Top Tech Jobs & Startup Jobs in Singapore

Own probe strategy and silicon learning at wafer test across pre-silicon through HVM. Define probe coverage, limits, and guard-bands; enable NPI and first-silicon bring-up; drive yield, quality, and cost optimizations; collaborate with Design, DFT, DV, Process, Test, and Reliability; apply data analytics and AI/ML for probe and test optimization.

The engineer will perform electrical failure analysis, operate specialized tools, analyze semiconductor failures, and generate failure analysis reports.

Oversee construction document control and project cost control for Fab10 facilities projects, ensuring document governance, versioning, cost baselines, forecasting, change management, invoice validation, and coordination across contractors, procurement, finance, and global facilities teams to improve forecast accuracy and drive execution discipline.

The Senior Engineer focuses on CVD/Diffusion process development for NAND technology, executing experiments, tool troubleshooting, and supporting manufacturing process transfer.

Lead HBM package product engineering to improve yield, reduce DPM, and resolve packaging failures via EFA/PFA and cross-functional collaboration. Drive process conversions, test optimization, AI/ML adoption, and project decisions to meet quality, cost, cycle time and scale targets.

Design, implement, and test SSD firmware subsystems to meet performance, endurance, capacity, functionality, and reliability targets. Develop firmware unit and functional tests, debug embedded code (primarily C), integrate storage interfaces (PCIe/NVMe), and apply AI-assisted tools to improve development efficiency and quality. Communicate status across teams and mentor colleagues.

Lead design, expansion, maintenance, and reliability improvements for semiconductor fab mechanical and cleanroom systems (HVAC, chillers, cooling towers, compressed air, process cooling, etc.). Drive preventive and predictive maintenance, troubleshoot production-impacting issues, perform root-cause analysis, manage spare parts and procurement, and implement sustainability and smart/AI initiatives.

Lead development of next-generation thin film processes for NAND, including dielectric, conductive, interface, and charge-storage layers. Drive materials and deposition innovation, integrate new processes with device and yield teams, mentor engineers, lead technical task forces, and apply AI/advanced analytics to accelerate process development and R&D productivity.

The Technician executes and maintains Micron's PCS systems, including SPC, MES, and RMS, ensuring data integrity and system updates while supporting equipment reliability. Responsibilities include monitoring system performance, troubleshooting issues, and collaborating with various engineering and manufacturing teams.

The role involves leading smart facility projects, planning maintenance, troubleshooting mechanical equipment, managing contractors, and ensuring safety compliance.