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The role involves process development for Bonding, Grind, and Trim in 3D NAND technology, focusing on equipment transfer, process improvement, and collaboration with local and global teams.

As a Process Engineer, you will optimize and develop processes, improve quality and yield, and collaborate on R&D activities. Your role includes troubleshooting, conducting experiments, and driving cost and risk management solutions with cross-functional teams.

Lead a team in HBM Package PE activities, improving yield and quality in assembly processes through collaboration and technical innovation.

As a HIG IE Engineer, you'll support lab operations, product analysis, and debugging, while mentoring team members and ensuring compliance with safety and quality standards.

As an HIG IE Engineer, you will support lab activities, conduct failure analysis, manage logistics, and drive process improvements while mentoring junior colleagues.

The role involves diagnosing assembly process issues, optimizing processes, managing suppliers, and supporting continuous improvement initiatives for new product introductions.

The role involves developing and optimizing processes for NAND memory, collaborating on technology breakthroughs, and managing experiments to enhance yield and quality.