Jobs at Micron Technology

The Senior Engineer develops and tests security firmware for SSD products, collaborates with teams, and integrates AI tools to enhance efficiency.

Owns NAND Flash memory test programs from development through production release. Develops wafer and package functional test strategies, improves yield and reliability through test optimization and data analysis, reduces test time, and ensures readiness for new product introduction and high-volume manufacturing. Collaborates with test, production, process, and engineering teams while applying programming, semiconductor, analytical, and AI-assisted problem-solving skills.

The Firmware Engineer will develop high-performance firmware for SSDs, conducting testing, debugging, and collaborating with multi-disciplinary teams.

As an SSD Customer Validation Engineer, you will develop and maintain test automation infrastructure for SSDs, create robust test designs, troubleshoot integration issues, and enhance validation approaches.

Design and implement process solutions to improve next-generation 3D NAND yield and quality. Lead cross-functional teams, define CSPEC, coordinate manufacturing experiments, transfer R&D to production, and support ramp-up and qualification while integrating AI-assisted tools.

The Yield Analysis Engineer will drive yield improvement activities, develop innovative NAND technologies, perform statistical analysis, and collaborate with cross-functional teams.

As a Principal Engineer, you will lead a team in defect detection and process improvement in the semiconductor industry, collaborating with various departments to drive innovation and mentor team members.

Develop and operate cloud-based data platforms and scalable ETL pipelines for NAND reliability engineering. Analyze large semiconductor and manufacturing datasets using Python, SQL, BigQuery, and PySpark. Develop and deploy AI/ML solutions for failure analysis, anomaly detection, reliability assessment, and engineering decision-making. Collaborate with IT, AI, quality, manufacturing, and engineering teams; communicate technical findings; support customer reliability inquiries; and promote AI-enabled productivity improvements.

The role focuses on product reliability, involving test development, execution, problem-solving, risk management, and cross-functional collaboration to drive innovations in high bandwidth memory technology.

Lead the Media Health Manufacturing efforts for Micron's HBM products, focusing on test coverage, product development, yield improvement, and cross-functional collaboration.

Lead complex semiconductor Assembly and Test manufacturing scenario studies, cost models, and financial analyses. Partner with Operations, Engineering, Supply Chain, and Finance leaders to evaluate capacity, competitiveness, network optimization, and technology-transition decisions. Improve analytical processes and standardize methodologies while delivering timely, high-quality recommendations. Use Excel, Power BI, SQL, data analytics, and AI-enabled tools to automate workflows and improve cost-study efficiency.

Leads High Bandwidth Memory product development from introduction through high-volume production. Owns technical program requirements, milestones, reviews, risk mitigation, decision-making, and cross-functional coordination across engineering, quality, supply chain, packaging, test, and manufacturing teams. Represents programs to executives, drives change management, and develops distributed team members through mentorship, coaching, evaluations, and accountability.

Execute and support thin-film ALD/CVD process development for advanced NAND cell-film modules. Run experiments, analyze data, document findings, support equipment qualification and troubleshooting, and assess process impacts on device behavior, yield, and reliability. Collaborate with senior, equipment, and integration engineers while developing expertise in materials, chemistry, vacuum systems, process physics, and semiconductor fabrication.

Develop and optimize dry etch processes for next-generation NAND products, improving capability, cost, variability, and yield. Conduct root-cause and failure-mode analysis, collaborate with process integration and related teams, guide vendor hardware solutions, perform fundamental research, maintain a pilot manufacturing line, and support technology transfer to domestic and international production facilities. Apply statistical process control, data analysis, Python, and AI-enabled tools where appropriate.

Execute and develop ALD/CVD thin-film processes for NAND cell films, run experiments, analyze data, support equipment qualification and troubleshooting, and investigate process impacts on integration, yield, and reliability. The role requires collaboration with engineering teams, accurate documentation, and growth toward independent process development using materials science, chemistry, vacuum systems, and semiconductor metrology knowledge.

Lead advanced NAND photolithography process development, optimization, troubleshooting, and technology transfer. Translate device requirements into process flows and control strategies; own material evaluations, OPC/layout development, process-window analysis, overlay optimization, and advanced process control using SPC, DOE, and simulation tools. Collaborate with global R&D, manufacturing teams, and suppliers while delivering milestones, supporting innovation disclosures, and applying AI-assisted tools responsibly.

Analyze semiconductor manufacturing, inline, parametric, probe, sensor, and fabrication-tool data to identify yield detractors and reduce defects. Build data pipelines, automate analysis, apply statistical modeling and machine learning, support Design of Experiments, and create dashboards and reports using Dash, Plotly, or Angular. Collaborate with manufacturing, process, equipment, and integration engineers to optimize processes and communicate findings.

Conduct electrical failure and qualification data analysis for 3D NAND memory devices. Define and manage NAND qualification plans, perform risk assessments, investigate rejected devices to identify failure mechanisms, and coordinate corrective actions with Research and Development and Product Engineering teams. Assess reliability and customer risk while leveraging AI tools to automate reporting, defect classification, and root cause analysis.

Lead global contamination-control strategy across semiconductor wafer fabs, improving yield, reliability, throughput, and cost. Responsibilities include contamination-risk mitigation, process and equipment optimization, capacity expansion support, wafer-shipment controls, KPI development, supplier collaboration, SOP standardization, and cross-functional project leadership. The role requires driving data-based monitoring, resolving process issues, supporting qualifications, coordinating global teams, and communicating outcomes across manufacturing sites.

Develops and optimizes CMP processes for next-generation 3D NAND memory products. Responsibilities include process-margin improvement, consumables and hardware evaluation, experiment management, manufacturability testing, vendor collaboration, process monitoring and control, technology roadmapping, and leading complex multidisciplinary projects. The role also provides technical guidance, mentorship, management counsel, and innovation through patents and technical publications.