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Applied Materials

College Intern

Posted 12 Hours Ago
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In-Office
Singapore, SGP
Internship
In-Office
Singapore, SGP
Internship
Supports chemists and engineers with experiments involving deposition, surface characterization, and hybrid bonding materials. Collects and analyzes experimental data, compiles findings, and prepares technical reports and presentation documentation while following safety guidelines. Gains hands-on laboratory experience and collaborates with internal and external partners on semiconductor materials research.
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Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. 


What We Offer


Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. 

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits

With the rapid advancement of high-performance computing and artificial intelligence, there is an increasing demand for semiconductor packaging technologies that enable higher interconnect density, improved electrical performance, and lower power consumption. Hybrid bonding has emerged as a key enabling technology, offering direct copper-to-copper and dielectric-to-dielectric connections that deliver superior performance compared to conventional solder bump interconnects. The quality of the dielectric interface plays a critical role in hybrid bonding, where dielectric material properties, deposition processes, and surface activation treatments directly influence bonding strength, bonding yield, and process reliability.

Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future.

As an intern, the candidate will get the opportunity to work alongside with experienced chemists, engineers, collaborators and gain hands-on experience. His/Her key responsibilities include assisting chemists on design of experiment (e.g. deposition and surface characterizations), collect data, analyze, and compile reports on a variety of experiments, within safety guidelines. He/She is able to generate internal and external documentation for presentations and technical reports.

Desired Skills Required:

  • Basic knowledge/experience on chemistry, material science or chemical Engineering
  • Hands-on experience with laboratory experiments is preferred
  • Basic knowledge of surface science, thin films, materials characterization, or semiconductor processing is a plus.
  • Good analytical & problem-solving skills and ability to work independently or in a team, positive attitude and willing to learn.
  • Understanding of semiconductor device and process with relevant courses is advantageous.

Additional Information

Time Type:

Full time

Employee Type:

Intern / Student

Travel:

No

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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