Top Tech Jobs & Startup Jobs in Singapore

Own smart manufacturing product solutions from problem definition through deployment, adoption, and value realization. Gather business requirements, define solution scope and KPIs, prioritize improvement opportunities, and lead cross-functional projects with data scientists, data engineers, suppliers, and manufacturing stakeholders. Use operational data, AI, machine learning, and automation to improve wafer output, productivity, decision-making, and capital efficiency.

Characterize and optimize advanced 3D NAND memory cells and arrays through device-physics analysis, electrical test-data analysis, AI-assisted workflows, and failure-mechanism investigation. The engineer will contribute to NAND architecture and process development while collaborating with device, integration, design, product, reliability, and manufacturing teams to improve performance, reliability, scaling, and technology qualification.

Leads High Bandwidth Memory product development from introduction through high-volume production. Owns technical program requirements, milestones, reviews, risk mitigation, decision-making, and cross-functional coordination across engineering, quality, supply chain, packaging, test, and manufacturing teams. Represents programs to executives, drives change management, and develops distributed team members through mentorship, coaching, evaluations, and accountability.

Leads Micron’s advanced NAND process integration organization and next-generation technology roadmap. Responsibilities include technology pathfinding, architecture development, process integration from concept through delivery, CSPEC/FMEA development, test vehicle execution, manufacturable solution development, and cross-functional milestone delivery. The role partners globally with device, design, probe, test, reliability, yield, operations, and process teams while building and mentoring a high-performing engineering organization and adopting AI-enabled, data-driven methodologies.

Develop AI-enabled dashboards, workflow automation, and productivity applications for semiconductor engineering. Analyze engineering processes, integrate data from multiple sources, and apply AI, data analytics, visualization, and software development techniques to improve project visibility, adoption, governance, and productivity. The intern will collaborate with engineering, manufacturing, and software teams and deliver documentation, testing evidence, deployment guidance, and a final presentation.

Develop and execute reliability stress tests, qualification plans, and test flows for HBM products. Drive DPM reduction, perform root-cause analysis using EFA/PFA, recommend process conversions for HVM, manage qualification risks, collaborate cross-functionally, make technical prioritization decisions, and embed AI/ML tools (Python, JMP, Claude) into reliability workflows to improve analytics and automation.

Lead mechanical facilities engineering and maintenance for HVAC, chillers, boilers, cooling towers, compressed air, scrubbers, and cleanroom air systems. Plan and execute preventive and corrective maintenance, troubleshoot production interruptions, design and lead mechanical projects, track capacity, maintain maintenance records, drive energy savings and sustainability projects, and integrate smart/AI tools to improve reliability and efficiency.

Lead engineering, maintenance, commissioning, and optimization of site electrical systems (230kV to LV) for semiconductor manufacturing. Drive capacity planning, reliability improvements, FMEA, root-cause 8D investigations, SMART power deployments, and mentor engineers and technicians to ensure safe, resilient, and efficient electrical infrastructure.

Supports semiconductor technology development during 12-hour shifts by resolving process and equipment issues, protecting yield, managing excursions and line-downs, executing reaction plans, and coordinating with development, operations, technicians, and suppliers. Performs data-driven troubleshooting, SPC and quality control, root-cause analysis, process development support, critical-lot monitoring, wafer shipments, and project execution to improve process stability, tool performance, output, and manufacturing efficiency.

Leads integration of High Bandwidth Memory products with end-system requirements. Manages technical requirements, silicon-system alignment, sample delivery, qualification changes, triage, risk mitigation, and cross-functional issue resolution. Collaborates across architecture, engineering, technology development, packaging, quality, and business teams to prioritize development and meet customer needs. Applies AI and data-driven solutions to optimize workflows and project decisions.