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The Senior/Principal Engineer will innovate and optimize process solutions for 3D NAND products, lead module ownership and coordination, and drive technology transfer from R&D to manufacturing.

As a Senior Process Integration Engineer, you will lead the development and optimization of 3D NAND process modules, focusing on yield improvement and technology transfer. Responsibilities include defining specifications, resolving issues, and innovating new technologies while providing team leadership and cross-functional coordination.

The role involves leading process integration projects in semiconductor manufacturing, addressing technology gaps, and improving ongoing processes while coordinating with cross-functional teams.

Develop and optimize 3D NAND CMOS devices, drive multi-functional teams, analyze performance metrics, and collaborate on technology transfer to manufacturing.

As a Process Integration Engineer, you will develop NAND CMOS devices, optimize processes, and collaborate with cross-functional teams to enhance performance and manufacturability.

The role involves developing 3D NAND CMOS devices, enhancing performance and manufacturability, and optimizing process flows. It includes collaboration across teams and leadership in project reviews.

The Director of NAND Design Rule will lead a team in developing design rules and enabling error-free mask tape-outs, while managing cross-functional collaborations to optimize NAND product performance and manufacturing processes.

The internship focuses on enhancing Run to Run controller technology to improve product quality for the semiconductor industry, with a potential path to full-time employment.

The NAND CMOS Device Engineer will direct CMOS technology development, improve device portfolios, run experiments, and ensure manufacturability and reliability of transistors.

Lead initiatives to enhance yield and quality in HBM product engineering through advanced data analysis and machine learning, collaborating across teams and mentoring members.