Top Tech Jobs & Startup Jobs in Singapore

Supports High Bandwidth Memory new product introduction by integrating processes across post-wafer finishing, assembly, and test. Performs process characterization, design of experiments, yield and defect analysis, root cause investigations, and corrective actions. Tracks lots, supports readiness and manufacturing handoffs, maintains technical documentation, and collaborates with fab, assembly, test, quality, and engineering teams to resolve integration issues and meet NPI milestones.

Architect and deploy autonomous Agentic AI systems for smart manufacturing. Responsibilities include developing multi-step AI agents, integrating LLMs with APIs and databases, building evaluation and profiling frameworks, implementing MCP and A2A interoperability, deploying agents through CI/CD to Kubernetes and cloud containers, securing agent workflows, optimizing inference performance, and mentoring engineers.

Analyze and improve yield during High Bandwidth Memory new product introduction, from first silicon through early high-volume manufacturing. Responsibilities include yield monitoring, excursion management, defect breakdown, failure analysis coordination, yield deviation analysis, dashboard maintenance, SPC/FDC monitoring, and identifying improvement opportunities. The engineer collaborates with process integration, process engineering, manufacturing, quality, and data analysis teams while applying AI-assisted tools and data-driven problem-solving methods.

The Workforce Development Specialist manages site learning initiatives, conducts needs analysis, develops training resources, and mentors team members to enhance operational excellence and employee growth.

Intern will analyze supplier performance, capital equipment delivery, and procurement data; build Power BI and Excel dashboards; explore AI-enabled analytics and workflow automation; map procurement processes; and recommend improvements to efficiency, data quality, supplier visibility, and decision-making. The role involves cross-functional collaboration with procurement, engineering, operations, and suppliers, along with documentation and final presentation of project deliverables.

Designs, develops, tests, and validates AI-enabled solutions, workflow automation, analytics tools, and internal EHSS applications. Translates business processes into scalable technical solutions, builds prototypes and pilots, integrates APIs and enterprise platforms, and supports production deployment. Partners with EHSS, IT, data, AI, PMO, and technology teams to improve operational visibility, risk management, decision-making, governance, security, and long-term solution scalability.

Optimizes semiconductor fabrication processes, product yield, quality, reliability, cost, and productivity. Leads yield improvement, new product startups, data analysis, DOE, failure analysis, process qualifications, and cross-functional taskforces. Collaborates with wafer fab, process integration, equipment, materials, and test teams to resolve manufacturing issues and establish continuous improvement roadmaps. The role also uses AI-enabled tools responsibly to improve analysis and operational effectiveness.

Serves as the technical specialist for EHSS data, designing data models, mappings, transformation logic, quality controls, metadata, and reusable datasets. Partners with subject matter experts, IT, and analytics teams to deliver trusted data products supporting reporting, analytics, automation, AI, and operational decisions. Responsibilities include validation, reconciliation, root-cause analysis, testing, deployment readiness, governance, documentation, and long-term sustainment of enterprise data assets.

Provides technical-functional leadership for EHSS business systems, including SAP S/4HANA, ServiceNow, integrations, workflows, and enterprise applications. Translates business and regulatory requirements into functional designs, system requirements, interfaces, and acceptance criteria. Evaluates configurations, integrations, controls, dependencies, and system roadmaps while supporting implementation, testing, cutover, stabilization, and sustainment. Partners with EHSS, IT, data, program, architecture, and implementation teams to ensure compliant, supportable, interoperable systems.

Develop and optimize advanced semiconductor packaging assembly processes, including wafer-level packaging, wafer bonding, and die stacking. Evaluate equipment and materials, establish process parameters, improve yield and quality, reduce costs, and implement process controls. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams to transition technologies from development through high-volume manufacturing. Use statistical analysis, automation, defect analysis, and AI-enabled tools to support process improvement and production readiness.