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The Package Development Engineer focuses on transitioning new memory and HBM packaging technologies to high-volume manufacturing, collaborating with teams for process advancement and risk management.

The Intern will assist in preparing 3D NAND samples for Electron Tomography, perform experiments using TEM, analyze data, and collaborate with cross-functional teams.

Analyze data to identify cost drivers and trends, develop analytics solutions and dashboards, and partner with Finance and Cost teams to achieve cost KPIs.

Support the HIG PSE IE team by optimizing semiconductor sample workflows, developing data analytics and dashboards, and collaborating on process improvements.

The intern will document electrical fail signatures, create a dashboard for defect tracking in HBM processes, and analyze defect fail modes.

As an Incoming Quality Control Engineer, you'll ensure quality for incoming materials, improve processes, manage quality systems, and collaborate with teams globally.

Lead a team of engineers to develop NAND process solutions, ensuring safety, strategy for technology nodes, and collaboration with global partners.

The IT Engineer will design, code, test, and analyze software for backend automation and manufacturing systems, while contributing to documentation and project ownership responsibilities.

The role involves providing technical support for construction project design and management, focusing on facility mechanical systems while ensuring alignment with global standards and sustainability goals.

Design, develop, and implement process solutions for 3D NAND product yield and quality. Collaborate with cross-functional teams and manage process improvements.