Top Tech Jobs & Startup Jobs in Singapore

The Principal Engineer will develop advanced packaging technology, lead technical teams, consult at management levels, and drive innovation through collaboration and mentoring.

Work with cross-functional fab and process teams to design and run experiments, analyze complex data, and improve semiconductor module yield, reliability, and process alignment. Communicate issues to fab engineering and leadership, engage global partners and sister fabs, incorporate AI-assisted tools for efficiency, and contribute to continuous improvement and process forecasting.

Design, build, and ship end-to-end production AI applications for smart manufacturing: data pipelines, model training/inference, APIs, web/mobile front-ends, on-prem/edge deployment, MLOps, monitoring, Responsible AI, and integration with robotics and MES.

Lead NAND cell integration efforts by driving process and device technology development, designing experiments, analyzing inline/probe/parametric/reliability data, applying device physics, using AI tools to accelerate learning, managing small projects, and coordinating cross-functional teams with product engineering, TCAD, and process integration to meet performance and reliability targets.

Maintain and audit fab capacity models, apply industrial engineering and statistics for scheduling and production planning, coordinate cross-functional projects, evaluate scenario impacts, support capital and product-introduction planning, and drive continuous improvement using data and AI-assisted tools.

Own and prioritize the product backlog for Industrial & Physical AI: translate stakeholder needs into requirements, run hybrid agile/waterfall delivery, partner with engineering, manage vendors, lead UAT/change management and scale pilots across global fab construction and operations.

Optimize and improve semiconductor test processes and yields, resolve process/product deviations, qualify new test equipment and products, drive continuous improvement projects, and develop BI reporting and dashboards. Integrate AI-assisted tools to boost efficiency and share AI-enabled enhancements.

Coordinate process integration activities to improve yield, quality, and output for NAND Flash production. Design and analyze experiments, investigate yield/quality issues with cross-functional teams, partner with production and global fabs, and integrate AI-assisted tools to enhance process efficiency and continuous improvement.

The Senior Business Analyst will act as Product Owner for Package Health initiatives, managing project execution and system adoption, collaborating with IT to translate business needs into digital solutions.

Lead device-level investigation and optimization of 3D NAND by analyzing electrical characterization data, driving device-array co-optimization, developing algorithms/waveforms, and applying data analytics and AI/ML to improve performance, yield, and reliability. Collaborate with process, design, product, and test teams to prototype solutions, support yield ramping, and define next-generation NAND scaling strategies.