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The internship offers university students a hands-on experience in various engineering departments at Micron from August to December 2025.

Responsible for improving 3D NAND product yield and quality by designing and implementing process solutions, leading cross-functional teams, and supporting technology transfer from R&D to manufacturing.

As a NAND CMOS Device Integration Engineer, you will set electrical targets, define transistor structures, and guide technology development while collaborating across teams.

The Senior Manager will lead global teams to improve product yield, quality, and new product introduction while ensuring strategic objectives are met.

The intern will work on optimizing wafer run-to-run control processes, enhancing CMP technology, and performing data analysis to improve production efficiency.

Lead integration of HBM products into system requirements, manage technical inputs, collaborate across teams, and resolve development challenges.

The Process Development Engineer will oversee NPI product/process transition, yield improvement, defect elimination, and collaboration for technology development in semiconductor packaging.

The role involves analyzing process flows, enhancing operations, managing image classification models, and collaborating on best practices for process improvements.

The Process Integration Engineer will develop and optimize manufacturing processes, improve product quality, and resolve assembly-related issues while collaborating with cross-functional teams.

The Intern will support the Digital Transformation team by analyzing business processes, collaborating on solutions, and ensuring smooth transitions during implementation.