Drive new semiconductor technology introductions and process integration for mixed-signal ICs. Collaborate with foundries, design, marketing, and product engineering teams to develop custom devices and silicon modules, improve performance and power efficiency, and resolve reliability issues. Advise design and layout teams on process knowledge, safe operating areas, design rules, and DFM. The role requires semiconductor technology experience, device physics expertise, analytical problem-solving, and English and Mandarin fluency.

Lead cross-functional package design for mixed-signal products, defining electrical, thermal, and mechanical requirements; perform physical design and simulation; develop DFM and manufacturing validation; drive automation and continuous improvement; create test vehicles; collaborate with customers, designers, and OSATs to resolve die-to-PCB integration issues.