Top Tech Jobs & Startup Jobs in Singapore

The role involves improving manufacturing operations through analytics, project management, collaboration, and effective communication of solutions using programming and machine learning skills.

Develop, deploy, and sustain process control systems (SPACE SPC, Applied E3, MES/MAM/RMS) for Assembly & Test. Configure SPC/FDC models, ensure equipment-to-host connectivity (SECS/GEM), govern OCAP/recipes, monitor metrics, perform RCA, automate tasks with SQL/Python, and maintain audit-ready documentation while collaborating with cross-functional teams.

Lead HBM product reliability test development and execution to reduce DPM, drive intrinsic/extrinsic reliability, debug qual/RMA failures via EFA/PFA, enable process conversions with fab, apply ML/AI to reliability datasets, mentor team, and collaborate cross-functionally to meet quality, cost, and cycle-time KPIs.

Lead technical strategy in 3D NAND thin film development, mentor engineers, influence standards, and drive process improvements.

Lead and develop a Procure-to-Pay operations team delivering global P2P support (tail spend, PR/PO processing, supplier onboarding, catalog, receiving, invoice resolution). Own service delivery KPIs, compliance, audit readiness, process documentation, stakeholder escalations, and continuous improvement. Act as P2P SME, drive automation/AI enablement, support system changes and UAT, and partner cross-functionally with Finance, IT, procurement, and suppliers.

The role involves developing AI-driven solutions for semiconductor engineering, focusing on GenAI systems, data pipelines, and machine learning models while collaborating with cross-functional teams.

Validate and qualify NAND flash products across pre-silicon and post-silicon stages. Perform simulations with CAD and Verilog, run device characterization and failure analysis, define product configurations, support engineering sample prep, and integrate AI-assisted tools to improve workflows while collaborating cross-functionally to resolve design issues.

The Principal Engineer will lead CMP process development for NAND technologies, optimize processes, collaborate globally, and mentor junior engineers.

Lead cross-functional execution of HBM products from concept through design, new product introduction, and high-volume manufacturing. Build and maintain development schedules, prioritize tactical activities, manage risks and issues, coordinate engineering and manufacturing teams, communicate status to technical and senior leadership, assign task ownership, maintain documentation, and support hardware readiness and capacity planning.

Drive next-generation memory package architecture and pathfinding across silicon, packaging, boards, and systems. Define packaging strategies optimized for bandwidth, power, thermal, mechanical, electrical, and system performance. Lead cross-functional collaboration with design teams, customers, business units, and senior leaders. Develop AI-based EDA and automation tools, measurement automation, and long-term technology roadmaps. Apply expertise in memory systems, package design, signaling, power integrity, timing, and simulation.