resolves high-priority manufacturing application issues. The role also promotes automation, analytics, and AI-enabled development while collaborating with global IT teams and advising management.

Conduct a five-month engineering project optimizing Chemical Mechanical Planarization processes and characterizing equipment in semiconductor manufacturing. Analyze process, metrology, equipment, and manufacturing data using statistical and AI-assisted methods; assess process capability and qualification results; and develop a dashboard, analytics model, or automation tool. Collaborate with cross-functional stakeholders and deliver technical reports, presentations, engineering recommendations, and documented improvement results focused on stability, yield, cost, productivity, or data accessibility.

Lead validation efforts for DRAM/HBM, develop test programs, perform advanced analysis, and mentor junior engineers. Ensure efficient execution and continuous improvement in processes.

Analyze semiconductor packaging, assembly, test, inline signals, process parameters, and manufacturing data to identify process variability and yield-loss contributors. Apply statistical analysis, visualization, programming, and AI-enabled workflows to investigate reject rates, develop engineering recommendations, document findings, and present results through a technical report and presentation.

Develops semiconductor memory reliability test flows, qualification plans, and manufacturing test strategies for HBM products. The role investigates reliability and RMA failures using electrical and physical failure analysis, drives root-cause resolution, supports process conversions, manages technical risks, and collaborates across fab, design, technology, systems, and quality teams. It also applies machine learning and AI automation to reliability data and workflows.

Owns advanced package architecture and execution from feasibility through tape-out, qualification, and production readiness. Leads complex package trade-offs across silicon, technology, assembly, quality, suppliers, and OSAT teams. Integrates electrical, thermal, mechanical, power, signal, and manufacturing requirements in silicon-package-board co-design. Advances design rules, automation workflows, and technology roadmaps while mentoring engineers and serving as the technical authority for package design decisions.

Sustains and maintains semiconductor fab support systems, leads technician coverage, improves process conditions and safety interlocks, introduces OEM equipment, manages budgets, analyzes abnormalities, and drives capability, reliability, cost, and continuous-improvement initiatives using RMS, SCADA, monitoring dashboards, and AI-assisted tools.

Support SSD products from development and qualification through high-volume manufacturing. Drive manufacturing test bring-up, product qualification, firmware and test validation, production readiness, yield improvement, and system-level failure analysis. Analyze test data and manufacturing performance, resolve root causes with cross-functional engineering teams, and develop automation, analytics, and AI-enabled solutions to improve product quality and engineering efficiency.

Lead cost improvement programs across HBM, MCP, LPDRAM, and SSD manufacturing. Manage month-end close, budgeting, capex optimization, FCF deliverables, material consumption, and cost-per-part projections. Partner with finance and site teams, deploy dashboards and AI-assisted tools, and promote Lean best practices to improve cost competitiveness.