Teams at Micron Technology

Lead cost improvement programs across HBM, MCP, LPDRAM, and SSD manufacturing. Manage month-end close, budgeting, capex optimization, FCF deliverables, material consumption, and cost-per-part projections. Partner with finance and site teams, deploy dashboards and AI-assisted tools, and promote Lean best practices to improve cost competitiveness.

Leads next-generation NAND dry etch process and critical module development, including process innovation, equipment roadmaps, scalability, yield improvement, and cross-functional problem solving. Owns technology roadmaps, collaborates with process and hardware teams, presents updates to management, mentors engineers, leads supplier evaluations, and applies statistical analysis, Python, and AI-enabled tools. Requires advanced semiconductor process expertise, plasma fundamentals, high-aspect-ratio etching experience, technical leadership, and substantial R&D experience transferring processes to manufacturing.

Investigate semiconductor yield and technology issues through electrical and physical failure analysis. Use EMMI, OBIRCH, thermal analysis, SEM, FIB, TEM, nanoprobing, and related methods to isolate failures, determine root causes, and improve memory product yield. Collaborate with engineering and R&D teams on process and design improvements, technology introduction, product qualification, yield ramp, and high-volume manufacturing. Develop analytical methodologies and support continuous improvement initiatives.