SUMMARY
We are seeking a highly skilled and detail-oriented Process Engineer to develop, optimize, and maintain surface mount assembly processes for printed circuit board assemblies (PCBA). The ideal candidate will ensure high-yield, low-defect production by improving process capability, equipment utilization, and quality assurance.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.
Develop and maintain SMT assembly processes (screen printing, pick-and-place, reflow soldering, Wave, SPI).
Analyze and improve process capability (Cp, Cpk), first pass yield (FPY), and overall equipment effectiveness (OEE).
Define, monitor, and optimize reflow oven thermal profiles for lead and lead-free soldering.
Drive root cause analysis and corrective actions for process defects (e.g., tombstoning, solder bridging, head-in-pillow).
Support New Product Introductions (NPI) by establishing process flows, documentation, and line setup.
Perform DFM/DFT reviews with design and test engineering teams.
Create and update standard operating procedures (SOPs), work instructions, and training materials.
Lead process validation, DOE (Design of Experiments), and statistical process control (SPC).
Work closely with cross-functional teams including quality, production, R&D, and equipment engineering.
Ensure compliance with IPC-A-610, J-STD-001, ESD, and other industry standards.
MINIMUM REQUIREMENTS
Bachelor's degree in Electronics, Mechanical, Mechatronics, or Industrial Engineering (or related field). 4–6+ years’ experience in SMT or PCBA manufacturing environment. Strong knowledge of SMT machines. Well verse on ISO 134854- Medical requirements. (Will be advantage)
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