Please Note:
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Job Description:- Provide leadership and insights into root cause of device failures via in-depth failure analysis using intricate tools and state of the art equipment.
- Collaborate with product engineering and R&D team to translate findings into solutions for new design improvements.
- Monitor and use big data analysis on long term wafer reliability performance and propose improvements to product design or manufacturing process changes.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom Singapore, Singapore, SGP Office
Singapore, Singapore
