SR/PRINCIPAL ENGINEER, FE CPIE RAM QUALITY and OPNS ENGINEERING

Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Responsibilities and Tasks:• Establish strategy, models and systems to improve wafer at risk reduction for RAM Defense line hardening.• Establish strategy, model and systems to improve RAM quality control and reduce defect OOC% variation.• Establish strategy, model and systems to improve RAM operation efficiency to achieve labor productivity improvement, Cycle time performance, tool utilization performance for lower cost.• Establish and improve BKM (Best Known Method) related to RAM defense line hardening and operation efficiency.• Ensure BKM sharing spans across all sites regardless of technology and/or site mission differences.• Implement abnormal analysis and improvement.• Lead Copy Smart Team (CST), facilitate taskforce discussion and drive RAM network alignment on strategy business process and roadmap to achieve area objectives and deliver to timelines/commitments.• Support and performs audit and establish metrics that can efficiently audit adoption rate and compliance to business process, BKM and strategy.• Actively provide recommendations to improve and optimize programs and processes to the respective program and/or process owners.• Manage projects with proper Project Management process with metric to track project success.• Track Fab performance metrics for benchmarking purposes. Identify gaps and area of improvements for Fabs.• Provide tactical support and coordination for the Fabs as required for issues of People, Safety, Time to Mature cummulative Yield, Quality, Cost, and Cycle Time.• Communicate clearly and present strategy and updates to network members and leaders.
Requirements:• Master's/Bachelor's in Engineering• Relevant working experiences in RDA and/or Metrology• Willing and capable of international travel, including Extended International Business Travel (EIBT) assignment to 6 months as needed, to accomplish the goals.• Good communication skills, maintain a strong and open relationship with peer group and appropriate team members in other functional areas such as Process Integration Engineering, Quality Systems, Production Operations Management• Promote worldwide sharing and transfer of area-specific domain knowledge• Proficiency, experience and knowledge relating to product and test wafer capacity modeling, wafer at risk modeling, Failure Mode Effect Analysis (FMEA) concept and system, defect analysis tools, sampling strategy and systems, Statistical Process Control (SPC) tools, Cycle Time Management, tableau creation, SQL and Programming language and Organization Change Management have advantage.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
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