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The role involves addressing deficiencies in module technologies, optimizing processes, leading projects, and coordinating with cross-functional teams to ensure effective transfer of new technologies to manufacturing.

Lead NAND CMOS team ensuring product introduction, quality, compliance, and collaboration across multiple departments while managing device health and reliability.

Lead the NAND Technology Integration team focusing on process development, node transfer, qualification, and team management, ensuring innovation and engagement across multifunctional groups.

Lead a team of engineers in NAND process development, focusing on strategy, innovation, safety, and collaboration with manufacturing and suppliers.

Lead a team in NAND process development, focusing on yield, reliability, mentoring engineers, and engaging suppliers for process solutions.

The FE CPIE Senior Manager drives yield improvement and product quality for HBM products, leading teams and strategic initiatives across Micron's global facilities.

The Director will oversee global supply and capital planning, developing teams, optimizing plans, and coordinating with various departments to achieve business objectives.

As a Senior/Principal NAND Module Process Integration Engineer, you will design and implement process solutions to enhance 3D NAND product yield and quality while leading cross-functional teams and managing technology transfers.

The role involves improving NAND product yield and quality through process integration, leading cross-functional teams, and tech transfer from R&D to manufacturing.

The Engineering Execution Manager leads HBM product development, ensuring integration across teams, maintaining schedules, and managing communication throughout the product lifecycle.