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The FE CPIE Senior Manager drives yield improvement and product quality for HBM products, leading teams and strategic initiatives across Micron's global facilities.

The Director will oversee global supply and capital planning, developing teams, optimizing plans, and coordinating with various departments to achieve business objectives.

As a Senior/Principal NAND Module Process Integration Engineer, you will design and implement process solutions to enhance 3D NAND product yield and quality while leading cross-functional teams and managing technology transfers.

The role involves improving NAND product yield and quality through process integration, leading cross-functional teams, and tech transfer from R&D to manufacturing.

As a NAND CMOS Device Engineer, you will develop transistor structures, set electrical targets, analyze silicon experiments, and collaborate with design and manufacturing teams to enhance device reliability and performance.

Drive NAND design rule development and integration, collaborating with teams to address process issues, ensure quality checks, and manage project timelines.

The role involves designing and improving process integration solutions for 3D NAND products, working across teams to enhance product yield and quality.

The role involves conducting failure analysis, electrical characterization, and developing methodologies to enhance yield. Responsibilities include collaboration with teams and presenting findings.

Lead a team in failure analysis for NAND memory technology, optimizing resources, and collaborating with engineering teams to drive improvements.

Design and develop process solutions for 3D NAND technology, focusing on yield and quality improvements while leading module projects and cross-functional teams.