Top Tech Jobs & Startup Jobs in Singapore

Lead mechanical construction for semiconductor fabs and cleanrooms, ensuring HVAC, exhaust, chilled water, CDA/PCW and other utilities meet contamination-control, safety, cost, schedule, and quality objectives. Oversee design reviews, construction coordination, commissioning, RFE/RFM readiness, handover documentation, and operations transition while driving change management, safety compliance, and continuous improvement.

This role focuses on reliability test development for High Bandwidth Memory products, involving root cause analysis, process improvement, and cross-functional collaboration to enhance product quality and performance.

Own end-to-end security validation for SSD firmware across development, qualification, release, and sustaining lifecycles. Architect security validation frameworks, lead automated testing and regression infrastructure, investigate security failures, and drive corrective actions. Collaborate on threat modeling, secure design and code reviews, communicate risks and coverage gaps, and provide technical leadership and mentorship across multiple SSD product generations.

The Global Facilities Tool Installation Engineer drives improvements in Front-End Manufacturing, manages TI projects, aligns global strategies, and mentors project managers, ensuring business alignment and optimization across multiple sites, while maintaining strong global relationships and communication.

Lead the reliability testing and process improvement for HBM products, ensuring quality and efficiency while mentoring team members and managing projects.

Develops and optimizes CVD and diffusion thin-film processes for advanced NAND technology. Responsibilities include designing experiments, analyzing data, characterizing films using SEM, TEM, XPS, SIMS, and AFM, troubleshooting process and equipment issues, supporting pilot-line execution and manufacturing transfer, and sustaining process capability. The role collaborates with integration, metrology, failure analysis, yield, manufacturing, and equipment partners while maintaining technical documentation and applying continuous improvement methods.

Lead CMP process development, characterization, and transfer for 3D NAND nodes. Drive yield, manufacturability, cost reduction, process monitoring, supplier engagement, and cross-site projects while applying failure analysis and AI-driven process improvements.

Lead test equipment engineering to improve availability, OEE, and reliability through data analytics, automation, AI-enabled tools, continuous improvement, tester setup/qualification, failure analysis, and team coaching. Support manufacturing test operations, implement fixes, and develop monitoring/visualization dashboards to reduce downtime and enhance productivity.

Leads test development, product engineering, and electrical failure analysis for automotive managed NAND and SSD BGA products across qualification, manufacturing ramp, and customer returns. Develops cost-efficient test strategies, improves yield, test time, and quality, secures test infrastructure, and collaborates with NAND, ASIC, firmware, and test engineering teams. Applies AI tools such as Claude Code and Copilot to automate workflows and data analysis, while communicating project status and technical findings.

Leads advanced packaging technology development programs and engineering builds from planning through execution and handoff. Responsibilities include managing integrated schedules, dependencies, risks, deliverables, materials, costs, resources, logistics, and stakeholder communications. The role supervises daily semiconductor build activities, coordinates cross-functional teams, maintains project documentation, and improves development processes. It requires semiconductor manufacturing and advanced packaging expertise, strong analytical and leadership skills, and proficiency with business, project management, and manufacturing systems.