Jobs at Lumilens

Support strategy, execution, adoption, and lifecycle management for high-speed optical interconnect product lines. Analyze customer and market requirements, competitive intelligence, technical trade-offs, and business metrics for 800G and 1.6T transceiver platforms. Coordinate with engineering, sales, manufacturing, finance, operations, and customer teams to resolve issues, support design wins, execute roadmaps, identify risks, and develop customer proposals and business cases.

Lead development of wafer-level opto-electrical test solutions for NPO/CPO products across NPI to volume production. Design and qualify test hardware and software, manage RFQ and vendor qualification, transfer testers to production, create process documentation and training, and provide ongoing engineering support to maintain yield, throughput, alignment stability, and reliability.

Lead cross-functional programs across silicon, photonics, packaging, bring-up, validation, and system delivery. Create and execute project plans, manage risks and schedules, coordinate vendors and partners, and communicate status to leadership to drive product readiness on aggressive timelines.

Drive end-to-end process development and manufacturing-readiness programs across photonics, advanced packaging, optical module assembly, and external manufacturing partners. Manage schedules from DOE and qualification through pilot builds and high-volume manufacturing release. Coordinate engineering, quality, operations, OSATs, suppliers, and manufacturing teams while ensuring process FMEA, DFM, audits, change control, reliability, and production requirements are met. Lead technical discussions, resolve risks, and make data-driven decisions during development and ramp-up.

Manage supplier quality relationships, define quality requirements, conduct audits, and improve supplier performance through structured reviews and corrective actions.

The Director of FP&A will lead financial planning, operational KPIs, and analysis for Lumilens, collaborating with R&D and business leaders to strengthen financial discipline in a fast-paced environment.

Lead reliability and qualification for photonic components (silicon photonics, lasers, SiPs). Define/execute qualification plans to Telcordia/JEDEC standards, run accelerated life tests, failure analysis, predictive modeling, and supplier qualification. Collaborate across R&D, packaging, manufacturing, and supply chain to enable NPI and production transfers, and produce reliability reports and risk assessments.

The Epoxy Engineer will develop and optimize epoxy formulations, troubleshoot adhesive failures, support manufacturing scale-up, ensure reliability, and provide global technical support.

The Silicon Test Engineer develops test solutions for silicon photonics and semiconductor products, optimizing test processes, collaborating with teams, and ensuring production readiness.

The Director/Sr. Director of Controlling leads corporate controllership across APAC, managing consolidations, statutory reporting, SOX compliance, and audit relations while partnering with finance and operations.

The Component Engineer is responsible for ensuring the quality, performance, and reliability of electronic components, supporting production and testing, coordinating with internal teams and vendors, and preparing technical documentation for products.

Lead development and support of flip chip assembly for silicon photonics, including DOE, material qualification, reliability validation, failure analysis, SPC, and NPI documentation to improve yield and manufacturability.

Develop and optimize optical active alignment processes for photonic transceiver production. Operate, control, qualify, and buy off alignment equipment; develop alignment algorithms; manage epoxy dispensing and curing; design alignment fixtures; troubleshoot production issues; and collaborate with R&D and manufacturing teams to improve yield, quality, documentation, and continuous improvement.

Own optical transceiver manufacturing readiness and product execution from development through high-volume production. Lead NPI, product transfers, contract manufacturer qualification, yield improvement, quality and reliability efforts, BOM accuracy, testing, failure analysis, corrective actions, documentation, and cost reduction. Collaborate with design, process engineering, quality, suppliers, and contract manufacturers to launch and scale 800G and 1.6T products. International travel is required.

Own end-to-end recruitment across technical, manufacturing, operations, and corporate roles in Singapore. Lead high-volume hiring campaigns, partner with contract manufacturers and business leaders, develop sourcing strategies, manage candidate experience and onboarding, monitor recruitment metrics, and advise leadership on workforce planning, talent availability, timelines, and hiring competitiveness. Coordinate across US and APAC time zones and support hiring initiatives at the Bulim Square facility.

Lead and grow a process and manufacturing engineering team for silicon photonics transceivers. Define, prove, and deploy HVM processes, drive continuous improvement, own process documentation and change control, partner with design and contract manufacturers, support qualification testing, champion automation, manage suppliers and capital/equipment selection, and develop staff across global sites.

Lead device and PIC characterization and test execution at bench level, architect high-speed measurements, build and scale lab test infrastructure, automate measurement routines, drive root-cause analysis and yield improvements, transition R&D to production test flows, and mentor junior test engineers while collaborating with design, process, and product teams.

Hands-on engineer executing photonics device and PIC characterization, high-speed measurements, and lab test setup. Develops test automation (LabVIEW/Python), supports wafer probing and optical alignment, troubleshoots instrumentation, analyzes data, and aids transition from R&D to early production test flows.

Lead DFM/DFR for optical transceiver designs across assembly processes (SMT, die attach, wire bonding, flip chip, active alignment, TCB bonding). Assess process capability and risks, engage cross-functionally with design, production, NPI and suppliers, collect and analyze data, and produce reports to drive manufacturing decisions and reliability testing.

Lead development, qualification, and supplier management for FR4/PCB substrates (mSAP/Any-Layer HDI). Drive DFM/DFT/DFR, quality control, failure analysis, reliability testing, and support packaging production (SMT, die attach, wire bond, alignment). Interface across design, manufacturing, and global suppliers.