Jobs at Applied Materials

Internship opportunity with Applied Materials in Singapore. The role offers exposure to a global semiconductor equipment and materials science company, with opportunities to learn, develop, and contribute in a supportive work environment. This is a full-time intern/student position requiring approximately 10% travel. Relocation is not provided.

Designs, troubleshoots, tests, and modifies PECVD chamber hardware and mechanical systems. Provides root-cause analysis, corrective actions, tooling, fixturing, assembly, installation, procurement, qualification, and chamber maintenance support. Conducts experiments, replicates customer issues, supports configuration conversions and safety reviews, and documents engineering evaluations and qualification results while collaborating with global engineering, operations, and facilities teams.

Develops and maintains manufacturing processes, operating sequences, and methods for parts, assemblies, and finished products. Coordinates product improvements, reduces costs, improves quality, establishes time standards, and recommends tooling. Develops test procedures, evaluates work methods, performs process FMEA, identifies root causes, and implements corrective actions. The role applies lean principles, automation, and continuous improvement in a cleanroom manufacturing environment.

Prepare project plans, coordinate deliverables, monitor cost performance, drive team collaboration, and implement process improvements.

Supports project and program planning, execution, documentation, resource and cost tracking, milestone completion, data collection, and compliance with company policies. The role may involve studying new technologies and working in semiconductor cleanroom environments. Physical duties can include standing, walking, bending, lifting, working in tight spaces, using hand and power tools, and wearing required personal protective equipment.

Supports engineers in developing PVD processes for TSV applications. Performs process optimization, metal film property measurements, data analysis, reporting, hardware characterization, troubleshooting, root cause analysis, and resolution of moderately complex process engineering issues while following safety guidelines.

Coordinates technical projects from planning through implementation, including schedules, budgets, resources, reports, quality metrics, and customer communications. Supports process improvements, supplier coordination, executive reporting, and cross-functional problem solving using 8D methodology. Requires Applied Materials customer engineering experience, familiarity with Applied products, customer-facing skills, and proficiency with SAP, Copilot, and Teamcenter. International travel to customer sites may reach 25%.

Designs, analyzes, troubleshoots, and documents mechanical systems, tooling, fixtures, layouts, and specifications for semiconductor equipment. Performs FEA, thermal, flow, and tolerance analyses; leads engineering tests and projects; develops suppliers; coordinates component procurement, manufacturing, assembly, and installation; and resolves complex mechanical issues throughout the product life cycle.

Designs and optimizes semiconductor and display manufacturing processes through experiments, data analysis, hardware characterization, film measurement, troubleshooting, and root cause analysis. The role produces technical documentation, supports customers, collaborates with vendors and suppliers, and implements new technologies and instrumentation for semiconductor packaging research and development.

Designs, modifies, tests, and troubleshoots electrical and electronic assemblies, schematics, layouts, and equipment for semiconductor manufacturing systems. Responsibilities include engineering analysis, test report generation, product release documentation, component procurement and assembly coordination, resolving technical issues, and developing electrical solutions and specifications.

Designs, integrates, tests, and optimizes complex semiconductor equipment subsystems. Responsibilities include defining architectures and specifications, evaluating prototypes and suppliers, troubleshooting engineering issues, supporting system integration, coordinating reliability testing, mitigating risks, and collaborating across electrical, mechanical, physics, software, and algorithm disciplines. The role also provides onsite and remote support to field personnel and manages system engineering projects from requirements through final testing.

Performs financial and nonfinancial analysis, complex modeling, forecasting, close and performance-management activities. Presents findings to executives and stakeholders, partners with business leaders, and supports system integration and process-improvement initiatives.

Supports global semiconductor equipment products by integrating corrective actions and lessons learned into designs, developing service procedures and best-known methods, participating in design reviews, addressing field issues, and leading CAPA and failure analysis activities. The role coordinates beta-site testing, technical training, engineering issue resolution, and spare-parts stocking. It requires technical leadership, complex problem-solving, cross-functional collaboration, and approximately 25% travel.

Leads the Singapore Systems Engineering team supporting semiconductor equipment development and sustaining engineering. Responsibilities include system architecture, electrical design, controls integration, equipment qualification, cross-functional product development programs, commercialization, compliance, continuous improvement, budgeting, and team development. The role partners with global R&D, Product Management, Manufacturing, and Field organizations while building regional technical capabilities for advanced packaging technologies.

Performs financial and operational analysis, complex modeling, close, flash, and commit activities. Develops strategic planning and business performance analyses, presents findings to finance and non-finance stakeholders, and partners with business leaders. Leads or supports system integration and process improvement initiatives while solving complex problems and building consensus across teams.

Lead advanced semiconductor packaging thermal-mechanical FEA projects, developing and validating high-fidelity models for reliability, stress, warpage, fatigue, creep, delamination, and process effects. Translate cross-functional engineering questions into simulation plans, perform sensitivity and optimization studies, correlate models with testing and metrology, and deliver design recommendations. The role also includes owning workflows, mentoring engineers, establishing modeling standards, supporting technology roadmaps, and evaluating emerging packaging materials, processes, and architectures.

Owns the development, validation, deployment, and lifecycle management of system-representative test solutions. Identifies test gaps using field failures, FMEA/FMECA, nonconformances, and test data; translates failure mechanisms into requirements; leads test-system sourcing, implementation, correlation, calibration, and production deployment. Partners with suppliers, factories, design, manufacturing, and quality teams while establishing scalable test standards and improving detection effectiveness.

Manage the full lifecycle of high-value semiconductor equipment orders, including forecasts, quotations, sales orders, documentation, shipment readiness, billing support, revenue recognition, and audit compliance. Coordinate with Sales, Finance, Manufacturing, Logistics, Legal, customers, and global sites to resolve issues, mitigate risks, ensure on-time delivery, and improve processes.

Leads semiconductor process transfer from R&D to pilot and high-volume manufacturing. Reviews and trains teams on existing processes, creates transfer checklists, coordinates R&D, production, operations, integration, and hardware teams, and tracks milestones, deliverables, schedules, and risks. Supports training, tool and process qualification, factory-side execution, troubleshooting, and technology ramp activities across Singapore, Southeast Asia, and the United States.

Designs, modifies, analyzes, tests, and troubleshoots electrical and electronic assemblies, schematics, layouts, and equipment. Develops AC power distribution expertise, creates CAD drawings and product documentation, coordinates component procurement and assembly, resolves technical issues, and supports product specifications and manufacturing improvements.