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This role focuses on diagnosing and resolving assembly process issues, managing supplier audits, and improving process efficiency and yields.

Lead wire bond process development for IC packages, collaborate with global teams, and showcase innovations through publications. Responsibilities include process characterization, qualification, and technology transfer.

The Intern will focus on automating reports and analyses, utilizing Python/JMP scripts, and collaborating with engineers for performance improvement in semiconductor manufacturing.

The Senior Engineer will lead the alignment and standardization of best-known methods, develop metrics for sustainability, and drive productivity improvements in collaboration with multi-functional teams while maintaining a strong culture of performance and diversity.

The Program Manager will oversee NAND and SSD product development, ensuring project targets and quality are met while managing cross-functional teams and communication.

The role involves advanced process development in photolithography for 3D NAND technology, troubleshooting processes and driving yield improvement, and integrating manufacturing methods into new development phases.

The role involves leading the FE CPIE team to drive yield, quality, and new product introduction for HBM products while ensuring collaboration across teams and developing best practices.