This internship provides hands-on experience in semiconductor packaging processes, focusing on Flip Chip Attach and Underfill technologies, data analysis, and AI-driven optimization.

Intern will develop an AI-driven tool for root cause analysis, automating diagnosis of issues in semiconductor operations by analyzing incident data and performance patterns.

As a Fab Process & Equipment Engineer, you will optimize semiconductor processes, improve productivity, conduct data analysis, and manage projects for process development.

The intern will gain practical experience in semiconductor manufacturing operations, focusing on automated solutions, data analysis, and problem-solving techniques.

The Planning Modeling Engineer at Micron is responsible for managing backend capacity modeling, optimizing product loading, and ensuring data accuracy in manufacturing processes.

Responsible for modeling backend capacity, ensuring accuracy, auditing data, and collaborating with teams on capacity strategies at Micron Technology.

As a PD Engineer, you will develop and optimize Plasma-CVD or Diffusion processes for NAND Flash products, involving design, characterization, and troubleshooting in a R&D environment.

Lead and develop a high-performing team to drive Package and HBM Product engineering activities. Collaborate across functions to improve quality, cost, and yield for HBM products. Responsibilities include yield improvement, debugging packaging issues, process conversion, and team mentorship.

The Process & Equipment Engineer will optimize processes, improve production costs, and analyze data to resolve complex manufacturing issues in the semiconductor industry.

As a Senior Product Engineer, you will lead a team in advanced data analytics to improve yield and quality through machine learning and AI, develop algorithms, and enhance data infrastructure while collaborating with cross-functional teams.

The engineer will improve processes, upgrade capabilities, modify management projects, set parameters for semiconductor equipment, and analyze abnormalities.

The role involves electrical characterization, failure analysis, data analysis, providing technical expertise, and managing laboratory compliance and equipment.

The role involves improving process conditions, upgrading process capability, setting semiconductor equipment parameters, and analyzing abnormalities.

The role involves leading change management initiatives, supporting global alignment of processes, conducting feasibility studies, and guiding projects through their lifecycle, while fostering collaboration and effective communication among stakeholders.

The role involves establishing and improving process conditions, upgrading capabilities, analyzing data, and resolving process issues in semiconductor manufacturing.

Lead photolithography process development for next-gen memory devices, ensuring technology transfer and optimizing processes for yield and performance.

As a Fab Process & Equipment Engineer, you will work on process start-up, optimization, yield improvement, and troubleshooting in semiconductor manufacturing.

Lead a team to enhance product yield and quality through advanced data analytics, machine learning, and AI. Develop algorithms and collaborate cross-functionally to drive improvements and innovation in HBM product engineering.

This internship involves assisting in data collection and analysis for metrology workstation conversion to enhance process efficiency, while learning about metrology techniques.

As a Smart Systems Engineer, you will enhance semiconductor systems through innovative software solutions, improving operational efficiency and product quality.