Teams at Lumilens

Lead development and optimization of wafer backside grinding, laser stealth dicing, and die sorting for silicon photonics. Troubleshoot process issues, improve yield and throughput, ensure compatibility with bumping/flip-chip, and produce SOPs, WIs, failure reports, and support NPI and process verification.

Lead quality standards and QMS for semiconductor assembly/test (OSAT), drive RCA and CAPA, perform SPC and yield analysis, support failure analysis, supplier/customer audits, and continuous improvement to improve yield and reliability.

Lead and maintain quality systems for wafer fabrication: monitor yields, analyze defects, drive continuous improvement, lead root-cause investigations and CAPA, manage customer quality interactions, support qualifications, audits, and compliance to ISO standards.