Top Tech Jobs & Startup Jobs in Singapore

Full-time engineering intern supporting failure analysis and refurbishment process development for Process Control Boards in a semiconductor manufacturing environment. Responsibilities include circuit diagnostics, component-level failure investigation, replacement component evaluation, troubleshooting, root-cause analysis, technical documentation, SOP development and validation, and final project presentation. The intern will collaborate with bench engineers and explore AI-enabled tools for documentation and workflow improvement.

Define and implement NAND Flash reliability test flows, analyze high-volume statistical data, perform electrical failure analysis, and develop countermeasures to improve product reliability. Qualify products, identify root causes, collaborate with Fab, design, technology, development, and quality teams, support customer inquiries, and advance reliability initiatives using AI-assisted tools and data analysis.

Owns AI-driven cost-reduction products and use cases across procurement, operations, engineering, and commercial functions. Collaborates with data scientists, data engineers, and global teams to implement solutions, quantify financial and operational impact, develop ROI-based business cases, prioritize projects, and identify additional opportunities. Requires strong cost-project experience, analytical skills, cross-functional leadership, communication, and relationship management.

Leads cross-functional global product development teams for NAND, mNAND, and SSD products from planning through qualification and production ramp. Manages program schedules, milestones, budgets, risks, KPIs, change requests, escalations, stakeholder communications, supply chain coordination, and manufacturing handoff. Drives continuous process improvement, stage-gate reviews, product qualification, and resolution of complex development issues.

The Senior/Staff Firmware Test Engineer will develop verification plans, analyze firmware failures, manage testing processes, and provide leadership within the SSD group, ensuring high product reliability and performance.

Drives HBM package product engineering, assembly and cube yield improvement, DPM reduction, cumulative yield ownership, and resolution of packaging quality and RMA issues. Leads process conversions, failure analysis, cross-functional manufacturing initiatives, technical decisions, and AI/ML projects focused on quality, cost, cycle time, and scale. Requires collaboration with global semiconductor, packaging, design, reliability, and manufacturing teams, including international travel.

Manage spares and materials forecasting for fab tools, maintain BOM/PM planning models, coordinate with procurement and process teams to prevent shortages/expiry, develop reporting/automation, and support cost management and continuous improvement initiatives.

Develop analytics, operations-research and machine-learning solutions and web applications to improve semiconductor manufacturing efficiency and scheduling. Manage requirements, stakeholders, and delivery; collaborate across teams; integrate AI-assisted tools; and support continuous improvement in capacity, cycle-time, and scheduling optimization.

Support and optimize site inventory and production scheduling using data analytics. Develop Python/SQL programs, create visual reports, collaborate across engineering teams, and apply AI-assisted tools to improve line inventory performance and scheduling logic.

Develop and apply industrial engineering forecasting models for fab utilities and metrics, analyze scenario impacts, coordinate stakeholders and global sites, communicate risks to management, pursue improvement and automation projects, and responsibly use AI-assisted tools to boost productivity and quality.