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The role involves process module ownership in Grind/Trim for 3D NAND, collaborating on process development, improving manufacturability, managing experiments, and leading multi-functional projects.

The principal engineer will drive advancements in NAND development, ensuring reliability and performance of CMOS technology and leading design efforts.

Responsible for full physical failure analysis support for NPI and HVM, certifying compliance with safety protocols, operating analytical tools, leading PFA technicians, and improving analysis processes.

The role involves sustaining NAND product ownership, testing flow development, failure analysis, and yield improvement through cross-functional collaboration.

The role involves data analysis, developing advanced algorithms for data-mining, and collaborating with cross-functional teams to optimize product reliability and quality.

The Test Development Engineer will design, develop, and maintain NAND reliability test programs, collaborating with various teams for product evaluation and testing methodology development.

The role involves addressing semiconductor technology deficiencies, enhancing process integration, and leading cross-functional teams to ensure successful technology transfer and product manufacturability.