Leads Asia-based packaging, assembly, PCBA, and device test operations for NPI and volume production. Collaborates with OSATs, foundries, assembly houses, reliability engineers, and headquarters teams on wafer-level testing, IIIV and CMOS processes, device packaging, module assembly, qualification, and reliability testing. Documents technical results, drives process improvements, supports FMEA and failure analysis, obtains supplier 8D reports, makes project decisions, and expands the regional operations team.

Lead optical device packaging and assembly process development, automation, tooling, testing, yield improvement, and cost reduction. Support mechanical design, thermal modeling, NPI, supplier and contract manufacturer activities, technical documentation, and project management. Use SPC, DOE, and failure analysis to improve process capability. Manage component specifications, audits, technical reports, and cross-functional collaboration while building a global operations process team.