Top Tech Jobs & Startup Jobs in Singapore

Perform cross-section analysis and SEM inspection to ensure production quality. Utilize FIB for TEM sample preparation, identify defects, and collaborate with engineering teams for efficient production. Maintain documentation of analytical findings.

The SMTS leads photolithography technology initiatives, mentors engineers, establishes long-term process roadmaps, and enhances innovation in semiconductor development.

The SMTS defines technical strategies in NAND cell film development, leads advanced process improvements, and mentors engineers, driving innovation and ensuring integration with complex device performance correlations.

The role involves developing advanced packaging processes, ensuring readiness and transition to production, and collaborating with cross-functional teams to resolve issues.

Manage spares and materials forecasting for fab tools, maintain BOM/PM planning models, coordinate with procurement and process teams to prevent shortages/expiry, develop reporting/automation, and support cost management and continuous improvement initiatives.

The NAND Cell Device Senior/Principal Engineer will characterize NAND memory cells, develop device solutions, and collaborate on architecture and process improvements.

The DMTS is a technical authority in NAND dry etch processes, responsible for developing and mentoring, while addressing complex integration challenges.

Lead the design and validation of SSD firmware test architecture, automation platforms, and CI/CD pipeline while resolving critical issues for enterprise products.

Lead global semiconductor spares engineering and strategic improvement programs focused on equipment availability, cost, quality, productivity, supply resilience, and operational scalability. Develop category strategies, roadmaps, governance, and executive reporting while coordinating engineering, operations, planning, supply chain, suppliers, and regional teams. Use performance data, benchmarking, and digital tools to drive network-wide improvements. The role requires cross-functional leadership, stakeholder influence, structured problem-solving, and domestic and international travel.

Leads HBM product system engineering and manufacturing test development for next-generation memory products. Responsibilities include test coverage optimization, product validation, circuit debugging, yield improvement, cost and test-time reduction, root-cause analysis, DFT strategy, technical decision-making, cross-functional collaboration, and team mentorship. The role also drives innovation, project execution, and productivity improvements using AI tools.