Top Tech Jobs & Startup Jobs in Singapore

Plans, designs, oversees construction, and commissions ultra-pure water and wastewater treatment systems for semiconductor facilities. Coordinates engineering disciplines, contractors, vendors, stakeholders, and regulatory bodies while ensuring performance, safety, environmental compliance, and project timelines. Monitors system operation, conducts root-cause analysis, develops water recycling strategies, manages commissioning, and leads contractor teams. The role requires at least six years of relevant experience, including semiconductor or high-tech industrial construction experience.

Leads next-generation NAND dry etch process and critical module development, including process innovation, equipment roadmaps, scalability, yield improvement, and cross-functional problem solving. Owns technology roadmaps, collaborates with process and hardware teams, presents updates to management, mentors engineers, leads supplier evaluations, and applies statistical analysis, Python, and AI-enabled tools. Requires advanced semiconductor process expertise, plasma fundamentals, high-aspect-ratio etching experience, technical leadership, and substantial R&D experience transferring processes to manufacturing.

Assist Process Integration Engineers in troubleshooting, managing wafer logistics, analyzing experimental data, and monitoring production processes in a semiconductor environment.

Manage network tool utilization strategies, benchmark performance, and optimize manufacturing capacity, equipment deployment, and capital investments. Develop and communicate improvement plans across manufacturing teams, assess capacity impacts from process changes, and collaborate on tool and process roadmaps. Apply AI to improve investment decisions, process flexibility, capacity sharing, and equipment repurposing. Identify discrepancies and drive resolutions in a changing environment.

Lead development and optimization of wet etch unit processes for advanced NAND. Perform fundamental research, hardware evaluations, DoE-driven experiments, data analysis, and process monitoring/control. Drive yield, quality, and manufacturability improvements, manage cross-functional projects, collaborate globally, and generate intellectual property.

Develops and executes semiconductor product reliability stress tests, qualification plans, and manufacturing test strategies for High Bandwidth Memory products. Investigates reliability failures using electrical and physical failure analysis, drives root-cause resolution, supports process conversions and high-volume manufacturing, and reduces defect rates. The role manages technical risks, collaborates across fab, design, technology, quality, and systems teams, promotes AI-enabled workflow improvements, and mentors team members.

Lead design, development, and transfer of CMOS 3D NAND process integration solutions to improve yield, quality, and manufacturability. Diagnose module deficiencies, run development experiments, coordinate cross-functional teams, support manufacturing ramp-up and training, and present findings at reviews and yield summits.

The role involves leading finance process intelligence initiatives, enhancing process visibility, driving adoption of process intelligence platforms, and optimizing finance operations through analytics and AI integration.

Intern will optimize semiconductor manufacturing layout planning for an MSH probe ramp. Responsibilities include conducting site assessments, evaluating installation readiness, mapping workflows, identifying bottlenecks, and developing AI-enabled automation using tools such as Power Automate, Python, SQL, and Microsoft Copilot. The intern will collaborate with engineering and production stakeholders, apply responsible AI practices, measure project benefits, and document solutions and user guidance.

Develops and maintains automated validation infrastructure for enterprise SSD interoperability, functionality, and reliability testing. Responsibilities include creating test automation and equipment interfaces, defining validation strategies, troubleshooting SSD and platform integration issues, improving defect detection, documenting methodologies, and collaborating with firmware, hardware, test, and product teams across global locations.