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The Senior Engineer focuses on CVD/Diffusion process development for NAND technology, executing experiments, tool troubleshooting, and supporting manufacturing process transfer.

Develop and optimize advanced semiconductor packaging assembly processes, including wafer-level packaging, wafer bonding, and die stacking. Evaluate equipment and materials, establish process parameters, improve yield and quality, reduce costs, and implement process controls. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams to transition technologies from development through high-volume manufacturing. Use statistical analysis, automation, defect analysis, and AI-enabled tools to support process improvement and production readiness.

Drives wafer-level reliability and quality for advanced NAND flash products through data analysis, failure diagnostics, reliability test development, process optimization, and product qualification. Collaborates with fab, quality, and external teams to investigate failures, establish sampling plans, validate diagnostics, mitigate excursions, implement corrective actions, and improve defectivity, manufacturing performance, reliability, and time to market.

Develop and optimize wafer-level semiconductor packaging processes, including wafer thinning and backside metal interconnects. Evaluate equipment and materials, establish process parameters, improve quality and yield through SPC, DOE, defect analysis, and advanced controls, and coordinate technology transfers from development through high-volume manufacturing. Collaborate across packaging, wafer fabrication, assembly, product engineering, and quality teams while documenting process and model records. Apply AI-enabled tools to improve analysis, efficiency, and operational outcomes.

Maintain and improve Micron's Quality Management System (QMS) to ensure compliance with standards (ISO 9001, IATF 16949), coordinate and support audits, close findings, drive continuous improvement and quality projects, monitor KPIs, resolve non-compliances, deploy QMS process changes, leverage AI and RPA tools for efficiency, and manage related cost tracking.

This role involves advancing thin film process development for NAND technology through experiments, material characterization, collaboration with teams, and project leadership.

As a Distinguished Member of Technical Staff, you will lead process modules for 3D NAND development, optimize performance, resolve issues, and coordinate technology transfer while fostering innovation and communication across teams.

The DMTS leads the technical vision for cell film processes, mentoring leaders, solving technical challenges, and driving partnerships for innovation.

The Principal Engineer leads NAND cell film process development, driving strategic advancements, resolving technical challenges, and mentoring senior engineers to ensure successful integration into manufacturing.

The role involves developing advanced thin film deposition processes, conducting experiments for process improvement, collaborating with teams, and mentoring junior engineers.