Top Tech Jobs & Startup Jobs in Singapore

The Engineer will support RAM operations, optimize tool performance, manage lot disposition, train team members, and enhance processes through data analysis.

Lead manufacturing test development and validation for next-generation HBM products. Drive test coverage optimization, yield improvement, DFT strategy, reliability, and test-time reduction. Perform circuit debug and cross-functional execution with Fab, design, and test teams while mentoring others and making technical risk/prioritization decisions to enable scalable, cost-effective production.

Lead shift-level process development and operations for TD manufacturing, ensuring process stability, yield protection, and quality. Coordinate priorities with 1st shift, HVM Ops, and cross-functional teams; troubleshoot complex process and equipment issues using data-driven analysis; manage and develop engineers and technicians; drive continuous improvement, capacity planning, and control of chronic tool/process issues.

Lead development and delivery of wafer/cube probe test solutions for HBM devices across NPI to HVM. Drive probe test plans, ATE program development, silicon debug, data-driven yield improvements, probe hardware validation, cost and test-time optimization, and cross-functional alignment. Mentor engineers and standardize probe practices to ensure production readiness and sustained issue closure.

Develop and debug intrinsic and extrinsic reliability test programs for HBM, DRAM, and interface dies (e.g., wafer-level burn-in, pWLRx, ELFR). Perform root-cause analysis, data-driven validation using statistical tools, hardware interface specification and validation, cross-functional collaboration, mentorship, process improvements, and project prioritization to meet quality, cost, and cycle-time KPIs.

Lead process integration for next-generation 3D NAND: identify module deficiencies, develop and implement process solutions, coordinate R&D-to-manufacturing transfers, drive CSPEC criteria and experiments, and lead cross-functional reviews to improve yield, quality, and manufacturability.

Perform data exploration, statistical analysis, and visualization on FOUP (wafer carrier) transportation datasets to identify factors affecting transport time. Engage stakeholders, develop methodology and optimization recommendations, and present findings.

Lead electrical engineering and construction for semiconductor fab and cleanroom facilities, overseeing HV/MV/LV power distribution, substations, UPS/generator systems, commissioning, energization, and handover. Ensure compliance with Global Facilities Electrical Standards, coordinate across disciplines, manage change approvals, and drive safety, reliability, and readiness for RFE/RFM.

Lead and develop a Procure-to-Pay operations team delivering global P2P support (tail spend, PR/PO processing, supplier onboarding, catalog, receiving, invoice resolution). Own service delivery KPIs, compliance, audit readiness, process documentation, stakeholder escalations, and continuous improvement. Act as P2P SME, drive automation/AI enablement, support system changes and UAT, and partner cross-functionally with Finance, IT, procurement, and suppliers.

Support and optimize site inventory and production scheduling using data analytics. Develop Python/SQL programs, create visual reports, collaborate across engineering teams, and apply AI-assisted tools to improve line inventory performance and scheduling logic.