Top Tech Jobs & Startup Jobs in Singapore

Leads global semiconductor packaging product yield, quality improvement, process integration, and new product introduction initiatives. Drives PI Loop taskforces, process-flow optimization, business-process standardization, benchmarking, and cross-functional project execution across fabs and engineering teams. Applies semiconductor expertise, AI-enabled engineering tools, advanced analytics, and digital transformation to accelerate problem solving, improve decision-making, and increase productivity. Requires regular collaboration, presentations, and travel to Micron fab locations.

Analyze and characterize semiconductor manufacturing defects, troubleshoot wafer fabrication problems, perform root cause analysis, and improve process capability, yield, quality, and cost. The role evaluates equipment and materials, manages process improvement projects, investigates process deviations, and recommends corrective actions and manufacturing changes. It collaborates across engineering and manufacturing teams while applying AI-assisted tools to improve analysis and operational effectiveness.

Supports the design, operation, optimization, and troubleshooting of chemical and gas delivery systems for semiconductor manufacturing facilities. Responsibilities include capacity planning, code compliance, equipment integration, infrastructure planning, contractor and supplier coordination, SOP improvement, safety verification, construction inspection, cost estimation, and continuous improvement. The engineer also supports new equipment startups, facility layouts, quality management processes, and responsible use of AI-enabled tools.

Support probe area capacity and cycle-time planning, identify and resolve constraints, deploy manufacturing systems, drive productivity and quality improvements, set up automated disposition systems, support new NAND device setups, integrate AI-enabled analytics, and maintain QMS and cross-functional coordination to meet business objectives.

Manage project controls across construction lifecycle: schedule, cost, risk, document control and reporting. Consolidate weekly/monthly reports, review contractor schedules (Primavera/MS Project), host schedule and cost reviews, maintain WBS/CBS/OBS, manage change orders/claims, support MPCS development and benchmarking, and coordinate mitigation to deliver projects on time and within budget.

Perform electrical and physical failure analysis of semiconductor devices using advanced FA tools (FIB, SEM, EDX, X-ray, micro-prober). Analyze test data with Bash/Python in Unix, identify failure mechanisms, drive corrective actions with product and process teams, develop FA techniques and automation, maintain lab safety and +6S standards, prepare FA reports, mentor technicians, and use AI-enabled tools to accelerate investigations and improve workflows.

Manage end-to-end reliability stress tests and package qualification (thermal cycling, HAST, CSAM, HTOL, etc.). Maintain process of record, lead equipment qualification, define control plans, analyze performance data, drive continuous improvements, and integrate AI-enabled reporting and automation with lab systems.

Leads NAND product engineering and cross-functional development from silicon through SSD integration and customer qualification. Translates business requirements into qualification specifications, develops AI-enabled workflows for data analysis and program management, coordinates engineering, fabrication, testing, quality, supply chain, and design teams, and guides resolution of NAND-system issues. Organizes capability reviews, leads product development meetings, and supports on-time delivery of next-generation NAND products.

Leads NAND product engineering and development, translating business and SSD requirements into qualification specifications. Builds AI-enabled workflows for data extraction, analysis, and program management. Coordinates NAND integration with technology, design, fabrication, assembly, testing, quality, supply chain, and business teams. Represents engineering in reviews, leads cross-functional meetings, organizes capability reviews, and resolves complex NAND-system issues to support timely product qualification and customer delivery.

Lead validation development for High Bandwidth Memory components as a subject matter expert. Develop, maintain, debug, and optimize C/C++ and Python test programs on ATE platforms; improve test stability, repeatability, test time, and parallelism. Own equipment qualification, hardware readiness, platform health, capacity forecasting, and validation infrastructure. Lead root-cause analysis, high-speed I/O and signal-integrity validation, cross-functional collaboration, technical standards, and mentoring of junior engineers.