Top Tech Jobs & Startup Jobs in Singapore

As a Senior Member of Technical Staff, you'll lead the development and integration of 3D NAND processes, focusing on innovation, performance optimization, and cross-functional team coordination.

The Package Health Test Engineer develops and executes package health monitoring, including DFT, data analysis, and reliability testing for semiconductor packaging solutions.

Lead development of dry etch processes for NAND scaling, drive next-generation plasma etch solutions, evaluate chemistries and hardware, collaborate across integration teams, and apply AI/ML and advanced analytics to accelerate process development and manufacturability.

Lead R&D and technology pathfinding for advanced NAND thin films and materials. Define roadmaps, evaluate novel materials and deposition processes, integrate solutions with device and manufacturing teams, drive external collaborations, generate IP, mentor technical staff, and apply AI/advanced analytics to accelerate process development and decision-making.

The role involves designing software and algorithms to analyze large datasets for actionable insights, enhancing production processes and product development.

Develop and apply industrial engineering forecasting models for fab utilities and metrics, analyze scenario impacts, coordinate stakeholders and global sites, communicate risks to management, pursue improvement and automation projects, and responsibly use AI-assisted tools to boost productivity and quality.

Lead design, development, and transfer of CMOS 3D NAND process integration solutions to improve yield, quality, and manufacturability. Diagnose module deficiencies, run development experiments, coordinate cross-functional teams, support manufacturing ramp-up and training, and present findings at reviews and yield summits.

The Warehouse Engineer manages and optimizes warehouse operations, ensures compliance with safety and process standards, and implements AI-driven solutions for efficiency.

The Staff/Senior Engineer will develop package health metrics, conduct defect characterization, and analyze data to enhance semiconductor packaging solutions.

Provide technical leadership for NAND-related debug in SSD systems, triaging and root-causing NAND-Firmware Interaction issues. Interface with NAND design and product teams, identify and mitigate development and field risks, and perform detailed firmware/hardware/system failure analysis using lab equipment. Integrate AI-assisted tools to improve debugging and share AI-enabled improvements.