Top Tech Jobs & Startup Jobs in Singapore

Drive manufacturing execution and product engineering for next-generation HBM products. Responsibilities include test flow development and validation, optimized test coverage, circuit debug, yield improvement, test-time reduction, reliability enhancement, cost reduction, and design-for-test strategy. The role supports product validation using CAD tools and Verilog simulations, resolves manufacturing and quality issues, collaborates cross-functionally, mentors engineers, and makes technical decisions on risk and project priorities.

Leads HBM product system engineering and manufacturing test development for next-generation memory products. Responsibilities include test coverage optimization, product validation, circuit debugging, yield improvement, cost and test-time reduction, root-cause analysis, DFT strategy, technical decision-making, cross-functional collaboration, and team mentorship. The role also drives innovation, project execution, and productivity improvements using AI tools.

Leads global EHSS solution programs from discovery through deployment and stabilization, initially focused on Health and Safety. Translates operational and regulatory needs into requirements, processes, UAT plans and delivery programs; coordinates business teams, IT, vendors and implementation partners; establishes governance, manages risks and dependencies, drives business acceptance, and evaluates AI, automation, analytics and enterprise platforms to improve EHSS outcomes.

As a Senior Member of Technical Staff, you'll lead the development and integration of 3D NAND processes, focusing on innovation, performance optimization, and cross-functional team coordination.

Perform electrical characterization and high-volume experiments on NAND cell arrays and test structures to identify failure mechanisms. Design experiments, analyze statistical data, assess reliability risks vs. JEDEC/internal qualifications, and drive process and product engineering solutions and roadmap for next-generation NAND.

The role involves validating and characterizing advanced NAND products using silicon validation techniques, automation, and applied AI/ML methods. Responsibilities include designing validation flows, conducting failure analysis, and improving test efficiency.

Performs electrical and physical failure analysis for semiconductor device anomalies, customer returns, and qualification failures. Uses advanced microscopy, imaging, probing, and testing tools, along with Bash and Python in Unix environments, to identify failure mechanisms. Collaborates with process and product teams, develops improved analysis techniques, maintains lab safety and quality standards, prepares reports, presents findings, guides technicians, and supports automation, analytics, and AI-enabled workflow improvements.

Five-month internship developing AI and machine learning solutions for semiconductor facilities engineering. Responsibilities include analyzing operational and sensor data, building predictive maintenance and anomaly-detection prototypes, creating dashboards and automation workflows, and developing AI-enabled knowledge-management tools. The intern will collaborate with facilities engineers, apply software-engineering principles, document findings, and present recommendations and business value.

Develop and improve NAND cell reliability through electrical characterization, high-volume wafer- and component-level experiments, statistical analysis, failure-mechanism identification, and risk assessment. Coordinate process, trim, and test strategies to meet JEDEC and internal qualification requirements. Provide reliability updates and roadmap feedback to cross-functional engineering teams, while contributing to next-generation NAND technology development and product capability projections.

Supports NAND product development from silicon through system integration. Responsibilities include translating business and SSD requirements into qualification specifications, developing AI-enabled data workflows, coordinating technology, design, fabrication, assembly, test, quality, supply chain, and business teams, and managing product qualification priorities. The role leads reviews, cross-functional meetings, capability assessments, and resolution of NAND-system issues to enable timely customer product qualification.