Top Tech Jobs & Startup Jobs in Singapore

This internship provides hands-on experience in semiconductor packaging processes, focusing on Flip Chip Attach and Underfill technologies, data analysis, and AI-driven optimization.

The Workforce Development Engineer supports technical training in NAND and HBM functions, collaborating with teams to meet training needs and evaluating course effectiveness.

The intern will gain practical experience in semiconductor manufacturing operations, focusing on automated solutions, data analysis, and problem-solving techniques.

Intern will develop an AI-driven tool for root cause analysis, automating diagnosis of issues in semiconductor operations by analyzing incident data and performance patterns.

The intern will learn about NAND device physics and work on validation and failure analysis while collaborating with engineers on various projects.

Lead and develop a high-performing team to drive Package and HBM Product engineering activities. Collaborate across functions to improve quality, cost, and yield for HBM products. Responsibilities include yield improvement, debugging packaging issues, process conversion, and team mentorship.

The Engineer will establish and improve process conditions, upgrade process capability, manage projects, set up equipment parameters, and analyze abnormalities.

As a Fab Process & Equipment Engineer, you'll optimize semiconductor processes, improve yield and quality, analyze data, and troubleshoot issues.

Manage and mentor a team of analysts and engineers to drive analytics solutions in manufacturing operations, focusing on data quality and compliance.

As a High Bandwidth Memory Test Engineer, you will develop, debug, and maintain test code and hardware for advanced memory devices, focusing on test flows and innovations.