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Lumilens

Senior/Staff Quality Assurance Engineer or Manager (OSAT)

Posted 2 Days Ago
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In-Office
Singapore, SGP
Senior level
In-Office
Singapore, SGP
Senior level
Lead quality standards and QMS for semiconductor assembly/test (OSAT), drive RCA and CAPA, perform SPC and yield analysis, support failure analysis, supplier/customer audits, and continuous improvement to improve yield and reliability.
The summary above was generated by AI

Responsibilities:

Quality Management

  • Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes.

  • Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions.

  • Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001).

Problem Solving & Failure Analysis

  • Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools.

  • Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints.

  • Support failure analysis activities and coordinate with engineering teams for resolution.

Process Control & Improvement

  • Monitor process capability using SPC methodologies.

  • Analyse yield, defect trends, and reliability data.

  • Lead continuous improvement projects to reduce defects and improve yield performance.

Supplier & Customer Quality

  • Support supplier audits and qualification activities.

  • Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT.

  • Manage the change control request review and approval, related to materials, processes, and equipment.

Audits & Compliance

  • Conduct internal and external quality audits.

  • Support customer audits and certification activities.

  • Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.

 

Required Qualifications

  • Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.

  • 5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs.

  • Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage.

Technical Skills

  • Statistical Process Control (SPC)

  • Failure Analysis (FA)

  • FMEA / PFMEA

  • CAPA

  • 8D Problem Solving

  • DOE (Design of Experiments)

  • Yield Analysis & Defect Reduction

  • Reliability Engineering

  • QMS - ISO 9001, IATF 16949

  • Minitab, JMP, Excel, SQL (preferred)

 

Preferred Skills

  • Strong analytical and troubleshooting skills.

  • Excellent communication and presentation abilities.

  • Experience working with OSAT subcontractors and cross-functional teams.

  • Ability to manage multiple projects and drive quality improvements independently.

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