Top Tech Jobs & Startup Jobs in Singapore

Lead and coordinate semiconductor package qualification and reliability testing for new products; develop test plans and screening methods; drive root-cause analysis and 8D corrective actions; present technical reports; and liaise with internal teams and customers on package quality and release recommendations.

Lead process integration efforts for next-generation 3D NAND: identify yield gaps, develop process solutions, coordinate R&D-to-manufacturing transfers, run experiments, support ramp and qualification, and apply AI to optimize workflows and decisions.

Lead process integration efforts for next-generation 3D NAND to improve yield, quality, and cost. Identify module deficiencies, lead cross-functional teams, develop and transfer process solutions to manufacturing, support ramps and qualification, and apply AI-driven analytics to optimize workflows and decision making.

Conduct semiconductor defect and yield analysis using manufacturing data. Investigate wafer, lot, tool, and process excursions; apply statistics to identify trends and root causes; and develop dashboards, scripts, automation, or AI-enabled workflows. Collaborate with engineering teams, document methodologies, communicate findings, and recommend improvements that increase analysis efficiency and accelerate yield investigations.

Develop an AI agent for NAND product-development project execution, including project-risk detection, mitigation recommendations, workflow integration, and evaluation. The intern will study engineering workflows, prototype AI applications using generative AI, large language models, agentic frameworks, and data analytics, then deploy and document the solution while collaborating with product-development engineers and stakeholders.

Develop and validate manufacturing test firmware for SSDs, improve test coverage and efficiency, and apply Generative AI and Agentic AI to code development, validation, log analysis, and failure investigation. The intern will collaborate with engineering and hardware teams, analyze manufacturing data, investigate failures, document results, and deliver firmware and AI-enabled prototypes.

Support site capital budgeting and CAPEX analysis, drive asset reuse and lifecycle management, perform ROI/NPV/payback and depreciation forecasting, build dashboards and analytics, leverage automation/AI tools to improve planning, and partner with Engineering, Manufacturing, Finance, Procurement, and Facilities to present recommendations and support capital governance.

Define physical design rules for Non-Volatile Memory technologies, interact with process integration, evaluate design feasibility, and support design rule checking.

Leads cross-functional Front-End Cost Excellence and Max Out programs, defining scope, governance, methodologies, dependencies, risks, milestones, and performance targets. Partners with stakeholders and senior leaders to drive alignment, productivity improvements, continuous improvement, and timely communication of priorities, progress, risks, and outcomes. Uses AI and subject-matter expertise to support execution.

Supports a semiconductor test engineering project focused on improving burn-in equipment availability and Parts per Jam. Responsibilities include structuring alarm data, analyzing downtime patterns, developing predictive analytics, creating automated notifications and visualizations, validating trigger logic, and evaluating socket-masking and Agentic AI solutions. The intern will use Python, SQL, Power BI, and Power Automate while learning semiconductor test processes and equipment monitoring.