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This role involves leading a DDQA engineering team to ensure the introduction of advanced package technologies, mitigate risks, and drive reliability strategies while fostering a culture of technical excellence.

The Senior Engineer, Process Integration will enhance NAND Flash production yields and quality through collaboration, data analysis, and process improvement experiments. Responsibilities include leading cross-functional teams, problem-solving, and integrating AI tools for operational efficiency.

The Senior/Staff Engineer will develop and optimize dry etch processes for NAND technology, collaborate with teams, conduct analysis, and maintain pilot manufacturing lines.

The DMTS Dry Etch Engineer will lead advancements in NAND technology, develop dry etch processes, mentor engineers, and represent Micron at technical forums. Responsibilities include collaborating in multi-functional teams, solving structural problems, and influencing technology roadmaps.

As a Validation Engineer, you will develop and execute validation test plans for SSD devices, analyze results, and assist in debugging. You will also perform failure analysis and enhance customer integration experiences.

Define and implement NAND Flash reliability test flows, perform large-scale statistical analysis and electrical failure analysis, develop countermeasures and qualification controls, collaborate with cross-functional teams, integrate AI-assisted tools, support customer reliability inquiries, and drive strategic reliability initiatives to ensure robust NAND product performance and prevent field escapes.

Lead R&D and operations in advanced metrology processes, develop methods for accuracy and precision, and mentor engineers in a semiconductor manufacturing context.

Lead dry etch process development for 3D NAND: deploy new process technologies, optimize etch tool performance and recipes, run DOE and data analysis, troubleshoot yield issues, collaborate with fabs and cross-functional teams, and apply AI to streamline workflows and decision-making.

Manage end-to-end reliability stress tests and package qualification (thermal cycling, HAST, HTS, CSAM). Maintain process of record and SOP adherence, qualify equipment/layout changes, define process windows and control plans, and drive continuous improvement. Collaborate with Quality, NPI, Product and Equipment Engineering. Analyze process data using statistical and AI-assisted techniques, integrate AI tools responsibly, and ensure compliance with quality, audit, and EHS requirements.

Lead NAND flash reliability testing and high-volume statistical analysis, drive electrical failure analysis and root-cause characterization, develop countermeasures and qualification controls, collaborate cross-functionally, apply AI-assisted tools, and support customer technical inquiries to improve product DPM and cell reliability.